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High Temperature High Power SiC Devices Packaging Processes and Materials Development
(2008-09-09)
Silicon power devices have reached their theoretical limits in terms of higher temperature and higher power operation by virtue of the physical properties of the material. SiC has been identified as a material with the ...
A Robust Software Radio Testset for Research and Laboratory Instruction
(2008-09-09)
Since the mid-1990s, communication technology has advanced dramatically, making it possible to achieve high data rates for both enterprise and individual users. The rapid and widespread deployment of wireless communications ...
Efforts Toward Design, Development and Implementation of an Integrated and Flexible Support System for Calibration of Air Data Attitude Heading Reference Systems
(2008-09-09)
An Air Data Attitude Heading Reference System is a device that provides a modern day Aircraft with altitude, air-speed, attitude, and magnetic parameters. A typical ADAHRS contains a number of tightly integrated sensors ...
High Frequency Noise Modeling and Microscopic Noise Simulation for SiGe HBT and RF CMOS
(2008-09-09)
RF bipolar and CMOS are both important in RFIC applications. Modeling of noise provides
critical information in the design of RF circuits. Unfortunately, available compact models
for both RF bipolar and CMOS, are typically ...
Topics in Multisensor Maneuvering Target Tracking
(2008-09-09)
Tracking uses models of the real environment to estimate the past and present and even predict the future state of a moving object from noisy observations of uncertain origin. In a tracking
scenario the most critical ...
Alternative Techniques for Built-In Self-Test of Field Programmable Gate Arrays
(2008-09-09)
In the Built-In Self-Test method of testing the logic and interconnect resources of the Field Programmable Gate Arrays (FPGAs), configuration time and time to retrieve of the test results dominate the duration of the test. ...
Process Development of Double Bump Flip Chip with Enhanced Reliability and Finite Element Analysis
(2008-09-09)
Flip chip technology has drawn tremendous attention in electronic packaging in recent years due to the advantages it offers, such as better electrical performance, high I/O density and smaller size. However, as package ...
Systematic Characterization and Modeling of Small and Large Signal Performance Of 50 - 200 Ghz SiGe HBTs
(2008-09-09)
Over the last ten years, SiGe BiCMOS technology has become the leading technology in analog circuit design for both wired and wireless telecommunication applications. However, the endless pursuit for high performance is ...
Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications
(2008-09-09)
While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, the exact Composition varies by geographic region, supplier and user. Add to that dissolved copper ...
Design of Direct Digital Frequency Synthesizer for Wireless Applications
(2008-09-09)
Direct Digital Synthesis can be practically defined as a means of generating highly accurate and harmonically pure digital representations of signals. High speed DDS presents an attractive alternative to use of Phase locked ...