Experimental and Analytical Investigation of a Dynamic Gas Squeeze Film Bearing including Asperity Contact Effects Except where reference is made to the work of others, the work described in this thesis is my own or was done in collaboration with my advisory committee. This thesis does not include proprietary or classified information. Manoj Deepak Mahajan Certificate of Approval: George T. Flowers Professor Mechanical Engineering Robert L. Jackson, Chair Assistant Professor Mechanical Engineering Jay M. Khodadadi Professor Mechanical Engineering Joe F. Pittman Interim Dean Graduate School Experimental and Analytical Investigation of a Dynamic Gas Squeeze Film Bearing including Asperity Contact Effects Manoj Deepak Mahajan A Thesis Submitted to the Graduate Faculty of Auburn University in Partial Fulfillment of the Requirements for the Degree of Master of Science Auburn, Alabama December 15, 2006 Experimental and Analytical Investigation of a Dynamic Gas Squeeze Film Bearing including Asperity Contact Effects Manoj Deepak Mahajan Permission is granted to Auburn University to make copies of this thesis at its discretion, upon the request of individuals or institutions and at their expense. The author reserves all publication rights. Signature of Author Date of Graduation iii Vita Manoj Mahajan, son of Deepak and Neeta Mahajan was born on January 19, 1981, in Nasik District in India. He attended Government College of Engineering, Pune and graduated in November 2002 with the degree of Bachelor of Engineering in Mechanical Engineering. He joined the Masters program in the department of Mechanical Engineering at Auburn University in August 2004. iv Thesis Abstract Experimental and Analytical Investigation of a Dynamic Gas Squeeze Film Bearing including Asperity Contact Effects Manoj Deepak Mahajan Master of Science, December 15, 2006 (B.E., Government College of Engineering, Pune University, 2002) 123 Typed Pages Directed by Robert L. Jackson This thesis presents a theoretical and an experimental investigation of planar gas squeeze film bearings. The thickness and pressure profile of the gas squeeze film are ob- tained by simultaneously solving the Reynolds equation and the equation of motion for the squeeze film bearing. This work also accounts for the force due to surface asperity contact in the equation of motion. When the surfaces are in contact, the model predicts the contact force as a function of film thickness. Computational simulations are performed to study the development of the squeeze film from its initial state to a pseudo-steady state condition and to evaluate its load carrying capacity. For certain cases, the simulation results correlate well with the pre-established analytical results. However, corrections must be made to the analytical equations when they are used out of their effective range. In the experimental study, a squeeze film is developed due to an applied relative normal motion between two v parallel circular plates of which one circular plate is effectively levitated. Theoretical results for the squeeze film thickness match qualitatively with its experimental counterpart. On successful testing of macro-scale gas squeeze film bearings, micro-scale bearing surfaces are fabricated. Experimental investigation of micro-scale bearings suggests that these bearings have significant potential for a wide range of applications in Micro-Electro Mechanical Systems (MEMS). vi Acknowledgments I wish to thank my advisor, Dr. Robert L. Jackson, for providing me with an oppor- tunity to conduct research in the exciting field of tribology. His guidance, support and encouragement have helped me towards the successful completion of my Master?s Degree in Engineering. He is a great mentor and working with him was a wonderful experience. I would like to extend my appreciation and thanks to Dr George Flowers for all the help with the test setup and being part of my graduate committee. I would also like to thank Dr. Jay Khodadadi for serving as a graduate committee member. Many thanks to Klaus Hornig, Dr. Roland Horvath and Alfonso Moreira for their help and motivation at the Vibration Analysis Laboratory. Special thanks to Mr. Charles Ellis and Abhishek for all the help at Alabama Microelectronics Science and Technology Center. I wish to acknowledge my companions here at Auburn, Harish, Rajendra, Harshavardhan, Ananth and Ravi Shankar for their friendship. I wish to dedicate this work to my parents and sisters for their enduring love, immense moral support and encouragement in the journey of life. vii Style manual or journal used LATEX: A Document Preparation System by Leslie Lamport (together with the style known as ?aums?) and Bibliography as per Tribology Transactions Computer software used TEX (specifically LATEX), MATLAB 7.0.4, MS Office PowerPoint 2003 and the departmental style-file aums.sty viii Table of Contents List of Figures xi List of Tables xiii Nomenclature xiv 1 Introduction 1 2 Background 3 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Lubrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.3 Squeeze Film Effect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.4 Incompressible Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . 6 2.5 Compressible Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . . 7 2.6 Squeeze Film Damping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.7 Micro-Scale Squeeze Film Bearings and Effects Due to Molecular Dynamics 18 3 Objectives 24 4 Numerical Investigation 26 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2 Thin Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2.1 Formulation of Coupled Dynamics . . . . . . . . . . . . . . . . . . . 26 4.2.2 Computational Scheme . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.2.3 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.3 Ultra-Thin Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . . . 47 4.3.1 Formulation of Coupled Dynamics . . . . . . . . . . . . . . . . . . . 47 4.3.2 Solution Methodology . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.3.3 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 5 Experimental Investigation 50 5.1 Thin Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 5.1.1 Experimental Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 5.1.2 Experimental Results . . . . . . . . . . . . . . . . . . . . . . . . . . 57 5.2 Ultra-thin Squeeze Film Bearings . . . . . . . . . . . . . . . . . . . . . . . . 63 5.2.1 Design of Micro-Scale Bearing Surfaces . . . . . . . . . . . . . . . . 63 5.2.2 Fabrication of Micro-Scale Bearing Surfaces . . . . . . . . . . . . . . 65 5.2.3 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 ix 6 Summary 73 Bibliography 75 Appendices 79 A Contact Force 80 B C-program to solve the coupled dynamics for thin squeeze films 86 C Tables of Experimental and Simulation Results 93 C.1 Configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 C.2 Configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 C.3 Configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 D Calibration of Capacitance Sensor 98 E Computer program to solve the dynamics for ultra-thin squeeze films102 x List of Figures 2.1 Classification of lubrication . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 The squeeze film thickness, h, as a function of normalized time, T, (h=hm(1+epsilon1?cos(?t) and epsilon1=?h/hm) . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Analogy of a squeeze film as a spring-damper system . . . . . . . . . . . . . 14 4.1 Schematic of a planar squeeze film bearing . . . . . . . . . . . . . . . . . . . 27 4.2 Scheme for discretization of i-spatial variable and j-time variable . . . . . . 28 4.3 Free body diagram of a squeeze film bearing (one degree of freedom) . . . . 30 4.4 Algorithm for computational simulation . . . . . . . . . . . . . . . . . . . . 34 4.5 Dimensionless P as a function of normalized T at R=0.5, ?=1000 and H=1- 0.5?sin(T) (16 nodes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.6 Dimensionless P as a function of normalized T at R=0.5, ?=1000 and H=1- 0.5?sin(T) (160 nodes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.7 Variation in film height for different time steps . . . . . . . . . . . . . . . . 37 4.8 Dynamic behavior of the squeeze film height for given input conditions as a function of time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 4.9 Comparison of the dimensionless squeeze film force, F(T)/(pi?R02?patm), as a function of normalized time, T, from the numerical simulation and from Langlois squeeze film force model [8] . . . . . . . . . . . . . . . . . . . . . . 40 4.10 Change in percentage error between Fi from the numerical simulation and Fn as predicted by Salbu?s Eq. as a function of the squeeze number, ? . . . 43 4.11 The results of numerical parametric study for hm as a function of Fi at a constant frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.12 The results of numerical parametric study for hm as a function of ? . . . . 46 xi 4.13 Algorithm for computational simulation of the ultra-thin squeeze film bearing 49 5.1 Schematic explaining the experimental setup . . . . . . . . . . . . . . . . . 50 5.2 Test stand used for experimental investigation . . . . . . . . . . . . . . . . . 51 5.3 Disks used for levitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.4 Photograph illustrates the experimental setup with the capacitance sensor . 53 5.5 Electrical circuit for capacitance measurement . . . . . . . . . . . . . . . . . 54 5.6 Photograph illustrates the experimental setup with the laser displacement measurement system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 5.7 Plot of DC voltage from the laser beam displacement measurement system 56 5.8 Experimental and simulation results for the squeeze film height against the amplitude of vibration for bearing configuration 1 (Capacitance measurement system) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 5.9 Experimental and simulation results for the squeeze film height against the amplitude of vibration for bearing configuration 2 (Laser displacement mea- surement system) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 5.10 Experimental and simulation results for the squeeze film height against the amplitude of vibration for bearing configuration 3 (Laser displacement mea- surement system) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 5.11 LASICAD drawing of micro bearing surfaces (not to scale and only portions of the textured sections are shown in this enlarged view) . . . . . . . . . . . 64 5.12 Fabrication procedure for micro-scale bearing surfaces . . . . . . . . . . . . 65 5.13 Schematics of single unit cell (not to scale) . . . . . . . . . . . . . . . . . . 68 5.14 Experimental results of micro-scale bearing . . . . . . . . . . . . . . . . . . 70 5.15 Dimensionless mean pressure, Pn, as a function of normalized time, T, for the ultra-thin squeeze film bearing . . . . . . . . . . . . . . . . . . . . . . . 71 A.1 Surface profile of a rough bearing surface . . . . . . . . . . . . . . . . . . . 83 A.2 Dimensionless contact load as a function of dimensionless mean surface sep- aration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 xii List of Tables 2.1 Assumptions and parameters used to estimate the mean free path . . . . . 20 2.2 Types of flows as per Knudsen number [34] . . . . . . . . . . . . . . . . . . 20 4.1 Comparison of load carrying capacity between Fi in numerical simulation and Fn by Salbu?s Eq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1 Bearing configurations used for the experimental purpose . . . . . . . . . . 51 5.2 Silicon Wafer Cleaning Procedure [42] . . . . . . . . . . . . . . . . . . . . . 66 xiii Nomenclature English Symbols A area of contact (m2) B bearing breadth (m) bei, ber Kelvin functions of order zero bei1, ber1 Kelvin functions of order one C capacitance (F) Cairgap capacitance between the squeeze film bearing surfaces (F) d gap due to air (m) E modulus of elasticity (Pa) F squeeze film force (N) Fi applied load, i.e. weight of levitating disk (N) Fd squeeze film damping force (N) Fn mean positive film force (N) f frequency (Hz) G gas constant (J?K?1?mole?1) H dimensionless film thickness, h/h0 H? dimensionless film thickness, h/hm h thickness of squeeze film in z direction (m) xiv h0 initial film thickness (m) hm mean film thickness (m) Kn Knudsen number k dielectric constant for air m mass of the levitated plate (kg) P dimensionless pressure, p/patm p pressure (Pa) patm atmospheric pressure (Pa) QP rarefaction coefficient R dimensionless radius, r/R0 R0 radius of area of contact (m) Rq RMS surface roughness (m) r radial coordinate in cylindrical polar coordinates Sy yield strength (Pa) T normalized time (rad), ?t Tg gas temperature (K) t time (s) UR, U?R physical components of surface motion in cylindrical polar coordinates Ux, U?x dimensionless surface velocity components, ux/V, u?x/V Uy, U?y dimensionless surface velocity components, uy/V, u?y/V ux, u?x surface velocity components of respective bearing surfaces xv in x-direction (m?s?1) uy, u?y surface velocity components of respective bearing surfaces in y-direction (m?s?1) V reference velocity (m?s?1) V in input voltage to the capacitance sensor (V) V o/p output voltage measured across the capacitor (V) Wn mean load capacity X, Y dimensionless right-handed Cartesian coordinates, x/B, y/B x, y, z right-handed Cartesian coordinates (m) Z0 amplitude of vibration of base plate (m) zb displacement of base plate (m) zt displacement of top disk (m) Greek Symbols ?R step-size for R ?T step-size for T (rad) ?h amplitude of oscillation of squeeze film at a steady state epsilon1 excursion ratio epsilon10 permittivity of free space (F?m?1) ? polytropic coefficient ? angular coordinate in cylindrical polar coordinates (rad) xvi ? bearing number ? mean free path (m) ? viscosity (Pa?s) ?eff effective viscosity (Pa?s) ? Poisson?s Ratio ? density (kg?m?3) ? squeeze number based on initial film height ?? squeeze number based on mean film height ?XP, ?Y P pressure flow factors in x and y direction ? angular velocity (rad?s?1), 2pif Subscripts: cont contact between rough surfaces i nodal value in radial direction j nodal value in time n nominal or apparent value xvii Chapter 1 Introduction Research in the field of tribology, the science and technology of friction, wear and lubrication, has been continuously improving the performance of mechanical systems ever since the industrial revolution. A British government report (the ?Jost Report?) in 1966 estimated a potential savings of ? 515 million per annum only for the United Kingdom by better application of tribological principles and practices [1]. Application of principles of tribology led to the development of many different types of bearings used for different purposes. Thrust bearings, hydrodynamic bearings, hydrostatic bearings, rolling element bearings, etc. are widely used as means to reduce the frictional losses in mechanical systems based on the selection criteria. The selection criteria include speed, load, life, maintenance, space requirements and environmental conditions etc. The largely underutilized squeeze film effect has a potential for use as a means to lubricate surfaces by creating squeeze film bearings. Applications of such squeeze film bearings can be used in read/write heads in hard disk drives, manufacturing processes, vibrating machinery, low-speed applications and hydrodynamic bearing start up and shut down. In this research, the thin gas squeeze film bearings are studied extensively. Both numerical and experimental results confirm that squeeze film bearings can be used as means for lubrication. Micro-scale bearing surfaces are fabricated to study ultra-thin squeeze films for lubrication of miniaturized mechanical systems. 1 In Chapter 2 of this thesis, a review of the squeeze film effect with the perspective of lubrication and damping is presented. The various lubrication regimes are described. Hydrodynamic lubrication as well as squeeze film lubrication are defined. Physics and fundamentals of the squeeze film effect are explained. Incompressible and compressible squeeze film bearings, with their governing equations, are reviewed. The latter part of chapter 2 gives a background of squeeze film damping. It gives a concise overview of the cut-off frequency, squeeze film damping and spring forces. This is followed by a review of ultra-thin squeeze film bearings where gas rarefaction effects are significant. In Chapter 3, all the research objectives as well as the specific goals pertaining to these objectives are stated. Chapter 4 is divided into two sections, namely Thin and Ultra-thin squeeze film bear- ings. Each section covers subsections such as formulation of coupled dynamics (the equation of motion and the Reynolds equation for the bearing), numerical scheme to solve the dy- namics, followed by the results of the numerical investigation. Chapter 5 explains all the observations made during the measurements of thin and ultra-thin squeeze film bearings. Here, experimental results are compared with the simula- tion results. Chapter 6 summarizes the thesis. In summary, a thorough study was conducted on the squeeze film bearings for their use as a potential means to lubricate surfaces. 2 Chapter 2 Background 2.1 Introduction This chapter discusses in detail the different types of lubrication regimes. The phe- nomenon of squeeze film effect with the perspective of lubrication is then described. In- compressible and compressible squeeze film bearings with their governing equations are reviewed. Then, the squeeze film damping phenomenon and its cut-off frequency are ex- plained. Lastly, ultra-thin (nano-scale) squeeze film bearings including effects due to molec- ular dynamics are studied. 2.2 Lubrication ?Lubrication is an application of a lubricant between two surfaces in relative motion for the purpose of reducing friction and wear or other forms of surface deterioration? [2]. The lubricant is usually a fluid, but in some cases it can be a solid such as a powder. Lubrication is broadly classified into fluid-film, boundary and mixed regimes (see Fig. 2.1). In fluid- film lubrication, bearing surfaces are completely separated by either a liquid or a gaseous lubricating film [3]. If the loads are high or speeds are low then the contact between high or tall asperities is likely to occur. This is a boundary lubrication regime where a suitable molecular layer of lubricant covers the high asperities. Hence, metal welding due to adhesion 3 is avoided [3]. The lubrication regime between boundary and fluid-film is categorized as mixed or partial lubrication. In the mixed lubrication regime, effects due to both, boundary and fluid-film lubrication are observed [3]. In fluid-film lubrication, a thin fluid film between Lubrication Fluid-Film Mixed Boundary Hydrodynamic Hydrostatic Elastohydrodynamic Sliding Squeeze film Figure 2.1: Classification of lubrication bearing surfaces is obtained by either hydrostatic or hydrodynamic action. Hydrostatic lubrication is a phenomenon of maintaining a lubricating film by external means; whereas, hydrodynamic lubrication is self-acting. In hydrodynamic lubrication, positive film pressure between conformal surfaces is developed due to relative motion and fluid viscosity [3]. The topic of interest here is squeeze film lubrication, which is a type of hydrodynamic lubrication 4 where a lubricating film is developed due to relative normal motion and fluid viscosity. Elastohydrodynamic lubrication is a form of hydrodynamic lubrication where lubricating surfaces are elastically deformable [3]. 2.3 Squeeze Film Effect The term ?squeeze film? defines a fluid film contained between two conformal, moving surfaces with velocities of the surfaces normal to the planes of the containment [4]. If the bearing surfaces approach each other then the motion is termed as ?positive squeeze?. Con- versely, if the bearing surfaces move apart then the motion is termed as ?negative squeeze? [4]. A relative normal motion between two parallel surfaces can produce a squeeze film which can completely separate the surfaces and contribute to lubrication. This phenomenon is known as the ?squeeze film effect? [3]. The load-carrying capacity results from the fact that a viscous flow cannot be squeezed out of the gap without any delay; therefore, providing a cushioning effect and the film equilibrium is established through a balance between viscous flow forces and compressibility effects [5]. Thus, the flow of fluid at the boundary is approximately reduced to zero due to high viscous forces resulting from alternate compression and decompression of the fluid [6]. Alternate compression and decompression produces a steady-state film pressure which oscillates about its mean value [6]. The average steady-state film pressure is greater than the atmospheric pressure over one cycle (T to T+2pi) and thus provides the squeeze film lift and lubrication [6]. Applications of the squeeze film effect are clutch packs in automotive 5 transmission, engine piston pin bearings, human hip and knee joints, damper films for jet engine ball bearings and piston rings [7]. The dynamics of squeeze film is coupled as it includes both the equation of motion for squeeze film bearing and the Reynolds equation. Here, the Reynolds equation governs the generated fluid pressure. The general form of the Reynolds equation is given by [3] ? ?x parenleftBigg ?h3 12? ?p ?x parenrightBigg + ??y parenleftBigg ?h3 12? ?p ?y parenrightBigg = ??x parenleftbigg?h(u x+u?x) 2 parenrightbigg + ??y ? ??h parenleftBig uy+u?y parenrightBig 2 ? ?+?(?h)?t (2.1) Here, h is the squeeze film height and ? is the viscosity of the fluid. The time dependent term ?(?h)?t is known as the ?squeeze term? as it represents squeezing motion of the fluid. Here, ux, uy and u?x, u?y are surface velocity components of bottom and top surfaces in x and y direction, respectively. 2.4 Incompressible Squeeze Film Bearings In incompressible squeeze film bearings, the lubricant is a liquid and its density is assumed to be constant in the operating range. As per Hamrock [3], when two surfaces approach each other, it takes a finite amount of time to squeeze out the fluid, and this action provides a lubricating effect. It is also interesting to note that it takes an infinite amount of time to theoretically squeeze out all the fluid. For an incompressible fluid, viscosity along with density is assumed to be constant in the Reynolds equation [3]. Also, if 6 only normal motion is considered and sliding velocities are zero then the Reynolds equation in rectangular coordinates is given as [3] ? ?x parenleftbigg h3?p?x parenrightbigg + ??y parenleftbigg h3?p?y parenrightbigg =12??h?t (2.2) Eq. (2.2) in cylindrical-polar coordinates is expressed as ? ?r parenleftbigg rh3?p?r parenrightbigg +1r ??? parenleftbigg h3?p?? parenrightbigg =12?r?h?t (2.3) The Reynolds equation given in the form of Eqs. (2.2) and (2.3) can be analytically solved for pressure, film thickness and finite squeeze time (i.e. the amount of time for the film to be squeezed out). Hamrock [3] provides analytical expressions for pressure, film thickness and finite squeeze time for various geometries such as parallel-surface bearings with infinite width, journal bearings with no rotation, a parallel circular plate approaching a plane surface and a long cylinder near plane. As per Hamrock [3], the parallel film shape produces the largest normal load-carrying capacity. 2.5 Compressible Squeeze Film Bearings In contrast, for compressible squeeze film bearings, the lubricant used is gaseous (such as ambient air). Langlois [8] was one of the first to extensively study the isothermal gas 7 squeeze films with the assumption of a thin and continuous gas film with a constant viscos- ity. Langlois [8] also assumed that the density of the gas is proportional to the pressure, which means that the gas squeeze film obeys the ideal gas law under isothermal condi- tions. Langlois [8] derived the equation that governs the pressure variation for a thin, flat isothermal gas squeeze film ? ?X parenleftbigg H3P ?P?X parenrightbigg + ??Y parenleftbigg H3P ?P?Y parenrightbigg = ? parenleftbigg ? ?X bracketleftbigPH parenleftbigU x +U?x parenrightbigbracketrightbigparenrightbigg +? parenleftbigg ? ?Y bracketleftBig PH parenleftBig Uy +U?y parenrightBigbracketrightBigparenrightbigg +??PH?T (2.4) Here, ? is the bearing number and ? is the squeeze number. The definitions of ? and ? are ? = 6?BV/patmh02 (2.5) ? = 12?B2?/patmh02 (2.6) Here, B is bearing breadth. The reference velocity, V, is used to obtain normalized Ux, U?x, Uy and U?y (see Nomenclature), where the order of magnitude of these normalized velocities is unity [8]. Likewise, Eq. (2.4) in cylindrical-polar coordinates is given as 8 ? ?R parenleftbigg RH3P ?P?R parenrightbigg + 1R ??? parenleftbigg H3P ?P?? parenrightbigg = ? braceleftbigg ? ?R bracketleftbigRPH parenleftbigU R +U?R parenrightbigbracketrightbigbracerightbigg +? braceleftbigg ? ?? bracketleftbigPH parenleftbigU ? +U?? parenrightbigbracketrightbigbracerightbigg+R??(PH) ?T (2.7) Later, Langlois [8] dealt with the exact solution to squeeze film equations (Eqs. (2.4) and 0 2 4 6 8 10 12 14 16 8 8.5 9 9.5 10 10.5 11 11.5 12 T (rad) hh hm ?h h h=hm(1+??cos(?t)) Figure 2.2: The squeeze film thickness, h, as a function of normalized time, T, (h=hm(1+epsilon1?cos(?t) and epsilon1=?h/hm) 9 (2.7)) by assuming the squeeze film thickness as a function of time (see Fig. 2.2) h = hm (1+epsilon1?cos?t) (2.8) Based on the assumption of a film thickness given by Eq. (2.8), Langlois [8] introduced a perturbation parameter for pressure of the order of epsilon1 in the Reynolds equation. Then, Langlois [8] solved Eq.(2.4) to obtain the squeeze film force (i.e. the force due to the difference between the pressure of the squeeze film and the ambient pressure for a given instant of time). This solution is given for the squeeze film between two flat long parallel plates and two parallel disks. Since the present work considers axisymmetric parallel disks without lateral surface motions, the governing Reynolds equation as per [8] is ? ?R parenleftbigg RH3P ?P?R parenrightbigg = R??(PH)?T (2.9) where ? is as given ? = 12?R02?/patmhm2 (2.10) As per [8], if the squeeze number is very large then the gas between bearing surfaces does not leak, and the squeeze film can be considered as incompressible. At low squeeze 10 numbers, the frequency of squeeze motion is low, and therefore gas leaks out [8]. The squeeze film force between parallel disks given by [8] is F (T) = parenleftBig pipatmR02epsilon1 parenrightBig [?g1 (?)cosT+g2 (?)sinT] (2.11) where, g1 (?)=1? radicalbigg2 ? ? ber??(bei1???ber1??)?bei??(ber1??+bei1??) (ber??)2 +(bei??)2 (2.12) g2 (?)= radicalbigg2 ? ? ber??(ber1??+bei1??)+bei??(bei1???ber1??) (ber??)2 +(bei??)2 (2.13) Eq.(2.11) gives a good estimate of the squeeze film force between parallel disks at a particular instant of time. For compressible squeeze film bearings, Salbu [9] showed that the squeeze film effect can be used to operate bearings in a highly vibrational environment, and also provided analytical equations for bearing load carrying capacity. Salbu [9] assumes that the squeeze film thickness is a known sinusoidal function of time. One disk is held stationary and the other oscillates sinusoidally about a mean film thickness in a direction normal to the surfaces with an amplitude of oscillation, ?h, and frequency, ?. Salbu [9] uses a simplified 11 form of the Reynolds equation (Eq.(2.9)). Then, the boundary conditions for the planar radial squeeze film bearing are assumed as P (R,T = 0)=1 (2.14) i.e. initial pressure between disks is atmospheric. At the outer periphery, P (R = 1,T)=1 (2.15) i.e. the pressure is atmospheric at all times. At equilibrium, the mean positive film force, is equal to the applied load. When ??? , ?the mass content rule? can be imposed on Eq. (2.9) and the following equation can be derived to approximate the mean load carrying capacity [9] Wn= Fnpip atmR02 = ?? ? bracketleftBigg1+ 3 2epsilon1 2 1?epsilon12 bracketrightBigg1/2 ?1 ?? ? (2.16) Salbu [9] numerically modeled Wn as a function of ? for various epsilon1 values and compared it with the asymptotic values of Wn, as given by Eq. (2.16). For ??10, Salbu [9] observed little variation between the numerical and analytical Wn predicted from Eq. (2.16) at the same epsilon1. Thus, Eq. (2.16) may be used to predict Wn for ??10. For ??10, Eq.(2.16) is 12 used to validate the computational simulation results of the current analysis presented in this thesis and will be referred to as Salbu?s Equation. Further work on dynamic gas squeeze film bearing theory was performed by Minikes et al. [10]. In [10], instead of assuming a squeeze film height as a function of time, it is deter- mined by equilibrium of forces. Minikes et al. [10] used a piezoelectrically vibrating disk to levitate another disk for experimental and numerical work. A sinusoidal voltage was applied on the electrodes which gave rise to harmonic deformation of the piezoelectric disk at the excitation frequency. The piezoelectric disk was also statically and dynamically deforming. However, in the present work both disks are considered to be rigid. A similar approach of coupled dynamics can also be found in [11], where the fluid film lubrication forces and seal dynamics were solved simultaneously for noncontacting gas face seals, although the faces were annular and not circular. 2.6 Squeeze Film Damping ?Damping is the element, present in all real systems, which dissipates vibrational en- ergy, usually as heat, and so attenuates the motion? [12]. A squeeze film can also be modeled as a spring-damper system (Fig. 2.3). An early study of squeeze film by Griffin et al. [13] suggests that squeeze film between two parallel plates provides viscous damping action over a certain frequency range. As per Griffin et al. [13], if the displacements to be damped are small (sub micrometer) then squeezing of a thin gas film between two parallel flat surfaces can produce substantial 13 Figure 2.3: Analogy of a squeeze film as a spring-damper system damping forces at very high frequencies. The damping force is proportional to the relative velocity over certain ranges of operation, and this type of damper is termed a viscous damper [13]. Squeeze film damping due to relative axial or tilting motion between two closely spaced plates is analyzed by Griffin et al. [13]. Griffin et al. [13] provides a critical frequency below which the squeeze film acts as a damper and above which it acts as a spring. At the critical frequency, both the damping and spring forces are equal. Analytical expressions are also provided by Griffin et al. [13] for the squeeze film force and critical frequency for special cases of infinitely wide parallel plates, annular parallel plates and parallel disks. The critical frequency for parallel disks is given by [13] ?c= ?hm 2pa 2.07?R02 (2.17) Blech [14] also analyzed squeeze film cut-off frequencies for different geometries and divided the squeeze film force into damping and spring force components. The spring force 14 is greater than the damping force for all frequencies except the cut-off frequency, and below the cut-off frequency damping is comparable to spring action [14]. As per Blech [14], the maximum damping occurs at the cut-off frequency when the spring and damping forces are equal, and above the cut-off frequency, the spring force increases while the damping force decreases with increases in the squeeze number, ?. Blech [14] gives the damping force as a function of the squeeze number, ?, and excursion ratio, epsilon1, between parallel circular disks Fd=? radicalbigg2 ? ? bracketleftbigA c parenleftbigber 1 ???bei 1 ??parenrightbig+B c parenleftbigber 1 ??+bei 1 ??parenrightbigbracketrightbigepsilon1 (2.18) Similarly, the spring force by [14] is Fs=1+ radicalbigg2 ? ? bracketleftbigA c parenleftbigber 1 ??+bei 1 ??parenrightbig+B c parenleftbigber 1 ???bei 1 ??parenrightbigbracketrightbigepsilon1 (2.19) Here, Ac= bei ?? parenleftBig ber2??+bei2?? parenrightBig (2.20) 15 and Bc=? ber ?? parenleftBig ber2??+bei2?? parenrightBig (2.21) The critical frequency for parallel disks is given by [14] as ?c= hm 2pa 1.93?R02 (2.22) For isothermal conditions, Blech [14] (Eq. (2.22)) underestimates the cut-off frequency by 7 % as compared to Griffin et al. [13] (Eq. (2.17)) because Blech [14] assumes one term approximation to the cut-off frequency. A sample cut-off frequency using Eq. (2.17) [13] and assumption of isothermal flow for an experimental result is calculated to be 1377 Hz. For this case (See Apendix C.2), hm is 13.38 ?m and the frequency of oscillation is 800 Hz. Thus, the frequency at which the bearing is operated is less than the cut-off frequency where the spring force is more than the damping force [14]. Similarly, a few more calculations based on the experimental results suggest that in the present work the range of operation of the squeeze film bearing is either below or above the cut-off frequency, and for such cases the spring force is always greater than the damping force [14]. The gas squeeze film stiffness and damping torques on a circular disk oscillating about its diameter were analyzed by Ausman [15]. In [15], the linearized Reynolds equation for small squeeze film motions is solved for pressure between the disks where one disk oscillates in a tilting motion about its diameter. This pressure is then integrated over the surface 16 area to obtain the total squeeze film torque. Then Ausman [15] separates the total squeeze film torque into stiffness and damping components. As per Ausman [15], the torque which opposes the angular deflection is stiffness torque; whereas, the torque which opposes angular rate is damping torque. The gas damping is observed as viscous friction of the gas as it flows in and out between the disks, and gas stiffness is observed as compressibility of a trapped gas between the disks [15]. Ausman[15] concludes that at higher frequencies, the gas is trapped and does not leak, resulting in higher compressibility. This means that higher frequencies produce higher stiffness torque, and at lower frequencies, gas has more than sufficient time to flow in and out, resulting in higher damping torque[15]. Etsion [16] analyzed squeeze film effects in liquid lubricated radial face seals and ob- tained damping coefficients. Green et al. [17] calculated dynamic damping and stiffness coefficients of the fluid films in mechanical face seals, considering squeeze film effects along with hydrostatic and hydrodynamic effects. Work specific to compressible squeeze film damping was done by Blech [18] for annular squeeze-film plates in relative motion. Re- search into the effect of squeeze film damping is also currently prominent in the design of micro-electro mechanical systems (MEMS) and microstructures ([19]-[26]). Some of this work is discussed in detail in the next section. 17 2.7 Micro-Scale Squeeze Film Bearings and Effects Due to Molecular Dynam- ics Micro-Electro-Mechanical Systems (MEMS) are miniature systems used to combine electro-mechanical functions with dimensions varying from a micrometer to a millimeter. Due to the micrometer size, lubrication in MEMS becomes a critical design parameter and design and selection of MEMS bearings is a challenge for researchers. Usage of liquid lubricant in MEMS leads to a power dissipation problem and so is not a good choice for lubrication [27]. An alternative to oil-based lubricant, gas lubricated bearings can be used in MEMS. Gas bearings can support their loads on pressurized thin gas films. As per Epstein [28], for micromachines such as turbines, gas bearings have several advantages over electromagnetic bearings, such as no temperature limits, high load carrying capability, and relatively simple fabrication. ?The relative load-bearing capability of a gas bearing improves as size decreases since the volume-to-surface area ratio (and thus the inertial load) scales inversely with size? [28]. An example of a fully functional gas film bearing is seen in the MIT Microengine project [29]. Here, a rotor of a micro-gas turbine generator is supported by a journal air bearing. As per Breuer [30], the gas lubrication system in MEMS should be easy to fabricate with sufficient performance and robustness. In another example, a self-acting gas thrust bearing was designed, fabricated and tested on a silicon microturbine [31]. Wong et al. [31] compared a hydrodynamic gas thrust bearing to an existing hydrostatic one, and observed that a hydrodynamic approach is much simpler to fabricate and the required source of pressurized gas can be eliminated. 18 If the high speed relative normal motion is already available in MEMS, then potentially the squeeze film effect can be used as a means to lubricate surfaces in MEMS, and create MEMS bearings. In such cases, there is no special geometry needed as two planar surfaces serve as a bearing, and the system is also maintenance free because ambient air serves as the lubricant. Breuer [30], in a summary on some of the issues of lubrication in MEMS, suggests that fundamental issues of fluids and solid physics such as gas surface interactions, momentum and energy accommodation phenomenon and surface contamination effects are vital parameters for ultra-thin lubrication. For such a small scale, continuum assumptions are not always valid, which can be seen in the following calculations. The RMS roughness, Rq, of MEMS surfaces seems rather smooth. The range of Rq is usually varies from 0.07 to 0.25 nm [32]. For a complete surface separation, film thickness of 10?Rq is a good approx- imation. Thus, a minimum film thickness of 2.5 nm should provide a full film lubrication. The above calculations show that ultra-thin fluid films can be used in MEMS as a means of lubrication. The mean free path of a gas is given as [33] ?=16?5p radicalBigg GTa 2pi (2.23) The mean free path can be estimated for the normal operating conditions (See Table 2.1) in a squeeze film bearing. Using Eq. (2.23) and the assumptions in Table 2.1, the mean free path, ?, is calculated to be 8.7 nm. The mean free path is used to calculate the Knudsen 19 Table 2.1: Assumptions and parameters used to estimate the mean free path Flow Isothermal Air Temperature, Ta 293 K Viscosity of air, ? 1.82?10?5 N?s/m2 Pressure, p 101325 N/m2 Gas Constant, G 8.3144 J?mol?1?K?1 number to further characterize the type of fluid flow. The Knudsen number, Kn is defined as Kn= Mean free path (?)film height (h) (2.24) If the mean free path is very small compared to the characteristic length (i.e. length scale of the problem), then the fluid flow is considered to be in the continuum range. If the mean free path is comparable to the characteristic length then continuum theory of fluid mechanics does not hold well. Typical values of the Knudsen number corresponding to different types of flow are tabulated in Table 2.2. Substituting values of ?=8.7 nm and Table 2.2: Types of flows as per Knudsen number [34] Range of Knudsen Number Type of Flow Kn? 10?3 Continuum Flow 10?3 10, it is observed that the percentage error between Fi and Fn by Salbu?s Eq. is fairly low (less than 7). However, for ?<10, the percentage error increases and over-predicts the load carrying capacity (Fig. 4.10). Thus, Salbu?s Eq. can be used as a basis to calculate load carrying capacity if ? is greater than 10, but if it is less than 10, the percentage error increases significantly and a modified form of Salbu?s Eq. is needed. In order to obtain a semi-analytical equation to extend the range of Salbu?s Eq., it is modified by the curve fitting technique using the percentage error between Fi and Fn as predicted by Salbu?s Eq. Here, the level of certainty of the fit is 95 % and value of R-square is 0.9985. An exponential equation f(?) is fit to the percentage error of the data as a function of ? (see Fig. 4.10) and is given by f (?) = 460?exp(?4.5??)+19?exp(?0.15??) (4.23) Wn= Fnpip atmR02 = parenleftbigg 1 1+f (?) parenrightbigg?? ? bracketleftBigg1+ 3 2epsilon1 2 1?epsilon12 bracketrightBigg1/2 ?1 ?? ? (4.24) A comparison between Fi and Fn using Eq. (4.24) for a large number of points within 0.4 is cleaned as per the B, C, and D silicon wafer cleaning procedure (See Table 5.2 [42]). 65 Table 5.2: Silicon Wafer Cleaning Procedure [42] B Removal of Residual Organic/Ionic Contamination 1 Hold a wafer in a (5:1:1) solution of H2O?NH4OH ?H2O2 for 10 min at a temperature of 75-80 0C 2 Quench the solution under running deionized (DI) water for 1 min 3 Clean a wafer in DI water for 5 min C Hydrous Oxide Removal 1 Immerse a wafer in a (1:50) solution of HF ?H2O for 15 sec 2 Clean a wafer under running DI water for 30 sec D Heavy Metal Clean 1 Hold a wafer in a (6:1:1) solution of H20?HCl?H2O2 for 10 min at a temperature of 75-80 0C 2 Quench the solution under running deionized (DI) water for 1 min 3 Clean a wafer in running DI water for 20 min Hard bake Hard baking of the wafer is done by an Imperial IV microprocessor oven. The wafer is kept inside the oven for 20 minutes at 120 0C. The hard bake process removes any moisture content from the wafer. Hexamethyl disalizane (HMDS) After the hard bake, the wafer is kept in a HMDS chamber for 20 minutes. Here, the wafer surface is primed with HMDS to promote better adhesion to the photoresist. Photoresist application Photoresist is a light-sensitive material to which patterns are first transferred from the photomask. A liquid photoresist (AZ 5214) is applied in a liquid form onto the wafer 66 surface. Then the wafer held on a vacuum chuck undergoes rotation at a speed of 3000 rpm for 40 sec. This process provides a layer of photoresist of even thickness. Soft baking The photoresist-coated wafer is then transferred to a hot plate for soft baking or pre- baking. Soft baking is performed on a hot plate at 105 0C for 1 minute. It improves the adhesion of the photoresist to the wafer and also drives off solvent from the photoresist before the wafer is introduced into the exposure system. Mask Alignment and Exposure In this step, the photo mask is aligned with the surface of the wafer. The wafer is held on a vacuum chuck, and moved into position below the photo mask. The spacing between the photo mask and wafer surface is in the range of 25 to 125 ?m. Following alignment, the photoresist is exposed for 10 seconds with high-intensity ultraviolet light. After this step, the wafer is developed in the AZ 514 developer. Etching Etching is performed to remove material between the circular and square areas so that micro-scale bearing areas are formed on the wafer (in the form of posts). These micro-scale bearing areas can be observed as posts protruding out from the base silicon. Deep reactive ion etching is used to etch out the wafer. The machine used for this process is Surface Technology System?s (STS) advanced silicon etcher. An etch depth of approximately 80 67 400 ? m 20 ? m - 10 ? m 80 ? m c 400 ? m 200 ? m - 100 ? m 80 ? m d 400 ? m 100 ? m - 50 ? m 80 ? m a 400 ? m 100 ? m 50 ? m b 80 ? m Figure 5.13: Schematics of single unit cell (not to scale) 68 ?m is achieved from 120 cycles of Morgan SOS 1 process. The process took 40 minutes to complete 120 cycles. The depth of the etch is checked using a microscope. Photoresist removal Photoresist is stripped off from a wafer using a Matrix machine. Dicing Dicing is used to cut the wafer and separate out the four different samples(Fig. 5.12). The wafer is attached to a plastic film before starting the dicing operation. The plastic film is then supported on a steel rim. Micro Automation?s dicing saw is used. After dicing, four samples of micro bearing surfaces with different sizes and geometries are collected in a petri dish. A schematic of the resulting unit cell can be seen in Fig. 5.13. 5.2.3 Results Measurements of micro-scale bearing samples using LBDMS encountered many prob- lems. In the first approach, the bearing sample was tethered to the rectangular bracket using four small strips of tape. This approach produced the squeeze film lift upon start of the base oscillation. However, after stopping the base oscillation the squeeze film lift did not always return to zero as the weight of the micro-scale bearing sample was supported by the attached four strips. Another method of testing was tried to test the sample. Here, the sample was constrained to translate in horizontal plane. This was achieved by placing small circular posts of tape at the midpoints of each side of the sample so that the circular post 69 and sample have in total four point contacts. This test method also did not work as the friction between the circular posts and the bearing sample was far more and the squeeze film could not generate. In the last test method, the micro bearing sample was not constrained 0 1 2 3 4 5 6?10 ?8 ?6 ?4 ?2 0 2 4 6 8 t (s) h ( ?m) Base oscillation started Base oscillation stopped Figure 5.14: Experimental results of micro-scale bearing by any means. The starting and stopping of base oscillation was performed in approxi- mately 2 seconds. Most of the tests using this method failed because the sample tended to translate in horizontal direction hampering the readings from LBDMS. One good result (See Fig. 5.14) was observed for the bearing configuration d (Fig. 5.13) having diameter of 70 100 ?m and height of 80 ?m. Here, once the base oscillation was started, the squeeze film achieved a steady state, and after stopping the base oscillation, it returned to the initial state (Fig. 5.14). For this test case, the frequency of the base oscillation, f, was 2000 Hz 0 2 4 6 8 10 12 14 16 18 200.975 0.98 0.985 0.99 0.995 1 1.005 1.01 1.015 1.02 1.025 T (rad) P n Figure 5.15: Dimensionless mean pressure, Pn, as a function of normalized time, T, for the ultra-thin squeeze film bearing and the amplitude, Z0, was 0.63 ?m. The mean squeeze film thickness, hm, obtained was 2 ?m. As the weight of the sample is 0.01079 N, the load on one post of bearing surface is 71 47.955 ?N. If the amplitude of oscillation of the squeeze film height is assumed to be 0.63 ?m, then the excursion ratio is 0.63/2 (i.e. 0.315). In order to compare the analytical and experimental results, the squeeze film height is assumed as a known function of time (Eq. (5.2)) in analytical work. h = hm?(1?epsilon1?sin(T)) (5.2) The Reynolds equation (Eq. (4.22)) is solved for pressure with the assumptions as made in Eq. (5.2) (See Appendix E). The pressure trace obtained is shown in Fig. 5.15. The pressure trace for every cycle is the same. However, the pressure profile is not sinusoidal because of the nonlinear pressure-squeeze film thickness relationship [6] as seen in the governing Reynolds equation (Eq. (4.25)). The mean pressure over one cycle results into a load carrying capacity of 40.16 ?N. The % deviation of the theoretical result (from the pressure trace) and the actual load (from weighing the sample) is 16.25. This comparison shows that the experimental results and theoretical results for these micro-scale bearing samples are in good agreement with each other. In future, more comparisons of experimental and simulation results are needed to validate the numerical model. 72 Chapter 6 Summary The tribology of macro-scale systems such as power plants, automobiles, air-craft en- gines etc has been greatly studied in the last century. As the miniaturization of mechanical systems is a need of future technology, it is important to address the issues related to friction, wear and lubrication for such micro-scale mechanical systems. The research under- taken starts with the experimental and analytical study of macro-scale squeeze film bearings which is later extended to study micro-scale squeeze film bearings. The first part of this research is to extensively study the squeeze film bearings where the squeeze films are characterized as thin films (the film thickness is in the range of 9 to 23 ?m). A coupled dynamic model with asperity contact effects is developed to study compressible dynamic squeeze films between disk shaped surfaces, in which, one disk is excited by a sinusoidal displacement. The model presented is general and can be used to investigate dynamic squeeze films with input parameters, frequency (f) and amplitude of vibration (Z0), mass (m), area of contact (A) and the surface properties. From the results of the numerical simulations, a comparison with Fi and Fn from Salbu?s Eq. is made. Based on these comparisons a new semi-analytical equation is developed to predict the load carrying capacity for 0.4???10 using an exponential curve to fit the simulation results. Experimental results disagree quantitatively because of the inability to perfectly model the 73 experimental system. Qualitatively, the experimental results are in fairly good agreement with the numerical results. The second part of this research is to study the micro-scale squeeze film bearings, where the squeeze films are characterized as ultra-thin (using Knudsen number, the film thickness should be less than 8 ?m). A sample of 3 cm X 3 cm patterned with an array of micro bearing areas having 100 ?m diameter is used for an experimental purpose. A single unit cell of this pattern is shown in Fig 5.13. A squeeze film thickness of approximately 2 ?m is measured experimentally when the micro bearing was operated at a frequency of 2000 Hz and an amplitude of 0.63 ?m. To compare with experimental results, the squeeze film thickness is assumed as a known function of time and the discretized Reynolds equation is solved. The deviation of load carrying capacity from the simulation to the actual load is found to be 16 %. These results are in good agreement with each other, although more extensive work is needed to confirm the results. In conclusion, numerical simulations and experiments have been performed to investi- gate the compressible squeeze film bearings. Both experimental and analytical results have shown that the squeeze film bearings have a good potential for lubrication in macro and micro-scale mechanical systems. 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(1998), Introduction to Microelectronic Fabrication, Prentice Hall, Inc., pp 316. [43] Greenwood, J.A. and Williamson, J.B.P. (1966), ?Contact of Nominally Flat Surfaces,? Proc. R. Soc. London, 295, pp 300-319. [44] McCool, J.I. (1987), ?Relating Profile Instrument Measurements to the Functional Performance of Rough Surfaces,? ASME J. Tribol., 109, 2, pp 264-270. [45] Front, I. (1990), ?The Effects of Closing Force and Surface Roughness on Leakage in Radial Face Seals,? MS Thesis,Technion, Israel Institute of Technology, Israel. [46] Horton, B.D. (2004), ?Magnetic Head Flyability on Patterned Media,? MS Thesis, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technol- ogy, Atlanta, GA. 78 Appendices 79 Appendix A Contact Force By fitting equations to finite element results, Jackson and Green [40] and [41] provide the following equations to predict the elastic perfectly-plastic contact of a sphere and a rigid flat. P?F is a ratio of contact load to critical contact load, Pc. For 0??????t P?F = (??)3/2 (A.1) where, ?? is the ratio of penetration or indentation depth between spherical asperities (?) to the critical interference (?c) and ??t is the value that defines the effective transition from elastic to plastic behavior of ??. For Jackson and Green [40], ?? is 1.9. For ??t??? P?F = bracketleftbigg exp parenleftbigg ?14 (??)5/12 parenrightbiggbracketrightbigg (??)3/2 +4HGCS y bracketleftbigg exp parenleftbigg ? 125 (??)5/9 parenrightbiggbracketrightbigg (??)?AE (A.2) where, HG Sy = 2.84 ? ?1?exp parenleftBigg ?0.82 parenleftBigg piCey 2 ???parenleftbigg ?? ??t parenrightbiggB/2parenrightBiggparenrightBigg0.7? ? (A.3) In Eq. (A.3), HG is the limiting average contact pressure, Sy is yield strength and ey is uniaxial yield strain (ratio of yield strength to equivalent elastic modulus). 80 The critical interference to cause initial yielding, ?c, is derived independently of the hardness, to be ?c = parenleftbiggpi?C?S y 2E? parenrightbigg2 R (A.4) where, R is the radius of the hemispherical asperity and E? is the equivalent elastic modulus. B and C are functions of the material properties given as B = 0.14?exp(23ey) (A.5) C = 1.295?exp(0.736?) (A.6) This model then assumes that the individual asperity contact between rough surfaces can be approximated by hemispherical contact with a rigid flat. Then, statistical relation- ships from Greenwood and Williamson [43] are used to model an entire surface of asperities with a range of heights described by a Gaussian distribution, G(z). These statistical equa- tions are given as Fcont = ?An? integraldisplay d PF(z ?d)G(z)dz (A.7) where, the average asperity radius of curvature, R, and the asperity surface density, ?, are needed to model asperity contact and are obtained from a profilometer produced surface profile using the methods outlined in McCool [44]. The distance between the surfaces can 81 be described in two ways: (1) the distance between the mean of the surface heights, h, and (2) the distance between the mean of the surface asperities or peaks, d. These values of h and d are related by h = d+ys (A.8) The value of ys is derived by Front [45] and given as ys = 0.045944?R (A.9) where, ? is the area density of the asperities. Eq. (A.7) is then numerically integrated to predict Fcont as a function of h. The surface profile of one of the rough bearing surfaces is used in the work shown in Fig. A.1. Dimensionless contact load for the surface is plotted against dimensionless mean separation (See Fig. A.2). An exponential fit to the data in Fig. A.2 is obtained. The resulting fit, Eq. (A.10) is then included in the numerical simulation to predict the contact force. Fcont = parenleftbigg ?9.98?exp parenleftbigg ?3.621? h? parenrightbigg +9.824?exp parenleftbigg ?3.595? h? parenrightbiggparenrightbigg ?AE? (A.10) Here, the goodness of fit is Sum of squares due to error, SSE= 7.586e-008 The ratio of the sum of squares of the regression, R-square= 0.9988 82 0 50 100 150 200 250 300 350 400 450 500?0.3 ?0.25 ?0.2 ?0.15 ?0.1 ?0.05 0 0.05 0.1 0.15 0.2 Sampling length (?m) Surface asperity height ( ?m) Figure A.1: Surface profile of a rough bearing surface 83 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 60 0.5 1 1.5 2 2.5 3 x 10 ?3 Dimensionless mean separation, h/Rq Dimensionless load, F cont /(A nE ? ) Figure A.2: Dimensionless contact load as a function of dimensionless mean surface sepa- ration 84 Adjusted R-square= 0.9988 Root mean squared error, RMSE= 1.967e-005 85 Appendix B C-program to solve the coupled dynamics for thin squeeze films include include include include include define MPI 3.1415926535897932385E0 FILE *f1; FILE *f2; FILE *f3; FILE *f4; double p[17][2]; // 2-D array for pressure double meanpressure(double h1,double sigma, double p[][2],double R[],double Rst,double tst,double h[]); main() /*********************All Variable Declaration**************************/ double t; // time double f; // frquency in Hz double w; // frequency in radians double Rst; // Step-size for R double h[2]; double hdot[2]; // Derivative of Height double Mult=0; //Dummy variable double tst; // Time step double Ro=0; // Radius of circular area (i.e. Area of contact) double visc; // Vissinity of the oil at T=293 double R[17]; //1-D array for Radius double Rinv[17]; double pmean=0; //Mean pressure double pa=0; //atmospheric pressure double g=9.81; //accn due to gravity double E=0; double F=0; //Dummy Variable double Aml=2.0*pow(10,-6); // Amlitude of the Shaker double m=7*pow(10,-3);; // Mass of the levitating plate double Ar; // Area of Contact 86 double sig=0.17*pow(10,-6); double CntFr=0; double sigma=0; double YM=0; double Dum1=0; double Dum2=0; double Dum3=0; double Dum4=0; double tstDum2=0; /********Variables Used for Runge-Kutta********/ double K11=0; double K12=0; double K21=0; double K22=0; double K31=0; double K32=0; double K41=0; double K42=0; /********Variables Used for Runge-Kutta********/ double K1=0; double K2=0; double K=0; double D1=1; double D2=0; double D3=0; double ho=0; double h1=0; double hdt=0; double htst; double qtst; double C1=0; double C2=0; double C3=0; double C4=0; double C5=0; double x=0; /****************Assignment of Values********************/ f=1500; w=2*MPI*f; visc=1.76/100000; ho=30*5.554*sig; Ro=9.0*pow(10,-3); 87 pa=101325; sigma=(12*visc*w*Ro*Ro)/(pa*ho*ho); Ar=MPI*Ro*Ro; YM=57.67*pow(10,9); /************Dummy Variables ********************/ Dum1=YM*Ar; Dum2=1/(w*w*ho); Dum3=w*w*Aml; Dum4=(pa/m)*Ar; /**********Step Sizes *************/ Rst=1/16.0; tst=0.005; tstDum2=tst*Dum2; htst=tst/2; qtst=tst/4; /************ Initial Conditions *****************/ t=0; h[0]=1; hdot[0]=0; pmean=1; int k=0; int j=0; /************ Assignment of Valuesof R @ different node points*******/ R[0]=0; for(k=0;k<16;k++) /***************Mean Pressure ***********************/ { R[k+1]=R[k]+Rst; } /***************Assignment of Valuesof R @ Ends Here ***********/ /******Assignment for pressure at time t=0 at all the radius is 1*******/ for(k=0;k<=16;k++) { p[k][0]=1; } /*********Assignment for pressure for initial guess **************/ for(k=0;k<=16;k++) { p[k][1]=1; } /*******************Assignment of Boundary Conditions ***********/ p[16][1]=1; // i is for radius // // and j is for time // 88 x=(h[0]*ho)/sig; CntFr=(-9.98*exp(-3.621*x)+9.824*exp(-3.595*x))*Dum1; printf(? f1 = fopen (?Height.txt?, ?wt?); /****3****/ f2 = fopen (?Hdot?, ?wt?); /****3****/ f3 = fopen (?MeanPr?, ?wt?); /****3****/ f4 = fopen (?Time?, ?wt?); /****3****/ for (int j=0;j<200000000;j++) { /******************* RK1 *************************/ if(h[0]<2) { x=(h[0]*ho)/sig; CntFr=(-9.98*exp(-3.621*x)+9.824*exp(-3.595*x))*Dum1; } else { CntFr=0; } K11=tst*hdot[0]; K12=tstDum2*(Dum3*sin(t)-0.1*Dum3*sin(7*t)+ (CntFr/m)+(pmean-1)*Dum4-9.810007193613373); /******************* RK1 *************************/ /**************H and HDOT After RK1**********************/ h1=h[0]+0.5*K11; hdt=hdot[0]+0.5*K12; Contact Force if(h1<2) { x=(h1*ho)/sig; CntFr=(-9.98*exp(-3.621*x)+9.824*exp(-3.595*x))*Dum1; } else { CntFr=0; } /******************Mean Pressure ***********************/ pmean=meanpressure(h1,sigma,p,R,Rst,htst,h); /*******************RK2*********************************/ t=t+htst; K21=tst*(hdot[0]+0.5*K12); K22=tstDum2*(Dum3*sin(t)-0.1*Dum3*sin(7*t)+ (CntFr/m)+(pmean-1)*Dum4- 9.810007193613373); h1=h[0]+0.5*K21; 89 hdt=hdot[0]+0.5*K22; if(h1<2) { x=(h1*ho)/sig; CntFr=(-9.98*exp(-3.621*x)+9.824*exp(-3.595*x))*Dum1; } else { CntFr=0; } pmean=meanpressure(h1,sigma,p,R,Rst,htst,h); /*******************RK3*************************/ K31=tst*(hdot[0]+0.5*K22); K32=tstDum2*(Dum3*sin(t)-0.1*Dum3*sin(7*t)+ (CntFr/m)+(pmean-1)*Dum4- 9.810007193613373); /*******************RK3*************************/ h1=h[0]+K31; hdt=hdot[0]+K32; if(h1<2) { x=(h1*ho)/sig; CntFr=(-9.98*exp(-3.621*x)+9.824*exp(-3.595*x))*Dum1; } else { CntFr=0; } pmean=meanpressure(h1,sigma,p,R,Rst,tst,h); /************RK4******************/ t=t+htst; K41=tst*(hdot[0]+K32); K42=tstDum2*(Dum3*sin(t)-0.1*Dum3*sin(7*t)+ (CntFr/m)+(pmean-1)*Dum4- 9.810007193613373); h[1]=h[0]+0.16666667*(K11+2*K21+2*K31+K41); hdot[1]=hdot[0]+0.16666667*(K12+2*K22+2*K32+K42); /**************Mean Pressure *******************/ h1=h[1]; pmean=meanpressure(h1,sigma,p,R,Rst,tst,h); h[0]=h[1]; hdot[0]=hdot[1]; for(int i=0;i<16;i++) { 90 p[i][0]=p[i][1]; } if(j { fprintf(f1,? fprintf(f2,? fprintf(f3,? fprintf(f4,? } } fclose(f1); fclose(f2); fclose(f3); fclose(f4); } fprintf (f1, ? doublemeanpressure(doubleh1,doublesigma, doublep[][2],doubleR[],doubleRst,double tst,double h[]) { double h3sig,A,B,C,D,R1,R2,P1,P2,pMean; double error[17]; double M[17]; double err=0; int s; h3sig=(pow(h1,3))/(sigma); B=h1/tst; for(s=0;s<=16;s++) { M[s]=p[s][1]; } /****************Assignment of Dummy Variable ******************/ do { for(s=15;s>0;s?) { R1=(R[s+1]+R[s])/2; R2=(R[s-1]+R[s])/2; A=(h3sig*(R1+R2))/(2*Rst*R[s]); C=((-p[s][0]*h[0])/tst)-((h3sig)/(2*Rst*R[s]))* (R1*pow(p[s+1][1],2)+R2*pow(p[s-1][1],2)); p[s][1]=(-B+sqrt(B*B-4*A*C))/(2*A); if (s==1) { 91 p[0][1]=p[1][1]; } } for(s=15;s>0;s?) { D=p[s][1]; p[s][1]=1.1*p[s][1]-0.1*M[s]; error[s]=fabs((p[s][1]-M[s])/p[s][1]); M[s]=D; } p[0][1]=p[1][1]; err=0; for(s=15;s>0;s?) { err=err+error[s]; } err=err/(15); /// Average error } while(err > 0.000001); P1=0; P2=0; for(s=1;s<=15;s=s+2) { P1=P1+p[s][1]; } for(s=2;s<=14;s=s+2) { P2=P2+p[s][1]; } pMean=(p[0][1]+4*P1+2*P2+p[16][1])/48; return pMean; } 92 Appendix C Tables of Experimental and Simulation Results C.1 Configuration 1 Frequency Amplitude Simulation hm Experimental hm (Hz) (?m) (?m) (?m) 800 6.1792 143.2729 0.9447 800 6.669 147.0127 1.2371 800 8.9486 162.775 2.5657 1050 2.4304 6.0489 3.1891 1050 3.617 106.1366 12.0375 1050 4.936 123.2343 21.4303 1050 5.9116 134.5224 23.4826 1300 2.6374 76.4061 6.5227 1300 2.9202 81.0329 7.6587 1300 4.598 107.2562 16.8267 93 C.2 Configuration 2 Frequency 800 Hz Amplitude (?m) 7.4 7.6 7.8 8.0 8.2 Test 1 13.4707 14.269 15.6517 16.274 16.1508 Test 2 13.0979 14.6449 15.0356 15.8266 16.0957 Test 3 13.2905 13.9359 15.6428 15.3388 16.1507 Test 4 13.0951 13.6214 15.0053 15.6878 16.0518 Test 5 13.5354 14.617 14.988 15.7182 16.0818 Test 6 13.9357 15.3383 15.6701 15.6848 16.3287 Test 7 13.445 14.469 15.4086 15.6693 16.0388 Test 8 13.1422 14.3621 15.6795 15.7049 16.5886 Test 9 13.4914 14.8486 15.1449 15.4356 15.8794 Test 10 13.3572 14.8437 15.2333 15.5237 15.508 Average (?m) 13.38611 14.49499 15.34598 15.68637 16.08743 Simulation (?m) DNC1 DNC DNC 57.3054 60.1417 Frequency 900 Hz Amplitude (?m) 5.8 6 6.2 6.4 6.6 Test 1 11.336 11.7322 12.2815 13.0025 13.9145 Test 2 10.6783 11.7956 11.8943 12.5222 13.2427 Test 3 11.01 12.0665 12.23 12.8047 13.263 Test 4 10.8241 11.8172 11.999 12.7467 13.1827 Test 5 11.3899 11.2529 11.8836 13.0562 13.414 Test 6 11.1745 11.6384 12.3865 12.9316 13.8134 Test 7 11.1602 11.7326 12.3004 12.8417 13.5801 Test 8 10.6472 11.1909 12.4745 12.6746 13.4392 Test 9 11.1084 11.1556 12.2482 12.6892 13.2696 Test 10 10.99 11.2763 12.5702 12.896 13.8474 Average (?m) 11.03186 11.56582 12.22682 12.81654 13.49666 Simulation (?m) DNC 55.5434 58.0158 60.4626 62.4467 1 DNC -Did Not Converge 94 Frequency 1000 Hz Amplitude (?m) 4.6 4.8 5.0 5.2 5.4 Test 1 11.0867 11.262 11.9811 12.5825 12.6396 Test 2 11.1729 11.1629 12.1185 12.72 12.6326 Test 3 11.264 12.0024 12.2013 12.4823 13.5024 Test 4 10.945 11.9393 12.2688 12.1882 13.1681 Test 5 11.0825 11.485 12.1646 13.0589 12.8527 Test 6 10.958 11.7505 11.9228 12.9179 12.8413 Test 7 10.6522 12.3604 12.3521 12.4905 14.1083 Test 8 10.7868 11.7528 11.8116 12.1864 12.8677 Test 9 11.2518 11.6818 11.8853 12.2711 12.6816 Test 10 10.9668 11.3539 12.1838 11.9896 13.3451 Average (?m) 11.01667 11.6751 12.08899 12.48874 13.06394 Simulation (?m) DNC 56.4912 59.1097 61.2036 62.9875 Frequency 1500 Hz Amplitude (?m) 1.8 2.0 2.2 2.4 2.6 Test 1 9.9339 10.9988 11.0939 11.6938 12.9752 Test 2 10.0439 10.1946 10.8504 12.5324 12.111 Test 3 8.9149 10.3972 10.8781 11.6999 12.7567 Test 4 8.8607 10.5234 10.7668 11.1444 12.5647 Test 5 8.9149 10.9258 11.3802 11.6934 13.2707 Test 6 10.2578 10.9915 11.0566 11.328 12.8714 Test 7 9.9627 10.8179 11.1325 11.9491 12.9994 Test 8 10.0065 10.7677 11.1432 11.8122 12.9973 Test 9 10.0962 10.6744 11.2106 11.8719 11.9577 Test 10 9.9072 10.7097 11.0775 11.5196 12.8166 Average (?m) 9.68987 10.7001 11.05898 11.72447 12.73207 Simulation (?m) 53.5354 56.0012 58.1313 60.0423 61.7946 95 C.3 Configuration 3 Frequency 800 Hz Amplitude (?m) 6.4 6.6 6.8 7.0 7.2 Test 1 21.4024 21.4089 22.1387 22.7954 22.7595 Test 2 20.9746 21.5593 21.8336 22.7572 23.0541 Test 3 21.2554 21.6139 21.7966 22.5867 22.9858 Test 4 20.9251 21.739 21.7729 22.6405 23.2238 Test 5 20.8396 21.7471 22.0179 22.6409 23.1163 Test 6 21.0984 21.4937 21.9323 22.8155 22.9272 Test 7 21.0307 21.4902 21.8789 22.5575 23.0514 Test 8 20.8029 21.438 22.096 22.4713 23.0452 Test 9 20.8746 21.4432 21.7509 22.4318 23.0638 Test 10 20.8737 21.5169 22.0775 22.5943 23.1871 Average (?m) 21.00774 21.54502 21.92953 22.62911 23.04142 Simulation (?m) 65.592 66.6991 67.7418 68.7306 69.6732 Frequency 900 Hz Amplitude (?m) 5.2 5.4 5.6 5.8 6.0 Test 1 18.7737 20.1916 20.8962 20.8628 21.7042 Test 2 18.8144 20.0742 21.0646 20.8695 21.5064 Test 3 19.0361 19.9377 20.9214 21.19 21.1382 Test 4 19.1751 19.528 20.9238 21.3347 21.2448 Test 5 19.0633 20.0621 20.9489 21.0129 21.7445 Test 6 18.9867 20.0116 20.8519 21.1412 21.3917 Test 7 19.1702 19.5744 20.4802 21.506 21.196 Test 8 19.0511 19.1967 21.1435 21.0589 21.05 Test 9 19.3148 19.4528 20.7809 20.8976 21.1931 Test 10 19.2281 19.8355 20.9035 21.222 21.3466 Average (?m) 19.06135 19.78646 20.89149 21.10956 21.35155 Simulation (?m) 65.4042 66.5021 67.5448 68.5408 69.4961 96 Frequency 1000 Hz Amplitude (?m) 4 4.2 4.4 4.6 4.8 Test 1 20.8198 22.0756 22.7689 23.0927 23.2616 Test 2 20.1229 22.0891 22.4801 22.8036 23.2182 Test 3 20.3533 21.9974 22.4754 22.8771 23.4326 Test 4 20.5557 22.0531 22.5285 22.5587 22.9707 Test 5 20.887 21.7522 22.322 22.7171 23.0604 Test 6 20.6034 22.1179 22.0915 23.1343 23.7415 Test 7 20.6502 22.0388 22.6978 22.7592 23.4185 Test 8 20.498 21.9899 22.8898 22.4465 23.3308 Test 9 20.6819 22.1545 22.6626 22.5107 23.8755 Test 10 20.8721 21.6264 22.6115 22.9328 23.7882 Average (?m) 20.60443 21.98949 22.55281 22.78327 23.4098 Simulation (?m) 62.8183 64.0531 65.2203 66.331 67.3937 Frequency 1500 Hz Amplitude (?m) 1.8 2.0 2.2 2.4 2.6 Test 1 16.2606 16.4348 16.944 17.1475 17.508 Test 2 16.4536 16.7723 16.9895 17.1686 17.2069 Test 3 16.2021 16.406 16.9542 17.2596 17.7354 Test 4 16.3595 16.9441 17.0921 17.2073 17.3995 Test 5 16.4152 16.5749 16.9935 17.4292 17.4173 Test 6 16.145 16.484 16.9261 17.1501 17.5845 Test 7 16.301 16.3783 16.9782 17.3174 17.7091 Test 8 16.2998 16.3724 16.9907 17.02 17.7404 Test 9 16.114 16.678 17.0715 17.2938 17.7186 Test 10 16.1834 16.5505 16.9701 17.2764 17.7282 Average (?m) 16.27342 16.55953 16.99099 17.22699 17.57479 Simulation (?m) 54.5747 56.4424 58.2134 59.8992 61.5094 97 Appendix D Calibration of Capacitance Sensor Equation for calibrating physical capacitance, C to the mean squeeze film thickness, hm in ?m is hm = A?epsilon10 ?k1.853?C1.706 +0.0784 (D.1) where, physical capacitance, C in F is given by C = ?Rst ?(?1+ 1 2.511?(VRexp)4 +6.011?(VRexp)3 ?4.72?(VRexp)2 +2.29?(VRexp)?0.1417) (D.2) and VRexp= experimental voltage ratio as recorded from LabView ?= frequency of AC voltage, Vin (2?pi?2000 rad) Rst= resistor used in the electric circuit (33 k?) A= area of contact (m2) epsilon10= permittivity of free space (8.85E-6 F??m?1) k= dielectric constant of air (1) 98 Calibration Procedure 1. Read the experimental voltage, Vo/p using LabView. 2. Calculate the experimental voltage ratio. VRexp = Rms Vo/pRms V in (D.3) 3. Experimental voltage ratio is calibrated in terms of the physical voltage ratio. Stan- dard capacitors are utilized for this calibration. For each standard capacitor, the experimental voltage ratio is calculated. Then, using these standard capacitor values and Eq. (D.5), physical voltage ratios are calculated. As, VRphys = RR+ 1 j?C (D.4) Thus, VRphys2 = ? 2C2R2 1+?2C2R2 +2?RC (D.5) Using a curve fitting technique, a polyfit is obtained for VRphys in terms of VRexp and is given by Eq. (D.6). Thus, the experimental voltage ratio is converted to the 99 physical voltage ratio using the 4th order polynomial (Eq.(D.6)). VRphys = 2.511?(VRexp)4 +6.011?(VRexp)3 ?4.72?(VRexp)2 + 2.29?(VRexp)?0.1417 (D.6) 4. Capacitance due to parallel plate can be calculated using the physical voltage ratio. A quadratic equation in terms of C is written as bracketleftBiggparenleftBigg 1? 1VR phys2 parenrightBigg ?2Rst2 bracketrightBigg C2 +[2?Rst]C +1 = 0 (D.7) Here, ?=2pi?2000 rad Rst=33 k? and VRphys is calculated as per step 3. Solving Eq. (D.7) and taking positive root, C is calculated as C = ?Rst ?(?1+ 1VR phys ) (D.8) 5. Mylar shims of thickness 38.1 ?m are used to calibrate the squeeze film thickness to the capacitance. The two bearing surfaces are separated using mylar shims so that 99.7 percent volume between the two plates is air and 0.3 percent volume is mylar. Thus, two surfaces form two capacitors in parallel, one due to air and the other due 100 to mylar. Capacitance due to each dielectric medium is calculated using C = Aepsilon10kd (D.9) Here, k for air =1 and k for mylar = 3.2. The total capacitance is the sum of capacitance due to air and mylar. This theoretical capacitance is then calibrated in terms of experimental capacitance (Eq. D.8). This results in a power function which represents the above calibration. Ccal = 1.853?C1.706 +0.0784 (D.10) Here, the goodness of fit is Variance Reduction= 99.99 S/(N - P) : 0.00002754 RMS (Y - Ycalc) : 0.00262 6. The mean squeeze film height is calculated using Eq. (D.11) as hm = Aepsilon10kC cal (D.11) 101 Appendix E Computer program to solve the dynamics for ultra-thin squeeze films import java.io.*; import java.math.*; class Reynoldsequation { public static void main(String args[]) { /*************All Variable Declaration****************/ double Rst; //Step-size for R double[][] p=new double[17][2]; // 2-D array for pressure double[] h=new double[2]; double tst; // Time step double[] R=new double[17]; //1-D array for Radius double[] M=new double[17]; double[] Rinv=new double[17]; double[] error=new double[17]; double err=0; //Mean pressure double A=0; //Dummy Variable double B=0; //Dummy Variable double C=0; //Dummy Variable double D=0; double P1=0; //Dummy Variable double P2=0; //Dummy Variable double pmean=1; double sig=0; double sig1=0; double R1=0; double R2=0; double K1=0; double K2=0; double h3sig; double visc=1.8*Math.pow(10,-5); double visc1=0; double t; 102 double N=0; double Exc=0.315; int n=0; double KN=0; double hm=2*Math.pow(10,-6); double ME=1.1467*Math.pow(10,-3); /*************Assignment of Values*********************/ h[0]=1; sig=929.68; /**********Step Sizes *************/ tst=0.0001; /************ Initial Conditions *****************/ t=0; err=1; /**************Assignment of Valuesof R @ different node points*********/ R[0]=0; N=16; n=16; Rst=1/N; for(int k=0;k0;i?) { R1=(R[i+1]+R[i])/2; R2=(R[i-1]+R[i])/2; A=(h3sig*(R1+R2))/(2*Rst*R[i]); C=((-p[i][0]*h[0])/tst)-((h3sig)/(2*Rst*R[i]))* (R1*Math.pow(p[i+1][1],2)+R2*Math.pow(p[i-1][1],2)); 104 p[i][1]=(-B+Math.sqrt(B*B-4*A*C))/(2*A); if (i==1) { p[0][1]=p[1][1]; } } for(int i=15;i>0;i?) { D=p[i][1]; p[i][1]=1.1*p[i][1]-0.1*M[i]; error[i]=Math.abs((p[i][1]-M[i])/p[i][1]); M[i]=D; } p[0][1]=p[1][1]; err=0; for(int i=15;i>0;i?) { err=err+error[i]; } err=err/(n-1); /// Average error } while(err > 0.0000001); for(int i=0;i