Development of Multi Chip Modules for Extreme Environments

Abstract

Multi chip module technology offers numerous advantages such as reduced signal delays, higher performance, lower power consumption, smaller space, its simplification. In this paper, the fabrication process of multi chip module for extreme environments will be presented including 2 IC interconnection techniques, flip chip and wire bond. The chips has been subjected to extreme thermal cycles for a reliability test. Resistance measurements were also performed at room temperature after thermal shock cycles. Finally, conclusions are made from the results.