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Die Attach for High Temperature Applications
(2014-12-17)
The energy sector is seeing dynamic growth with advanced oil and gas recovery methods being deployed. Measure-while-drilling (MWD) and downhole production instrumentation is important to maximize production and safety. ...
Aperture Coupled Microstrip Patch Antenna for WIFI, WiMAX, and Radar Applications
(2014-04-25)
The aperture-coupled microstrip patch antenna is presented. The operation frequency
range of antenna is 4.8 - 5.2 GHz. This frequency range is possible due to the use of low
dielectric materials for the patch and microstrip ...
A Dual-Band Metamaterial Antenna
(2014-05-02)
Metamaterials have a wide variety of potential applications in areas such as optics, acoustics and RF design. Split-Ring Resonators (SRR) are fundamental sub-wavelength structures found in metamaterial design. An adaptation ...
Channel State Information Fingerprinting Based Indoor Localization: a Deep Learning Approach
(2015-07-28)
With the fast growing demand of location-based services in indoor environments, indoor positioning based on fingerprinting has attracted a lot of interest due to its high accuracy. In this thesis, we present a novel deep ...
An Experimental Evaluation of the Delta Operator in Digital Control
(2010-07-19)
Interest in digital control systems has been on the rise over recent decades with the ever decreasing cost and increasing performance of microprocessors and the academic advancements in control theory. Although there are ...
Resonant Frequencies in Aviation Platforms
(2015-03-09)
This thesis examines the coupling effects of electromagnetic fields to the interior of aviation platforms during electromagnetic vulnerability (EMV) testing and the potential of resonant frequency field enhancements. ...
Impact of Charge Collection Mechanisms on Single Event Effects in SiGe HBT Circuits
(2009-07-17)
Investigations into single event effect (SEE)
induced charge collection in
Silicon Germanium (SiGe) heterojunction
bipolar transistors (HBT)
are made through three-dimensional (3-D) device simulation.
The transistor ...
Flip Chip and Heat Spreader Attachment Development
(2009-04-09)
Flip chip packages offer many advantages over traditional wire bonding based packages. Flip chip packages have high input/output (I/O) handling capability, better electrical performance and smaller size. Proper package ...
Diagnostic Test Generation for Transition Delay Faults Using a Two-Timeframe ATPG Model
(2015-07-24)
Determining the location and cause of a defect in a faulty circuit plays a vital role in VLSI testing. These are critical factors in boosting product quality and reducing manufacturing costs.
An automatic test generation ...
SPICE model implementation of a quantum phase-slip junction
(2015-07-24)
A quantum phase-slip is a superconducting phenomenon, which is identified as an exact
dual to Josephson tunneling. Therefore, the device known as a quantum phase-slip junction is
expected to be as significant and fundamental ...