Closing the Gap in Electronics Manufacturing Education

Abstract

Abstract

The U.S. electronics manufacturing sector faces an urgent workforce shortage, particularly in integrated circuit (IC) packaging, printed circuit board (PCB) fabrication, and PCB assembly. While the CHIPS and Science Act of 2022 supports semiconductor design and fabrication, it largely overlooks these post-fabrication processes, which are equally vital to supply chain resilience. This dissertation examines the gap between higher education programs and industry workforce needs, with the goal of designing a curriculum that addresses this gap. A mixed-methods study was conducted, incorporating expert interviews, analysis of industry reports, and a survey of manufacturing industry professionals. Results identified gaps in technical coursework, particularly in PCB assembly and surface mount technology, and highlighted a need for integration of soft skills such as communication and teamwork. Correlation and factor analysis indicated that experiential learning, including hands-on labs, real-world projects, and collaborative teamwork, is strongly linked to workforce readiness. Respondents also emphasized the importance of preparing for emerging areas such as additive and flexible manufacturing, artificial intelligence, and sustainable electronics. To address these needs, this study proposes a master’s-level program that blends technical depth with professional competency development. The program includes targeted courses in packaging, PCB fabrication, and assembly, along with modules in emerging technologies and industry-recognized certifications. The program also offers flexible pathways, including a one-year accelerated track and extended 18–24-month options, all of which are supported by hybrid delivery options and industry partnerships. This program’s framework aligns academic programs with industry needs to support the reshoring of U.S. electronics manufacturing.