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dc.contributor.advisorDean, Robert
dc.contributor.authorMcPherson, Ryan
dc.date.accessioned2010-10-26T21:07:45Z
dc.date.available2010-10-26T21:07:45Z
dc.date.issued2010-10-26T21:07:45Z
dc.identifier.urihttp://hdl.handle.net/10415/2358
dc.description.abstractAs thin, flexible electronics solutions become more robust, their integration into everyday life becomes more likely. With possible applications in wearable electronics, biomedical sensors, or ‘peel and stick’ sensors, the reliability of these ultra-thin packages becomes paramount. Likewise, the density achievable with stacked packages benefits greatly from thinner die stacks. To this end, techniques previously developed have demonstrated packages with die thinned to approximately 20µm. Covered in this work are methods for thinning and packaging silicon die, as well as information on common materials used in these processes. The author's contribution is a fabrication process for embedding ultra-thin (approximately 10µm) silicon die in polyimide substrates. This method is fully illustrated in Chapter 3 and enumerated in the Appendix as a quick reference. Additionally, thermal cycle testing of passive daisy chain assemblies has shown promising reliability data. Packages were mounted in three alignments: flat, concave, and convex, and placed into thermal shock testing. Finally, the author discusses possible applications for this fabrication process, including the fabrication of multi-chip-modules.en
dc.rightsEMBARGO_NOT_AUBURNen
dc.subjectElectrical Engineeringen
dc.titleFlexible, Ultra-Thin, Embedded Die Packagingen
dc.typedissertationen
dc.embargo.lengthNO_RESTRICTIONen_US
dc.embargo.statusNOT_EMBARGOEDen_US


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