Browsing Auburn Theses and Dissertations by Title
Now showing items 8245-8264 of 8966
There’s no place like home: University campus-student interaction to promote sense of belonging among first year international students
(2024-03-20)
Acclimating to a new environment can take a mental and emotional toll on anybody; compounding that change in an environment with a cultural change can intensify the toll. This study explores the initial perceptions and ...
Thermal Conductivity Determination of Octadecane and Eicosane near Phase Transition for Solid Specimen Prepared Subject to Controlled Freezing and Explaining the “Anomalous” Measurements in Terms of Solid-Solid Transition
(2018-07-23)
The effects of the freezing time and vacuum oven time (degasification time) associated with processing of two paraffins specimen, i.e. octadecane (C18H38) and eicosane (C20H42) on the temperature-dependent thermal conductivity ...
Thermal Conductivity Enhancment of Solid Eicosane-Based Silver Nanostructure-Enhanced Phase Change Materials for Thermal Energy Storage
(2015-07-29)
In this thesis, thermal conductivity of eicosane-based PCM was enhanced by suspending highly-conductive silver nanoparticles resulting in the formation of nanoparticle-enhanced PCM (NePCM). Eicosane (C20H42) was selected ...
Thermal Conductivity of Nanostructure-Enhanced Phase Change Materials: Measurements for Solid Eicosane-Based Copper Oxide and Carbon Nanotube Colloids and Numerical Modeling of Anomalous Measurements near Phase Transition
(2013-06-25)
In this thesis, thermal conductivity of eicosane-based nanostructure-enhanced phase change materials (NePCM) and modeling of the effectiveness of the widely-used transient hot wire (THW) apparatus near the liquid-solid ...
Thermal Cycling Reliability of Doped SnAgCu Solder Alloys after Long-Term Aging
(2021-04-21)
Eutectic SnPb (Tin-Lead) solder has been used in electronics since early days. This universal
alloy combination was used in all soldering applications because it had good mechanical
and electrical properties and hence ...
Thermal Cycling Reliability of Nickel added Solder Paste for use in Surface Mount Manufacturing
(2010-11-03)
With the ban on lead (Pb) by the European Union (EU), the electronics industry has sought alternatives to replace the long used Sn-Pb solder. Although Sn-Ag-Cu (SAC) alloys with Sn3Ag0.5Cu (SAC 305) have been considered ...
Thermal Diffusion of Dopants in Silicon Carbide
(2012-07-27)
Despite considerable advancement in SiC material and device technology, there are still vital issues to be resolved such as metallization and doping. In SiC, ohmic contacts require high concentration doping. Commonly used ...
Thermal Electrochemical Dynamic Modeling of Sealed Lead Acid Batteries
(2009-08-06)
Limitations to battery technology ranks second as the most vital problem facing the electronic and mechanical engineering industry in the future. The life span and performance of batteries specifically SLI (Starting – ...
Thermal Field Mapping Technique for Friction Stir Process
(2009-12-14)
Friction Stir Welding is a solid state “green” welding method developed by The Welding Institute (UK). An internal thermal mapping instrument has been developed which allows for symmetrical mapping of the thermal fields ...
Thermal Management and Data Archiving in Data Centers
(2016-05-06)
This dissertation is focused on thermal and resource management of data centers. Recognizing that there is the lack of comprehensive benchmarks for thermal management in the context of cluster computing in data centers, ...
Thermal Modeling and Management of Storage Systems
(2014-06-24)
Energy consumption of data storage systems has increased significantly for the past decades. There is an urgent need to build energy-efficient data storage systems. Computing cost of IT facilities and cooling cost of air ...
Thermal Modeling and Simulation of Metals Additive Manufacturing
(2019-12-05)
Additive manufacturing (AM) enables a layer-wise approach to near-net shape fabrication of three-dimensional computer aided designs. In powder-metal-based AM processes, such as directed energy deposition (DED) and laser-powder ...
Thermal Modeling of the Laser-Powder Bed Fusion Process
(2018-07-24)
Parts fabricated using laser-based additive manufacturing (AM) methods, such as laser-powder bed fusion (L-PBF) receive very high, localized heat fluxes from a laser within a purged, shielding gas (i.e. argon) environment ...
Thermal Performance of Ball Grid Arrays and Thin Interface Materials
(2005-08-15)
Current electronic packages exhibit very high and ever increasing power densities. That trend mandates the need for enhanced thermal performance. This study introduces a state of the art apparatus to measure thermal ...
Thermal Segregation: Causes and Effects on In-Place Density and Fatigue Performance of Asphalt Mixtures
(2012-04-17)
Previous research has demonstrated that an excessive loss of mix temperature during hauling and paving operations can cause significant reductions in the mix consistency and therefore, in its ability to be compacted ...
Thermal Stability of Tagatose
(2009-07-06)
Tagatose is a minimally absorbed monosaccharide that has prebiotic properties. To achieve this prebiotic benefit, tagatose in foods and beverages must not be lost during processing. However, data on the thermal stability ...
Thermal-Aware File and Resource Allocation in Data Centers
(2017-12-04)
After addressing the issue of reducing power consumption by computing nodes in data centers, in recent years, computer scientists are focusing on reducing cooling cost of the data centers, thereby making the data centers ...
Thermal-aware Resource Management in Energy Efficient Clusters
(2018-07-25)
There is a pressing need for thermal management in most electronic devices today, ranging from portables to high-performance servers, and it poses barriers to the safe operations of data centers. The goal of thermal ...
Thermal-Mechanical Characterization and Microstructural Evolution of Lead Free Solder Alloys in Harsh Environment Applications
(2021-04-27)
With the emergence of the modern electronic packaging technology over the last few decades, lead free solder alloys have been the primary interconnects material used in electronic packaging industry due to their relatively ...
Thermo-mechanical Reliability Models for Life Prediction of Area Array Electronics in Extreme Environments
(2006-05-15)
The increasing functionality in modern microelectronics requires more complexity in less space and more reliability at lower cost. Demands on miniaturization have lead to the evolution of several types of area array packages ...