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Abstract:
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The addition of Deep Reactive Ion Etching (DRIE) in the fabrication of micro-electro-mechanical-systems(MEMS) has enabled the creation of many new structures that were not previously feasible. By combining this technique with silicon wafer bonding Silicon-On-Insulator (SOI) technology and other silicon fabrication processes, a new large scale 3D structure has been created to support a large area single crystal Silicon membrane of 2-5 um thick. The structure consists of a series of very high aspect ratio silicon ridges created using the DRIE process that are bonded using this silicon fusion bonding technique on both sides of the silicon membrane. This structure allows the membrane to withstand the stresses placed on it during vacuum testing by reducing the pressure of one side of the membrane to near vacuum. |
