Selective and Non-selective Synthesis of Carbon Nanotubes (CNTs) by Chemical Vapor Deposition (CVD) Characterization: Catalysts and Underlayers E ects on Field Emission Properties by Chung-Nan Tsai A thesis submitted to the Graduate Faculty of Auburn University in partial ful llment of the requirements for the Degree of Master of Science Auburn, Alabama Dec 08, 2012 Keywords: Carbon Nanotube, Chemical Vapor Deposition, Field Emission Copyright 2012 by Chung-Nan Tsai Approved by Hulya Kirkici, Chair, Professor of Electrical and Computer Engineering Guofu Niu, Professor of Electrical and Computer Engineering Michael Baginski, Associate Professor of Electrical and Computer Engineering Abstract Since the discovery of carbon nanotubes (CNTs), they have been attracted much at- tention with abundant potential applications based on their outstanding properties. CNTs are well-known for their superior mechanical strength and low weight, excellent heat con- ductance, and varying electronic properties depending on their helicity and diameter. In particular, the recent research studies have reported that CNTs have excellent electrical eld emission properties, with high emission currents at low electric eld strength due to the high aspect ratio (small diameter and relatively long length). As a result, CNTs are consid- ered as one of the promising materials as cold-cathode eld emission sources, especially for application requiring high-current densities and lightweight packaging. In this research work, the selective and non-selective multi-wall CNTs (MWCNTs) are grown by using chemical vapor deposition (CVD) technique. Then, their eld emission properties are examined in a high pressure vacuum chamber of around 10 7 to 10 6 Torr. MWCNTs are grown onto various underlying layers such as SiO2,Ti ,and W-coated silicon substrates. Thermal CVD furnace containing gas mixtures of acetylene and argon is used to grow CNTs. The growth conditions such as catalyst types and thickness, gas ow rate and deposition temperature are discussed. E ects of di erent catalysts with various underlayers on the eld emission properties of CNTs are studied and results are presented. The mea- surement results indicate that CNTs have signi cant eld emission capabilities to be used as cold cathode materials. ii Acknowledgments First of all, with a deep sense of gratitude, I wish to thank my thesis advisor, Prof. Hulya Kirkici, for her guidance throught my research work, for her encougement of my professional development, and for her advise on organizing and writing this thesis. I am also very grateful to Prof. Guofu Niu and Prof. Michael Baginski for their time to review my thesis. During the period of my M.S. study in Auburn, I would like to thank Dr. Yu-Chun (Brad) Chen who spent enormous time with me to discuss my research in details and was willing to share his life experiences. I also thank all my friends for their friendship, help and support, who are Dr. Haitao Zhao, Ms. Huirong Li, Mr. Zhenhong Li, Mr. Ming Zhang and Mr. George Hernandez. Most of all, I thank my parents, Hsueh-Jung Tsai and I-Min Liao, for their love, encour- agement, dedication, and support. I also thank my girlfriend, Yueh-Chuan Liu, who always believe in me, encourage me to try out my own life, and give me all her support whenever I need it. I would like dedicate this thesis to my family. iii Table of Contents Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vi List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 LITERATURE REVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Material properties of carbon nanotubes . . . . . . . . . . . . . . . . . . . . 5 2.1.1 Structure of carbon nanotubes . . . . . . . . . . . . . . . . . . . . . . 5 2.1.2 Electrical properties . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.3 Mechanical properties . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.4 Other properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 Synthesis techniques of carbon nanotubes . . . . . . . . . . . . . . . . . . . . 11 2.2.1 Arc discharge and laser ablation . . . . . . . . . . . . . . . . . . . . 11 2.2.2 Chemical vapor deposition . . . . . . . . . . . . . . . . . . . . . . . . 14 2.3 Growth mechanisms of CNTs . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.4 Field emission of electrons from CNTs . . . . . . . . . . . . . . . . . . . . . 18 2.5 Potential applications of CNTs . . . . . . . . . . . . . . . . . . . . . . . . . 21 3 Carbon Nanotubes: FABRICATION AND CHARACTERIZATION . . . . . . . 25 3.0.1 Growth process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.0.2 Selective grown CNTs synthesis processes . . . . . . . . . . . . . . . 28 3.1 Electron eld emission measurements and experimental setup . . . . . . . . . 30 4 RESULTS AND DISCUSSION . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.1 In uence of catalyst layer thickness . . . . . . . . . . . . . . . . . . . . . . . 32 iv 4.2 In uence of underlying layer . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.3 In uence of the deposition temperature . . . . . . . . . . . . . . . . . . . . . 33 4.4 Fowler-Nordheim curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.5 Scanning electron microscope image . . . . . . . . . . . . . . . . . . . . . . . 35 4.5.1 SEM images of CNTs with di erent catalysts sputtering time and un- derlayers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5 SUMMARY AND FUTURE DIRECTIONS . . . . . . . . . . . . . . . . . . . . 70 v List of Figures 1.1 Schematic of an individual layer of honeycomb-like carbon called graphene, rolling into CNT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Atomic structures of carbon nanotubes . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Base and tip growth of CNTs rooted in a nanoporous (e.g. zeolite) substrate . . 4 2.1 sp2 hybridization of carbon and its derived materials. (a) The three sp2 hy- bridized orbital are in-plane, with 2p orbital orthogonal to the plane, and ? denotes the bonding and anti bonding orbital. (b) Graphene as the source of three di erent materials, fullerence (left), carbon nanotube (center) and bulk graphite (right) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Chiral structure of carbon nanotube . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 A two-dimensional honeycomb lattice of graphene sheet. The vectors OA and OB de ne the chiral vector Ch. Unitary vector a1 and a2 are to determine the rolling direction expressed by vector Ch. There are several ways to roll it up As a result, di erent types of tubules can be formed . . . . . . . . . . . . . . . . . 8 2.4 Schematic diagram of the arc apparatus where the nanotubes are formed from the plasma between the two carbon rods . . . . . . . . . . . . . . . . . . . . . . 12 2.5 Schematic diagram of a laser ablation set-up . . . . . . . . . . . . . . . . . . . . 13 2.6 Schematic diagram for thermal CVD reactor . . . . . . . . . . . . . . . . . . . . 16 vi 2.7 (a) tip-growth model (b) base-growth model . . . . . . . . . . . . . . . . . . . . 18 2.8 Typical set-up for eld emission: a potential di erence is applied between a nanotube and a counter electrode . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.9 TEM image of an individual SWNT tip produced by controlling carefully the catalyst density. The scale bar equals 10 nm . . . . . . . . . . . . . . . . . . . . 23 2.10 Schematic process for the fabrication of a CNTFET with a suspended graphene gate without any Si3N4 protective layer: The CNTFET can be gated either by the suspended graphene gate or by the Si substrate acting as a back gate . . . . 24 3.1 Schematic diagram for thermal CVD reactor . . . . . . . . . . . . . . . . . . . . 27 3.2 Schematic diagram of CNTs fabrication processing (a) silicon wafer cleaned and prepared, (b) mask is aligned to remove parts of the photoresist for patterned deposition of the iron catalyst. (c) the spattering process is conducted. (d) photoresist is removed from the wafer exposing only the sections with catalyst Fe. The sample is now ready to be moved to the CVD chamber for CNT growth process. (e) the CNTs are selectively grown on the substrate. . . . . . . . . . . 29 3.3 Schematic diagram for the eld emission measurement setup . . . . . . . . . . . 31 4.1 1min Fe sputtering time on SiO2 underlayer . . . . . . . . . . . . . . . . . . . . 36 4.2 5min Fe sputtering time on SiO2 underlayer . . . . . . . . . . . . . . . . . . . . 36 4.3 5min Fe with Carbon 8 min sputtering time on SiO2 underlayer . . . . . . . . . 37 4.4 5min Fe sputtering time on SiO2 underlayer . . . . . . . . . . . . . . . . . . . . 37 4.5 15 sec Cobalt sputtering time on SiO2 underlayer . . . . . . . . . . . . . . . . . 38 vii 4.6 30 sec Cobalt sputtering time on SiO2 underlayer . . . . . . . . . . . . . . . . . 38 4.7 Cobalt sputtering time above 1min on SiO2 underlayer . . . . . . . . . . . . . . 39 4.8 SEM image of vertically-aligned multi-wall carbon nanotubes (VA-MWCNTs). . 40 4.9 Cross-sectional SEM image of randomly-oriented MWCNTs. . . . . . . . . . . . 41 4.10 SEM image of patterned CNTs array (a) 25 m circle array with 25 m spacing, (b) 25 m diameter circle array with 50 m spacing, (c) 50 m 50 m square array with 25 m spacing, (d) a close-up image of a single CNT bundle (from a circle array sample) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 4.11 Field emission curve for growing CNTs on SiO2 using Fe as catalyst w/o pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 4.12 Fowler-Nordeim curve of CNT grown on SiO2 using Fe as catalyst w/o pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 4.13 Field emission curve for growing CNTs on SiO2 using Fe as catalyst with pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.14 Fowler-Nordeim curve of CNT grown on SiO2 using Fe as catalyst with pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.15 Field emission curve for growing CNTs on SiO2 using Co as catalyst w/o pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 4.16 Fowler-Nordeim curve of CNT grown on SiO2 using Co as catalyst w/o pre- treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 4.17 Field emission curve for growing CNTs on plain silicon using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 viii 4.18 Fowler-Nordeim curve of CNT grown on plain silicon using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 4.19 Field emission curve for growing CNTs on plain silicon using Fe as catalyst with pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 4.20 Fowler-Nordeim curve of CNT grown on plain silicon using Fe as catalyst with pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 4.21 Field emission curve for growing CNTs on Ti underlying layer using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 4.22 Fowler-Nordeim curve of CNT grown on plain silicon using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 4.23 Field emission curve for growing CNTs on Ti underlying layer using Fe as catalyst with pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 4.24 Fowler-Nordeim curve of CNT grown on Ti underlying layer using Fe as catalyst with pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 4.25 Field emission curve for growing selective CNTs on plain silicon using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 4.26 Fowler-Nordeim curve of selective CNT grown on plain silicon using Fe as catalyst w/o pre-treatment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 ix List of Tables 4.1 Various Structural Properties of Catalyst-Underlying-Layer Combinations . . . 32 4.2 Iron catalyst vs. sputtering time . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.3 Cobalt catalyst vs. sputtering time . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.4 Various Structural Properties of Catalyst-Underlying-Layer Combinations . . . 43 4.5 Various Structural Properties of Catalyst-Underlying-Layer Combinations . . . 44 4.6 MWNTs growth on the catalyst-coated(Fe) substrate w/ SiO2 underlayer . . . . 45 4.7 MWNTs growth on the catalyst-coated(Co) substrate w/ SiO2 underlayer . . . 50 4.8 MWNTs growth on the catalyst-coated(Fe) substrate w/o SiO2 underlayer . . . 53 4.9 MWNTs growth on the catalyst-coated(Co) substrate w/o SiO2 underlayer . . 58 4.10 MWNTs growth on the catalyst(Fe)-underlying Ti layer-coated substrate . . . . 59 4.11 MWNTs growth on the catalyst(Co)-underlying Ti layer-coated substrate . . . . 64 4.12 MWNTs growth on the catalyst(Fe)-underlying W layer-coated substrate . . . . 65 4.13 MWNTs growth on the catalyst(Co)-underlying W layer-coated substrate . . . 66 4.14 Selective growth of MWNTs on the catalyst(Fe)-coated substrate w/o SiO2 . . 67 x Chapter 1 INTRODUCTION Since the rst amazing discovery of carbon nanotubes (CNTs) by Japanese physicist Iijima in 1991 using arc discharge method [1], they have attracted considerable interest because of their extraordinary properties. CNTs are known for their superior mechanical strength, low weight, good heat conductance, and varying electronic properties depending on their helicity and diameter. In particular, the recent research studies [2{4] have reported that CNTs have excellent electrical eld emission properties, with high emission currents at low electric eld strength. The turn-on voltage of CNTs can be as low as 1-3 V/ m and emission current can be as high as 0.1mA from a single nanotube [5]. As a result, CNT are considered as one of the promising materials as cold-cathode eld emission sources, especially for application requiring high-current densities and lightweight packaging. CNTs are essentially tubes with the diameter of nanometer and made of carbon. One could think of it as a graphene sheet rolled upinto tubes. The structure of a graphene sheet is shown in Figure 1.1 [6], which is a planar sheet of carbon atoms that are densely packed in a honeycomb crystal lattice. CNTs are distinguished by their numbers of concentric layers (\wall"), with spacing 0:34nm, and their chirality (wrapping angle). They are typically categorized as single-wall CNTs (SWCNTs), double-wall CNTs (DWCNTs), and multi-wall CNTs (MWCNTs) with respect to the numbers of graphitic layer, as shown in Figure 1.2 [7]. The typical diameter of SWCNTs are 0.4 to 5nm, and MWCNTs can be up to 100nm. The number of sidewalls of CNTs can can be precisouly controlled by the preparation of catalyst that serves as the CNT growth sites that is deposited onto the substrate prior to the growth. There are two general growth mechanisms that have been proposed [8]. When the catalyst particles remain anchored to the substrate, this is known as \base-growth" model 1 Figure 1.1: Schematic of an individual layer of honeycomb-like carbon called graphene, rolling into CNT [6] (Figure 1.3 [8]). On the other hand, the growth follows a \tip-growth" model when the metal catalyst particles lift o from the substrate and remain at the top of the CNTs during growth. In both cases, carbon is added at the catalyst site for CNTs to grow. Currently, there are several synthesis techniques proposed for growing CNTs. These can be divided into methods where CNTs grow from transition metal catalyst particles, and method where CNTs grow without catalyst particles. They include carbon arc discharge [9], laser ablation [10], and chemical vapor deposition [11]. Numbers of potential applications of CNTs have been widely proposed. Among these, CNTs have been reported to be a promosing materials for cold-cathode applications [12]. Because of their high aspect ratio, electrons can be emitted easily from the tips of CNTs in a vacuum ambient under a relatively low applied electric eld. Also, the high current density of CNTs is the other important property making them attractive [13]. 2 Figure 1.2: Atomic structures of carbon nanotubes [7] The purpose of this study is to investigating the growth condition of CNTs on di er- ent underlaying layers and catalyst types and characterize their eld emission properties. From the experimental results, It is found that underlaying layers play an criticle role for CNTs growth. SiO2, Titanium and Tungsten are used. Each of them has substantially di erent performances as a substrate for CNTs growth. In addition to investigation of un- derlayers, the transitation metals, Iron and Cobalt, are utilized as catalysts for depositing CNTs. Randomly-oriented and vertically-aligned CNTs can be grown by controlling the ex- perimental parameters such as catalyst type, catalyst thickness, and deposition temperature. Moreover, di erent sizes of patterned CNTs are also successfully grown by utilizing basic photolithography steps. 3 Figure 1.3: Base and tip growth of CNTs rooted in a nanoporous (e.g. zeolite) substrate [8] 4 Chapter 2 LITERATURE REVIEW 2.1 Material properties of carbon nanotubes 2.1.1 Structure of carbon nanotubes Carbon, the group IV element, is very active in producing many molecular compounds and crystalling solids. A carbon atom has six electrons which occupy 1s2, 2s2, and 2p2 atomic orbital and can hybridize in sp, sp2 or sp3 forms. It has been used for centries, but yet it has been stimulated in the nanotechnology eld by the discovery of these unique nanometer sizes of sp2 carbon-bonded materials such as fullerene, carbon nanotube and graphite, as shown in Figure 2.1 [14]. Figure 2.1: sp2 hybridization of carbon and its derived materials. (a) The three sp2 hy- bridized orbital are in-plane, with 2p orbital orthogonal to the plane, and ? denotes the bonding and anti bonding orbital. (b) Graphene as the source of three di erent materials, fullerence (left), carbon nanotube (center) and bulk graphite (right) [14] 5 Carbon nanotube (CNT), a new form of pure carbon, can be thought as a hexagonal graphene sheet rolled up to form a cylinder that is capped by pentagonal carbon rign. Depending on the manner in which the graphene sheet is rolled up, the arrangement of carbon atoms along the cylinder circumference can be \arm-chair", \zig-zag", or several di erent intermediate chiral structure (Figure 2.2) [15]. Figure 2.2: Chiral structure of carbon nanotube [15] CNTs are distinguished by their numbers of concentric layers called the "walls", with spacing of sub-nm, and their chirality. There are several types of CNTs: Single-Wall CNTs (SWCNTs), Double-Wall CNTs (DWCNTs), and Multi-Wall CNTs (MWCNTs) with respect to the number of graphitic layers (Figure 1.2). Unlike graphene, CNTs exhibit di erent phys- ical properties depending upon their structure. The crystal structure of a nanotube depends upon the axis along which the cylinder is formed from the graphene sheet. Figure 2.3 [16] shows the vectors on graphene plane that are important in understanding the formation of 6 a nanotube . Here, we will follow the established notations, which can be found in litera- ture [17]. The electrical character of a nanotube is speci ed by two numbers that determine the chirality of the nanotube. The vector OB perpendicular to the nanotube axis is called chiral vector !Ch. The vector OA, which is parallel to the axis is termed as the translational vector T, this is the unit vector of 1-D nanotube. The chiral vector is !Ch = n !a1 + m !a2 and the chiral numbers n and m are integers (the chirality convention requires 0 jmj n). The length of the unit vectors is a and the angle they enclose is 60 . As a result, the diameter of the nanotube can be expressed as: d = !C h = apm2 +mn+n2 and the chiral angle from the gure with the expression: cos = !C h !a1 j !Chjj !a1 j = 2n+m 2pn2 +m2 +nm Due to the hexagonal symmetry of the lattice, the chiral angle can only take on values between 0 and 30 . The electron wavevector along the circumference of the CNT is quantized while the graphene sheet is rolled. It is shown that this condition leads to a metallic nanotube, zero band gap, when the di erence n-m is a multiple of 3 [17]. 7 Figure 2.3: A two-dimensional honeycomb lattice of graphene sheet. The vectors OA and OB de ne the chiral vector Ch. Unitary vector a1 and a2 are to determine the rolling direction expressed by vector Ch. There are several ways to roll it up As a result, di erent types of tubules can be formed [16]. 8 2.1.2 Electrical properties CNTs can be either metallic or semiconducting depending on the con guration and molecular structure [18]. For example, SWCNT is metallic if the structure is armchair. On the other hand, zigzag tube as well as chiral-type tube (m,n) with 2m+n=3N (N: positive integer), is a narrow-gap semiconductive [19]. In contrast, the band structures of MWCNTs are more sophisticated because of the interlayer coupling. However, theoretical discussion by Saito et al. emphasized that the interlayer has little e ect on the electronic properties of individual tubes [20]. As a result, two coaxial armchair nanotubes yield a DWCNT. Coaxial metallic-semiconducting and semiconducting-metallic tube will retain their respective char- acters when interlayer interaction is introduced [19]. Several techniques have been utilized in determining the properties of CNTs, such as raman spectroscopy [21], electron energy loss spectroscopy (EELS) [22], electron spin reso- nance (ESR) [23], scanning tunneling microscopy (STM) [24], four-point probe, and atomic force microscopy (AFM). Many groups worked on characterizing the conductivity of CNTs. Ebbesen et al [25] measured the resistivities of MWCNTs using four-point probe technique and determined the resistivties of nanotubes ranged between 8m -m and 0.051 -m. The results show that the electrical resistivity of CNTs can vary greatly according to their porposed structure. The resistivity of SWCNTs have also been measured by means of four-probe arrangement by Smalley et al. [26], and ranged from 0.34 -m to 1.0 -m. The range of resistivities for SWCNTs is smaller than MWCNTs because it is not very conductive between the multi- layers of MWCNTs. 2.1.3 Mechanical properties CNT are among the strongest materials in nature, especially in the axial direction. Because of their high strength-to-weight (STW) ratio, CNTs have been concluded as one of the sti est materials. Also, traditional carbon nano bers have the the STW ratio of 40 times 9 greater than steel, however, CNTs have STW ratio at least 2 orders of magnitude greater than steel [19]. According to Lourie et. al [27], SWCNTs have Young?s modulus of 2.8 - 3.6 TPa, and MWCNTs for 1.7 - 2.4 TPa. In addition, direct tensile loading tests of SWCNTs and MWCNTs have been reported by Yu et al [28] . The Yong?s modulus can be obtained ranging from 320 to 1470 GPa for SWCNTs and from 270 to 950 GPa for MWCNTs [17]. Theoretical studies have suggested that SWCNTs have Young?s modulus as high as 1 - 5 TPa [29]. For MWCNTs, the strength would be a ected by the sliding of individual graphene cylinders with respect to each other. Treacy et al. [30] were the rst to report tting Young?s modulus of MWCNTs to experimental data. For a total of 11 MWCNTs? Young?s modulus values were reported as ranging from 0.4 to 4.15 TPa with a mean of 1.8 TPa. A similar experimental research on SWCNTs was reported by Krishnan et al [31], who presented an average Young?s modulus of 1.3 TPa from measured amplitudes of 27 SWNTs. 2.1.4 Other properties In addition to the electrical and mechanical properties, there are other outstanding properteis that make CNTs attractive such as optical properties, high thermal conductivity ,and high resistance to chemical attacks. As a result, CNTs can be applied on a variety of technological applications. For example, the researchers shows that the low-density vertcially aligned CNTs arrays can be engineered to have an extremely low index of refraction and combined with the nanoscale surface roughness of the arrays , can produce a near-perfect optical absoprtion materials [32]. Moreover, CNTs have been demonstrated that can be the fabricated as the darkest materials. [33]. As a result, CNTs will be the excellent candidate as the next-generation solar cell materials. 10 2.2 Synthesis techniques of carbon nanotubes Currently, CNTs can be synthesized by using a variety of techniques such as arc- discharge, laser ablation, chemical vapor depsotion, plasma-enhanced CVD, and so on. In this section, the methods to produce MWCNTs and SWCNTs are summarized. 2.2.1 Arc discharge and laser ablation Arc discharge and laser ablation methods for growing CNTs have been widely pursued in the past years. Both synthesis techniques are based on condensing carbon atoms from evaporation of solid carbon sources onto substrate. Temperatures in both methods are close to the melting temperature of graphite, 3000 4000 C. In arc-discharge method, carbon atoms are evaporated by plasma of helium gas ignited by high currents passed through opposing carbon anode and cathode. The arc-discharge technique has been developed into an excellent method for producing both high quality MWCNTs and SWCNTs. In 1992, the DC-arc technique was rst done by Ebbesen et al. [34] and become a common scienti c method for synthesizing MWCNTs. MWCNTs have lengths of on the order of ten microns and diameter in the range of 5 - 30nm. A schemtaic diagram of DC arc-discharge method used for synthesizing CNTs is shown in Figure 2.5 [16]. The arc is generated between two pure graphite electrodes. The positive electrode must be replaced with a new one before doing any new deposition because it is consumed in the arc. Helium is a typical gas used as lling up the chamber because it has low ionization potential. It ows though the chamber from the inlet a at a desired pressure of around 500 torr. Since plasma is necessary in this methode, the type and pressure of the gas surrounding the arc becomes critical. The typical applied DC voltage is 20 V. The positive electrode is brought closer to negative one until arcing occurs. A plasma with a temperature up to 3700 C is formed. Consequently, the variation of temperature might cause the large size distribution of CNTs. The deposit forms on the negative electrode where there is a current owing. It 11 has been shown that lower the current ow, the better the yields of CNTs are. With this process, a following puri cation procedure is needed to extract CNT samples [35]. Figure 2.4: Schematic diagram of the arc apparatus where the nanotubes are formed from the plasma between the two carbon rods [16] 12 The growth of high-quality SWCNTs at the 1 - 10g scale was achieved by Smalley using a laser ablation method. The schematic diagram is shown in Figure 2.6 [36]. The method took advantage of intense laser pulses to ablate a carbon target which contains 0.5 atomic percent of nickel and cobalt. The target was palced in a tube-furnace heated to 1200 C. During the processing of laser ablation, a ow of inert gas was passed through the chamber to carry the grown nanotubes downstream to be collected on a cold nger. The synthesized SWCNTs are mostly in the form of ropes consisting of tens of individual nanotubes close-packed into hexagonal crystals via Vander Waals interactions. In growth SWCNTs by means of arc- discharge and laser ablation, typical by-products including fullerenes, graphitic polyhedrons with enclosed metal particles, and amorphous carbon in the form of particles or overcoating on the sidewalls of nanotubes have been seen [17]. Figure 2.5: Schematic diagram of a laser ablation set-up [36] 13 2.2.2 Chemical vapor deposition Among these synthetic techniques, chemical vapor deposition (CVD) method is espe- cially attractive because it can be easily scaled up. The synthesis of CNTs by CVD method requires the presence of a gaseous phase activated carbon. It is common to use gaseous carbon sources including methane, acetylene, and carbon monoxide. But also alcohols and carbon clusters derived from solid carbon forms can be used. The activation of the molecules or of the nanostructured fragments is achieved using a variety of methods which can be roughly categorized as: [37] 1) Plasma CVD 2) Thermal CVD CNTs synthesis by CVD is a two-step process consisting of a preliminary catalyst prepa- ration step followed by actual synthesis of the nanotubes. In general, CVD technique tends to produce nanotubes with fewer carbonaceous impurities with respect to the other synthetic techniques and the residual particles of the metal catalyst are frequently found at an extrem- ity of the nanotube, making their elimination by post-synthesis chemical processes easier. The choice of metal cayalyst, usually a rst-row transition metal such as Ni, Fe, or Co can drive the process toward the preferential growth of single rather than multiwall nanotubes and to control the formation of individual or bundled nanotubes. The dimensions of the catalyst are very important: large particles can produce MWCNTs, but if the particle size of the metal or metallic alloy is too large, carbon laments or bers can be produced instead of nanotubes [37]. In plasma enhanced CVD technique, the plasmas is used to decompose and activate the reactants in the gas phase. Plasma is often generated by hot- lament or by electrical discharges at di erent frequencies (DC, RF, MW). Plasma-enhanced CVD (PECVD) is a method that can be easily scaled-up. In PECVD, the catalyst is supported by the substrate 14 and can be prepared by wet chemistry or by a sputtering process. In the rst case, a solution containing a metal compound is deposited by casting onto the substrate surface. In the second case, a layer of metal is deposited on the substrate by sputtering. Both processes are followed by either chemical etching or thermal annealing to induce catalyst clustering and particle formation on the substrate. The reactive carbon species in the gas phase then di use towards the substrate, which is generally heated between 650 to 1500 C temperature. The pressure in the deposition reactors is typically low (< 100 Torr). In a hot lament reactor, the reactants are activated by a heated lament that induces the formation of radicals and active species: the reaction product condense on a substrate forming a deposit. The fundamental components of a typical hot lament CVD (HFCVD) system for the growth of nanotubes are: 1) A vcauum chamber that the pressure of the reaction gases is maintained at values between 10 and 300 Torr. 2) A heated lament located at a distance of a few mm from the substrate on which the material must be deposited. 3) An additional system for heating the substrate up to 800 1500 C. The thermal CVD method involves the decomposition of a gaseous or volatile compound of carbon, catalyzed by metallic nanoparticles, which also serve as nucleation sites for the initiation of nanotube growth. Abundant carbon gas mixed with argon or nitrogen gases are used, but sometimes the starting material can be a liquid that is consequently vaporized. The catalyst can be either in solid form, supported on a previously coated substrate, or mixed with the feed gas, and owed into the reactor. The deposition reactors are typically maintained under atmospheric pressure, even if some intereting processes can be carried out under high-pressure condition. It has the advantage of being remarkably cheap and o er the posibility of being easily scaled-up. One disadvantage is the presence of deposits of a large amount of residual metallic catalyst. The general scheme of a thermal CVD apparatus for carbon nanotubes synthesis is shown in Figure 2.8 [38]. 15 Figure 2.6: Schematic diagram for thermal CVD reactor [38] In thermal CVD, the catalyst has a strong e ect on the growth rate and on the nal nanotube yield [39]. Therefore, various techniques have been developed for the preparation of catalyst. It is often used in bulk quantities, and to the choice of a suitable catalyst support. For example, the use of metallic alloys to catalyze for the nanotube growth often results in an enhancement of the yields. Nanoparticles of bimetallic alloys, as for exmple Fe and Co, give 10 - 100 times higher yield of SWNTs than pure Fe [40]. The e ect of deposition temperature and of the metal particle concentration on the deposit morphology has also been investigated [41]. When growing CNTs by thermal CVD on a catalyst supported by a substrate, the CNT diameters are often found to be dependent on the lm thickness or on the particle size. For instance, a research group reported [42] that using substrates coated by a metal lm with a thickness of 13 and 27nm, the diameter distribution resulted in the ranges of 30 - 40 nm and 100 - 200 nm respectively. 16 2.3 Growth mechanisms of CNTs Growth mechanism is always an interesting topic that has been debatable right from its discovery. Several research groups have reported a variety of possibilities which are often contradicting. As a result, there is no well established CNT growth mechanism. However, there are two widely accepted mechanism can be categorized as tip-growth model and base- growth model. Hydrocarbon vapor when comes in contact with the hot metal nanoparticels, rst decomposes into carbon and hydrogen species; hydrogen ies away and carbon gets dissolved into the metal. After reaching the carbon-solubility limit in the metal at that temperatutre, as-dissolved carbon precipitates out and crystallizes in the form of a cylindrical network having no dangling bonds [43]. When the catalyst-substrate interaction is weak, hydrocarbon decomposes on the top surface of the metal; carbon di uses down through the metal; and CNT precipitates out across the metal bottom, pushing the whole metal particle o the substrate. This is described in picture 2.9 (a) As long as the metal?s top is open for fresh hydrocarbon decomposition, CNT continues to grow longer and longer. Once the metal is fully covered with excess carbon, its catalytic activity ceases and the CNT growth is stopped. This is known as tip-growth model (Figure 2.9(a) [43]). On the other hand, when the catalyst-substrate interaction is strong, initial hydrocarbon decomposition and carbon di usion take place similar to that in the tip-growth case, but the CNT precipitation fails to push the metal particle up; so the precipitation is compelled to emerge out from the metal?s apex. First, carbon crystallizes out as a hemispherical dome which then extends up in the form of seamless graphitic cylinder. Subsequent hydrocarbon deposition takes place on the lower peripheral surface of the metal, and as-dissolved carbon di uses upward. CNT grows up with the catalyst particle rooted on its base; hence, this is known as base-growth model (Figure 2.9(b) [43]). CNT synthesis involves many parameters such as hydrocarbon, catalyst, temperature, pressure, gas ow rate, deposition time and reactor geometry. 17 Figure 2.7: (a) tip-growth model (b) base-growth model [43] 2.4 Field emission of electrons from CNTs Local electric eld is the eld that surface experiences and proportional to the applied eld, when applied eld is enhaced due to \sharp" surface irregulation. Field emission is a process that the electrons are emitted from a cold solid surface under the action of a strong electric eld. It involves the extraction of electrons from a solid by tunneling through the surface potential barrier. The potential barrier is square when no electric eld is applied as shown in Figure 2.8 [44]. Its shape becomes triangular when a negative potential is applied to the solid, with a slope that depends on the amplitude of the local electic eld, F, just above the surface. Field emission from CNTs follows the same physics. For a single nanotube with sharp tip, the local electic eld cannot be simply calculated by dividing the applied voltage 18 by the gap distance between the tip of the nanotube and the anode electrode. The local eld will be higher by a factor , which ampli es the eld and is determined by the geometrical shape of the emitter. Therefore, the electric eld is written as: F = E = V=d0, where E is the applied eld. The eld emission characteristic of SWCNT have been studied [45]. Most single SWCNT emitters with a closed tip as well as opened are capable of emitting over an incredibly large current. Field emission from individual MWCNTs has studied by Satio et al [46]. Also, they have used closed and opened tubes as the sources in a eld emission microscopy. The motivation behind these studied is to explore the possibility of using individual nanotube eld emitters in cathod ray tubes or electron guns for electron microscopy. 19 Figure 2.8: Typical set-up for eld emission: a potential di erence is applied between a nanotube and a counter electrode [44] 20 The emission current increases linearly with applied eld for a eld smaller than a critical eld which is designated as the turn-on eld, E0, and then the current increases exponentially with the applied eld for a eld stronger than turn-on eld. The J-E characteristics of the CNTs were analyzed using Fowler-Nordheim (F-N) model [47]: J =a E2 exp b E , where a=A 2=d2 1:1 exp 1:44 10 7B 1=2 , b=0:95B 3=2d , where A is 1.54 10 6 eV V 2 and B is 6.83 107 eV 3=2V cm 1 derived from quantum statistics, is the work function of CNTs, is the emission e etive area, and is the eld enhancement factor, which is directly related to the geometry and surface properties of the CNT samples. The applied electric eld is de ned as E=V/d, where V is the applied voltage and d is the distance between the electrodes. The localized electric eld experienced by one CNT is expected to be V/d. The parameters in the F-N equation can be deduced by tting the ln(I/V2) vs. 1/V curve, the F-N plot. Fowler-Nordheim model shows that the dependence of the emitted current on the local electric eld E and the work function , is exponential like. 2.5 Potential applications of CNTs Many potential applications have been reported for CNTs including their use as rein- forcement in composite materials, as transparent and exible electrodes [48], AFM/STM tips (Figure 2.9 [49]), and electron- eld emitters [50]. The SWCNT lms can exhibit con- ductivity/transmittance values comparable to those of low-temperature ITO. Transparent conducting SWCNT coatings on exible substrates such as polyethylene terephthalate (PET) outperform ITO/PET electrodes in terms of chemical and mechanical stability and exhbit a wider electrochemical window. Moreover, the application of SWCNTs as eld-emission electron sources for use in at-panel displays [17], gas-discharge tubes [17] and microwave generators [51] has been widely explored. The advantages of these devices over those made from metals such as tungsten and molybdenum are the following: relatively easy manufac- turing/fabrication process, less deterioration in high vacuum (10 8Torr), and high current 21 densities of 109 A/cm2. Other desirable properties that make CNTs promising materials as eld emitters are their nanosize diameter, structural integrity, high electrical conductiv- ity, and high chemical stability. Studies on a eld-e ect transistor (Figure 2.10 [52]) made from a semiconducting SWCNT showed it to have the ability to be switched from a con- ducting to an insulating state. Logic switches, the basic components of computers, can be constructed by coupling such CNT transistors. Recently, the application of random CNT Networks (CNTNs) as semiconducting materials for thin- lm transistors (TFT) [53] has at- tracted interest due to their superior performance compared to that of organic TFTs and potentially low-cost fabrication. Uniformity of CNTN properties is achieved by statistical averaging over the large number of individual tubes that make up the network. Various devices and components based on CNTNs have been successfully demonstrated, including diodes, logic circuit elements, solar cells, displays, and sensors [53]. 22 Figure 2.9: TEM image of an individual SWNT tip produced by controlling carefully the catalyst density. The scale bar equals 10 nm [49] 23 Figure 2.10: Schematic process for the fabrication of a CNTFET with a suspended graphene gate without any Si3N4 protective layer: The CNTFET can be gated either by the suspended graphene gate or by the Si substrate acting as a back gate [52]. 24 Chapter 3 Carbon Nanotubes: FABRICATION AND CHARACTERIZATION In this study, CNTs are synthesized using thermal chemical vapor deposition technique (CVD). The CVD method has advantages of simple equipment setup and excellent unifor- mity of thin- lm deposition over large area. Silicon wafers are used as the substrate for CNTs growth and several underlayers and catalyst materials deposited on the silicon wafers using DC/RF magnetron supttering system. Once the synthesis process is completed, CNTs are examined used scanning electron microscopy (SEM) and their electrical properties are char- acterized by eld emission measurements in vacuum. Synthezied parameters are optimized by using sputtering and growth conditions. 3.0.1 Growth process Two metal catalysts were used. Fe as the catalyst, the growth of CNTs is carried at a temperaute of 700 C, however, Co as the catlyst, the temperature was risen from 700 to 850 C. All the experiments were running at the pressure of 70 Torr and the growth time are all 20 min. Figure 3.1 shows the schematic diagram for the thermal CVD reactor used for the growth of CNTs. A resistive heater is used to heat the quartz substrate inside the furnace. A thermocouple is connected to the substrate holder to measure the temperature. Flowmeters connected between the chamber and the gas cylinders are used to measure the gas ow into the CVD chamber. The pressure in the chamber is controlled by a throttle valve, which is connected between mechanical pump and the pressure gauge. The gas mixture of acetylene and argon with 20 and 75sccm respectively were used as the feed gas in the chamber. For growing the vertically-aligned MWCNTs (VA-MWCNTs), after the deposition of the iron catlayst, it was received the other graphite deposition. After two steps deposition processes, 25 the sample was oxidized in air at 300 C for 8 hours. Thermal CVD of CNTs was performed in a vacuum furnace lled with a gas mixture of acetylene and argon at a pressure of 70 torr. Before the gas mixture was fed into the furnace, the substrate was heated to 700 C in vacuum and the temperature was remained constant during the 20 min growth of MWNTs. VA-MWNTs grew on the substrate iwht a uniform length approximately 20 m (Figure 4.8). 26 Figure 3.1: Schematic diagram for thermal CVD reactor [54] 27 3.0.2 Selective grown CNTs synthesis processes The fabrication process for synthesizing selectively grown CNTs sample is carried out in detail as shown in Figure 3.3. First, the plain n-type (100) silicon wafers are cleaned by the standard RCA (Radio Corporation of Americ) cleaning procedure. They are dipped into a Bu ered Oxide Etching (BOE) solution in order to remove native oxide and chemical impurities, followed by deionized water (DI water) rinse for a couples of minutes. A dehy- dration bake step for 20min is performed before priming and spin-coating a wafer with resist. Following the dehydration bake, the silicon wafer is primed with a pre-resist coating of a material designed to improve adhesion in this case. Hexamethyldisilazane (HMDS) enhances the adhesion between the Si wafer and the photoresist (PR), and bahaves as surface-linking adhesion promoter. 10min of HMDS priming allows good adhesion. Following cleaning, dehydration baking, and priming, the silicon substrate is coated with photoresist (PR) at a speed of 3000 rpm for 30 sec, and soft-baked on the hotplate at 105 C for 1min. After a wafer has been coated with resist, it is subjected to a temperature step, called soft-bake (or pre-bake), and it is ready to be exposed to some form of radiation in order to create a latent image in the resist. After exposure, then, the patterned substrate is subject to another temperature step, called hot-bake, putting on the hotplate at 120 C for 1min. After this baking process, the substrates are then sputtered with iron forming a 7nm thick Fe (purity 99.99%) catalysis lm in a sputtering vacuum chamber. The sputtering system is a 2-inch DC magnetron sputtering system with a power 100W through shadow masks, containing di erent patterned openings with the sizes of 25 m to 0.5 cm at pitch distances of 25 m to 0.5 cm. When the catalyst are deposited onto the substrate, it is dipped into the aceton for couple minutes to remove PR, then the patterned lm are successfully obtained. 28 Figure 3.2: Schematic diagram of CNTs fabrication processing (a) silicon wafer cleaned and prepared, (b) mask is aligned to remove parts of the photoresist for patterned deposition of the iron catalyst. (c) the spattering process is conducted. (d) photoresist is removed from the wafer exposing only the sections with catalyst Fe. The sample is now ready to be moved to the CVD chamber for CNT growth process. (e) the CNTs are selectively grown on the substrate. 29 3.1 Electron eld emission measurements and experimental setup Once the growth process of the CNTs is completed, eld emission properties are mea- sured in vacuum. These CNTs samples, one at a time, are loaded into a high vacuum chamber. The chamber is pumped by a turbomolecular pump to a vacuum level of 3 10 6 Torr. The measurements are performance at room temperature. The distance between the CNTs sample (the cathode) and the anode is maintained constant by a glass spacer with a thickness of 140 m. A rod made by tungsten with a diameter of 0.4 cm was used as the anode. A dc variable high-voltage supply is used to bias the electrodes. The voltage is con- tinuously increased with intervals between the cathode and the anode. The emission current was recorded by a Keithley picoammeter which was connected to a computer through GPIB card. The applied voltage and the eld emission current are recorded and then analyzed. A schematic diagram of an experimental setup used for theses measurements is shown in Figure. 3.3 [6]. For the eld emission study, once the voltage and current data are collected, the elec- tric eld and the current density data are calculated from the raw data with the following equations: E = V IRd and j = IS where R is the resistance of the current limiting resistor with a value of 3 M , d is the gap distance, which is the thickness of the glass spacer, and S is the emission area which is the exposed area of the collector rod to the CNTs. In these equations d = 140 m and S = 0.0316 cm2 are used. For each applied voltage, ve current data with 1 second intervals are recorded and then averaged to form one data point, to assure the test accuracy. 30 Figure 3.3: Schematic diagram for the eld emission measurement setup [6] 31 Chapter 4 RESULTS AND DISCUSSION Two di erent morphologies of CNTs, randomly oriented and vertically aligned, were successfully deposited on silicon substrate with di erent catalysts and underlying layers by thermal chemical vapor deposition. The catalysts are Iron (Fe) and Cobalt (Co) and under- lying layers are SiO2, Titanium (Ti) and Tungsten (W). The eld emission characteristics of the CNTs specimens are examined in a high pressure vacuum chamber. The e ect of catalysts and underlying layers on the eld emission characteristics of CNTs are studied. Table 4.1: Various Structural Properties of Catalyst-Underlying-Layer Combinations Substrate Underlayer Catalyst N/A FeCo Silicon dioxide (SiO2) FeCo Silion Titanium (Ti) Fe Co Tungstun (W) FeCo Selectively growth CNTs w/o underlayer Fe 4.1 In uence of catalyst layer thickness It is known that CNTs grown by low temperature CVD procedures requires a transition metal catalyst [43], and numerous studies have reported the use of Ni, Fe, Co. [55{57]. In this study, the CNTs are grown on silicon p-type (100) substrates. A thin catalyst lm (Fe, Co) is deposited on substrates by DC magnetron sputtering. Table 4.2 and 4.3 show that 32 the relationship between sputtering time and metal catalysts (Fe, Co) thickness, separately. From the experimental results, for both Fe and Co catalysts, CNTs can by synthesized well onto the plain silicon substrates by depositing the thickness around 7nm-12nm. However, once the catalyst lms are thicker than 15nm, CNTs are not found at any substrate, instead of graphite. The catalyst thinkess was measured by pro lometer. Table 4.2: Iron catalyst vs. sputtering time Sputtering time 1min 3min 5min 8min 10min 15min Iron thickness t 7nm 7nm 10nm 15nm Table 4.3: Cobalt catalyst vs. sputtering time Sputtering time 15sec 30sec 45sec 1min >1min Cobalt thickness t 7nm 15nm 25nm >25nm 4.2 In uence of underlying layer CNTs are grown ever di erent underlying layers of SiO2, Ti and W. We investigated the Fe and Co catalysts and various underlayers in their respective e ectivenss. For using Fe catalyst, the results indicates that nanotubes are grown well on plain Si and SiO2 underlayer at a certain growth condition. On the other hand, using the Ti or W as underlayer, the high-quality nanotubes cannot be form. For Co catalyst, nanotubes can be only grown on SiO2 underlayers. The Ti, W and plain silicon are not found nanotubes formation. For plain silicon, the reason could be the formation of silicide, CoSix during the high temperature processing [58] . As a result, a barrier layer such as SiO2 is useful to prevent silicide formation when using Co as catalyst. 4.3 In uence of the deposition temperature In this study, nanotubes were synthesized at two di erent deposition temperatures while keeping all other parameters constant. For Fe catalyst, our experimental results indicate 33 when temperature is below 700 C, it may not be su cient for nucleating nanotubes. The temperature may be too low to decompose C2H2, hindering growth. Furthermore, the low temperature also limits the graphitization, which increases the condensation of a-C [59]. The nanotubes grown at 700 C are uniform and dense in size. Nevertheless, when the deposition temperature is increased to about 900 C, the nanotubes are not grown. For Co catalyst, it is found that the nanotubes cannot be grown at 700 C. However, while increasing the deposition temperature to 850 C, the nanotubes are successfully grown. According to C.H. Lin et al. [60], it is believed that the e ect of the substrate temperature is to minimize the thermal energy to activate catalysts to precipitate carbon atoms to form nanotubes. 4.4 Fowler-Nordheim curves In section 2.4, the eld emission properteis of CNTs has been introduced. During the eld emission process, when the injected electrons pass through the surface of the CNTs and are emitted into the vacuum towards the anode from the CNTs, the local electric eld is enhanced due to the sharp needle like emitting structures of the CNTs compared to the at structures. According to Fowler-Nordheim (F-N) theory [61], the dependence of the emission current, I(A) on the work function (eV) of the emitting surface and the local electric eld just above the emitter surface, F= E= V/d (V/ m), is exponential, and described by the F-N equation written as: I=k1 2E2s exp 0 @ k2 3 2 1 A where s is the emitter area (cm2) and is the enhancement factor, determined by the geometric shape of the emitter. The constants k1 = 1:54 10 6(A-eV/V2) and k2 = 6:83 107 (eV 3=2-V/cm) are given in the literature [62]. In general, the plot of ln(1/E2) vs 1=E yields a straight line and the slope of the line is proportional to the eld enhancement factor, of the emitters and the intercept gives the emitter area. 34 4.5 Scanning electron microscope image In this section, the scanning electron microscope (SEM) images of CNTs samples with di erent growth conditions and underlying layers are presented. The following SEM images show that the samples with 1 and 5 of iron sputtering time on SiO2 and 15, 30sec and 1min of cobalt sputtering time on SiO2. The sample with 5 min iron and 8 min graphite sputtering time can yield very good-quality MWNTs on both plain silicon and SiO2, as shown in Figure 4.3. Figure 4.5 and 4.6 were used cobalt as catlayst to deposit CNTs. Using cobalt to synthesize CNTs, they are obviously shorter than using Fe as catalyst under the same growth time. Figure 4.7 shows that when catalyst thickness is too thick, then carbon cluster will be formed instead of CNTs. The cross-sectional SEM image of vertically-aligned and randomly-oriented MWCNTs is shown as Figure 4.8 and Figure 4.9, separately. Figure. 4.10 is the patterned CNTs of SEM image. 4.5.1 SEM images of CNTs with di erent catalysts sputtering time and under- layers 35 Figure 4.1: 1min Fe sputtering time on SiO2 underlayer Figure 4.2: 5min Fe sputtering time on SiO2 underlayer 36 Figure 4.3: 5min Fe with Carbon 8 min sputtering time on SiO2 underlayer Figure 4.4: 5min Fe sputtering time on SiO2 underlayer 37 Figure 4.5: 15 sec Cobalt sputtering time on SiO2 underlayer Figure 4.6: 30 sec Cobalt sputtering time on SiO2 underlayer 38 Figure 4.7: Cobalt sputtering time above 1min on SiO2 underlayer 39 Figure 4.8: SEM image of vertically-aligned multi-wall carbon nanotubes (VA-MWCNTs). 40 Figure 4.9: Cross-sectional SEM image of randomly-oriented MWCNTs. 41 Figure 4.10: SEM image of patterned CNTs array (a) 25 m circle array with 25 m spacing, (b) 25 m diameter circle array with 50 m spacing, (c) 50 m 50 m square array with 25 m spacing, (d) a close-up image of a single CNT bundle (from a circle array sample) 42 Table 4.4: Various Structural Prop erties of Catalyst-Underlying-La yer Com binations Sp ecimen Substrate Underlying Catalyst Typ e Pre-treatmen ta Typ es of CNTs Gro wth Note b Lab el La yer (XX) (YY) Condition c Iron f N/A Random T: 700 C; t:20min Table4.5 S01-XX-YY d Silicon e Oxide(0.6 m ) w/ dep ositing graphite Vertically-Aligned Ar:C 2H 2=75:25sccm Cobalt g N/A Random T: 850 C h; t:20min Table4.6 w/ dep ositing graphite Random Ar:C 2H 2=75:25sccm Iron N/A Random T: 700 C; t:20min Table4.7 S02-XX-YY Silicon N/A i w/ dep ositing graphite Vertically-Aligned Ar:C 2H 2=75:25sccm Cobalt N/A Random T: 850 C; t:20min Table4.8 w/ dep ositing graphite Random Ar:C 2H 2=75:25sccm Iron N/A Random T: 700 C; t:20min Table4.9 S03-XX-YY Silicon Titanium(0.6 m )j w/ dep ositing graphite Random Ar:C 2H 2=75:25sccm Cobalt N/A Random T: 850 C; t:20min Table4.10 w/ dep ositing graphite Random Ar:C 2H 2=75:25sccm Iron N/A N/A T: 700 C; t:20min Table4.11 S04-XX-YY Silicon Tungsten(0.4 m )k w/ dep ositing graphite N/A Ar:C 2H 2=75:25sccm Cobalt N/A N/A T: 850 C; t:20min Table4.12 w/ dep ositing graphite N/A Ar:C 2H 2=75:25sccm aSp ecimen with dep ositing graphite were then annealed in air at 300 C for 8hrs [63] bF or detailed information, refer to the table cThe grw oth time of sp ecimens all are 20m in in agas mixture of Argon and Acet ylene(75:25sccm) in the pressure 70T orr fThe iron pur ity is 99.99% dXX: the dep osition time of catalyst, YY: the dep osition time of graphite eUse n-t yp e< 100 > Si waf er, resistivit y1 to 5 -cm gThe cobalt purit yis 99.99% hIt is believ ed that substrate temp erature is to minimize the thermal energy to activ ate catalysts to form nanotub es [60] iR CA cleaning pro cess(a short imme rsion in a1:50 solution of HF + H2O) to remo ve nativ eo xide lay er jThe titanium pur ity is 99.99% kThe tungsten purit yis 99.99% 43 Table 4.5: Various Structural Prop erties of Catalyst-Underlying-La yer Com binations Sp ecimen Substrate Underlying Catalyst Typ e Pre-treatmen t Typ es of CNTs Gro wth Note b Lab el La yer (XX) (YY) Condition a S05-XX-YY c Silicon N/A Iron N/A Random T: 700 C; t:20min Table4.13 Ar:C 2H 2=75:25sccm bF or detailed information, refer to the table aThe grw oth time of sp ecimens all are 20min in agas mixture of Argon and Acet ylene(75:25sccm) in the pressure 70T orr cSelectiv egrw on CNTs 44 Table 4.6: MWNTs gro wth on the catalyst-coated(F e) substrate w/ SiO2 underla yer Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emi ssion Characteristics S01-F e-1min-00 Lo w de ns ity gro wth Random Turn on eld 1:86 V= m Saturation curen t 5:4 10 3 A=cm 2 S01-F e-3min-00 t 7nm Lo w de ns ity gro wth Random Turn on eld 1:57 V= m Saturation curen t 5:2 10 3 A=cm 2 S01-F e-5min-00 High densit ygro wth Random Turn on eld 1:71 V= m Saturation curen t 4:1 10 3 A=cm 2 S01-F e-8min-00 t 7nm High densit ygro wth Random Turn on eld 1:71 V= m Saturation curen t 4:8 10 3 A=cm 2 S01-F e-10min-00 t 10nm High densit ygro wth Random Turn on eld 1:57 V= m Saturation curen t 4:9 10 3 A=cm 2 S01-F e-15min-00 t 15nm No gro wth a N/A N/A S01-F e-5min-C-1min High densit ygro wth Random Turn on eld 1:71 V= m Saturation curen t 4:1 10 3 S01-F e-5min-C-3min High densit ygro wth Random Turn on eld 1:71 V= m Saturation curen t 5:3 10 3 A=cm 2 S01-F e-5min-C-5min Fe catalyst: t 7nm a High densit ygro wth Random Turn on eld 1:71 V= m Saturation curen t 4:78 10 3 A=cm 2 S01-F e-5min-C-8min Extreme densit ygro wth Vertically Aligned Turn on eld 2:14 V= m Saturation curen t 1:78 10 3 A=cm 2 S01-F e-5min-C-10min High densit ygro wth Random Turn on eld 1:57 v= m Saturation curen t 4:58 10 3 A=cm 2 S01-F e-5min-C-15min No gro wth N/A N/A aF orm the carb on cluster aCho osing Fe-5min as the base,and then pretreated by dep ositing graphite(C) an dannealing 8hrs. 45 Figure 4.11: Field emission curv efor gro wing CNTs on SiO 2 using Fe as catalyst w/o pre-treatmen t 46 Figure 4.12: Fo wler -N ordeim curv eof CNT gro wn on SiO 2 using Fe as catalyst w/o pre-treatmen t 47 Figure 4.13: Field emission curv efor gro wing CNTs on SiO 2 using Fe as catalyst with pre-treatmen t 48 Figure 4.14: Fo wler-Nordeim curv eof CNT gro wn on SiO 2 using Fe as catalyst with pre-treatmen t 49 Table 4.7: MWNTs gro wth on the catalyst-coated(Co) substrate w/ SiO 2underla yer Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emiss ion Characteristics S01-Co-15sec-00 Lo w de ns ity gro wth Random Turn on eld 2:72 V= m t 7nm Saturation curen t 4:5 10 3 A=cm 2 S01-Co-30sec-00 Lo w de ns ity gro wth Random Turn on eld 5:57 V= m Saturation curen t 2:09 10 3 A=cm 2 S01-Co-45sec-00 t 15nm Lo w de ns ity gro wth Random Turn on eld 1:72 V= m Saturation curen t 3:8 10 3 A=cm 2 S01-Co-1min-00 t 25nm Lo w de ns ity gro wth Random Turn on eld 2:72 V= m Saturation curen t 3:7 10 3 A=cm 2 S01-Co-Ab ov e1min-00 t> 25nm No gro wth N/A N/A S01-Co-45sec-C-3min No gro wth N/A N/A S01-Co-45sec-C-4min No gro wth N/A N/A S01-Co-45sec-C-5min Co catalyst: t 25nm No gro wth N/A N/A S01-Co-45sec-C-7min No gro wth N/A N/A S01-Co-45sec-C-10min No gro wth N/A N/A 50 Figure 4.15: Field emission curv efor gro wing CNTs on SiO 2 using Co as catalyst w/o pre-tre atmen t 51 Figure 4.16: Fo wle r-Nordeim curv eof CNT gro wn on SiO 2 using Co as catalyst w/o pre-tr eatmen t 52 Table 4.8: MWNTs gro wth on the catalyst-coated(F e) substrate w/o SiO2 underla yer Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emi ssion Characteristics S02-F e-1min-00 Lo w de ns ity gro wth Random Turn on eld 1:21 V= m Saturation curen t 4:33 10 3 A=cm 2 S02-F e-3min-00 t 7nm Lo w de ns ity gro wth Random Turn on eld 1:22 V= m Saturation curen t 6:47 10 3 A=cm 2 S02-F e-5min-00 High densit ygro wth Random Turn on eld 1:78 V= m Saturation curen t 5:45 10 3 A=cm 2 S02-F e-8min-00 t 7nm High densit ygro wth Random Turn on eld 1:43 V= m Saturation curen t 6:4 10 3 A=cm 2 S02-F e-10min-00 t 10nm High densit ygro wth Random Turn on eld 1:14 V= m Saturation curen t 6:6 10 3 A=cm 2 S02-F e-15min-00 t 15nm No gro wth a N/A N/A S02-F e-5min-C-1min High densit ygro wth Random Turn on eld 1:14 V= m Saturation curen t 5:74 10 3 A=cm 2 S02-F e-5min-C-3min High densit ygro wth Random Turn on eld 1:37 V= m Saturation curen t 5:1 10 3 A=cm 2 S02-F e-5min-C-5min Fe catalyst: t 7nm a High densit ygro wth Random Turn on eld 1:36 V= m Saturation curen t 6:4 10 3 A=cm 2 S02-F e-5min-C-8min Extreme densit ygro wth Vertically Aligned Turn on eld 2:14 V= m Saturation curen t 1:41 10 4 A=cm 2 S02-F e-5min-C-10min High densit ygro wth Random Turn on eld 1:86 v= m Saturation curen t 2:08 10 3 A=cm 2 S02-F e-5min-C-15min No gro wth N/A N/A aF orm the carb on cluster aCho osing Fe-5min as the base,and then pretreated by dep ositing graphite(C) an dannealing 8hrs. 53 Figure 4.17: Field emission curv efor gro wing CNTs on plain silicon using Fe as catalyst w/o pre-treatm en t 54 Figure 4.18: Fo wler -Nordeim curv eof CNT gro wn on plain silicon using Fe as catalyst w/o pr e-treatmen t 55 Figure 4.19: Field emission curv efor gro wing CNTs on plain silicon using Fe as catalyst with pre-treatme nt 56 Figure 4.20: Fo wler-Nordeim curv eof CNT gro wn on plain silicon using Fe as catalyst with pre-treatmen t 57 Table 4.9: MWNTs gro wth on the catalyst-coated(Co) substrate w/o SiO2 underla yer Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emissi on Characteristics S02-Co-15sec-00 No gro wth N/A N/A t 7nm S02-Co-30sec-00 No gro wth N/A N/A S02-Co-45sec-00 t 15nm No gro wth N/A N/A S02-Co-1min-00 t 25nm No gro wth N/A N/A S02-Co-45sec-C-3min No gro wth N/A N/A S02-Co-45sec-C-4min No gro wth N/A N/A S02-Co-45sec-C-5min Co catalyst: t 25nm No gro wth N/A N/A S02-Co-45sec-C-7min No gro wth N/A N/A S02-Co-45sec-C-10min No gro wth N/A N/A 58 Table 4.10: MWNTs gro wth on the catalyst(F e)-underlying Ti lay er-coated substrate Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emiss ion Characteristics S03-F e-5min-00 Very low densit ygro wth Random Turn on eld 2:9 V= m Saturation curen t 2:52 10 3 mA=cm 2 S03-F e-8min-00 Fe catalyst: t 7nm Very low densit ygro wth Random Turn on eld 3:2 V= m Ti lay er 0:6 m Saturation curen t 1:54 10 3 mA=cm 2 S03-F e-10min-00 Very low densit ygro wth Random Turn on eld 2:3 V= m Saturation curen t 2:64 10 3 mA=cm 2 S03-F e-5min-C-5min Very low densit ygro wth Random Turn on eld 2:14 V= m Saturation curen t 2:04 10 3 mA=cm 2 S03-F e-5min-C-8min Fe catalyst: t 7nm Very low densit ygro wth Random Turn on eld 2:71 V= m Saturation curen t 1:43 10 3 mA=cm 2 S03-F e-5min-C-10min Very low densit ygro wth Random Turn on eld 3:86 V= m Saturation curen t 1:55 10 3 mA=cm 2 59 Figure 4.21: Field emission curv efor gro wing CNTs on Ti underlying lay er using Fe as catalyst w/o pr e-treatmen t 60 Figure 4.22: Fo wler -Nordeim curv eof CNT gro wn on plain silicon using Fe as catalyst w/o pr e-treatmen t 61 Figure 4.23: Field emission curv efor gro wing CNTs on Ti underlying lay er us ing Fe as catalyst with pre -treatmen t 62 Figure 4.24: Fo wler-Nordeim curv eof CNT gro wn on Ti underlying lay er using Fe as catalyst with pre-treatmen t 63 Table 4.11: MWNTs gro wth on the catalyst(Co)-underly ing Ti lay er-coated substrate Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emi ssion Characteristics S03-Co-30sec-00 t 7nm No gro wth N/A N/A S03-Co-45sec-00 t 15nm No gro wth N/A N/A S03-Co-1min-00 t 25nm No gro wth N/A N/A S03-Co-1min-C-5min No gro wth N/A N/A S03-Co-1min-C-8min t 25nm No gro wth N/A N/A S03-Co-1min-C-10min No gro wth N/A N/A 64 Table 4.12: MWNTs gro wth on the catalyst(F e)-underlying W lay er-coated substrate Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emiss ion Characteristics S04-F e-5min-00 t 7nm No gro wth N/A N/A S04-F e-8min-00 t 7nm No gro wth N/A N/A S04-F e-10min-00 t 10nm No gro wth N/A N/A S04-F e-5min-C-5min No gro wth N/A N/A S04-F e-5min-C-8min Fe catalyst: t 7nm No gro wth N/A N/A S04-F e-5min-C-10min No gro wth N/A N/A 65 Table 4.13: MWNTs gro wth on the catalyst(Co)-under lying W lay er-coated substrate Sp ecimen Lab el Thic kness of Catalyst SEM Image Typ e of CNTs Field Emi ssion Characteristics S04-Co-30sec-00 t 7nm No gro wth N/A N/A S04-Co-45sec-00 t 15nm No gro wth N/A N/A S04-Co-1min-00 t 25nm No gro wth N/A N/A S04-Co-1min-C-5min No gro wth N/A N/A S04-Co-1min-C-8min Co catalyst: t 25nm No gro wth N/A N/A S04-Co-1min-C-10min No gro wth N/A N/A 66 Table 4.14: Selectiv egro wth of MWNTs on the catalyst(F e)-coated substrate w/o SiO2 Sample Lab el Size Shap e Arra y Spa cing SEM Image Typ e of CNTs Field Em ission Characteristics 25 m in diameter Circle 25 m High densit y Random Turn on eld 2:26 V= m Saturation curen t 2:47 10 3 A=cm 2 25 m in diameter Circle 50 m High densit y Random Turn on eld 3:12 V= m Saturation curen t 0:3 10 3 A=cm 2 25 m in diameter Circle 100 m High densit y Random Turn on eld 2:42 V= m S05-F e-5min-00 Saturation curen t 1 10 3 A=cm 2 50 m 50 m Square 25 m High densit y Random Turn on eld 2:28 V= m Saturation curen t 4 10 3 A=cm 2 0.5cm 0.5cm Square 0.5cm High densit y Random Turn on eld 2:82 V= m Saturation curen t 0:4 10 4 A=cm 2 67 Figure 4.25: Field emission curv efor gro wing selectiv eCNTs on plain silicon using Fe as catalyst w/o pre-treatmen t 68 Figure 4.26: Fo wl er-Nordeim curv eof selectiv eCNT gro wn on plain silicon us ing Fe as catalyst w/o pre- treatmen t 69 Chapter 5 SUMMARY AND FUTURE DIRECTIONS Since the discovery of carbon nanotubes (CNTs), many studies have been carried out on their synthesis. With their outstanding electrical, structure, and physical properties, CNTs are envisioned to impact furture electronic applications such as nanoelectronics, sensors, electrodes, and nanophotonics. These applications generally require controlled growth on patterned substrates. Therefore, there has been a strong focus on using thermal chemical vapor deposition (CVD) technique to realized CNT structures for these applications. Field emission is one of the most advanced and broadly studied applications of CNTs. They can emit electrons easily due to their high aspect ratios, compared to other cold-cathode materials. In this work, CNTs have been selective and non-selective grown on a variety of catalyst- coated underlaying layers (plain silicon, SiO2, Ti, W) substrate at two di erent temperatures (700 C, 800 C) by using thermal chemical vapor technique. We investigated their eld emis- sion characteristics. 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