Now showing items 1-2 of 2
Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
(2019-12-02) ETD File Embargoed
The most common solder alloy SAC305 has a significant reliability issue especially after aging. In addition to aging, multiple factors can contribute to the early failure of the solder joint. Research has shown that shear ...
Evolution of the Mechanical and Microstructure Properties of SAC Alloys During Thermal Cycling
(2023-04-18) ETD File Embargoed
In real-time applications, solder joints are exposed to thermal and mechanical stresses. As a result, the microstructure evolves, and mechanical characteristics deteriorate, resulting in component failure. Solders have ...