Reliability of Solder Attachment Options with Lead Free for 0.4 mm Micro BGA Packages
Type of Degreethesis
DepartmentIndustrial and Systems Engineering
MetadataShow full item record
Electronic Modules have become an integral part in Automobiles. User friendly applications in Automobiles require high reliable electronic components to perform in harsh temperature ranges of -40 C to 165 C. Micro-electronic devices are often manufactured with operating conditions as a priority which is termed as Design for Reliability. This exponential rise in use of electronics results in dramatic increase in the use of electronics modules which fosters the development of use of materials that is very hazardous to human body and environment. Solder joints in electronic packages give mechanical, electrical and thermal support to the overlying integrated circuits. Hence its reliability is also a major concern for the performance of electronic module. BGA (Ball Grid Array) are very common type of surface mount technology packages on electronic modules. In BGA packages, Solder balls are arranged in particular grid patterns which form the interconnection between chip and board resulting in High density Interconnections (HDI). Thus solder attachment reliability is a big concern to the functioning of whole electronic system. Tin-Lead solders were initially used in the electronic industry, but later lead in the solders resulted in Lead poisoning, which was toxic to the human body. Green Electronics is gaining greater attention by the consumers and Environmental Protection Agency (EPA) which includes the elimination of use of lead for soldering but many researchers believe this transition into lead free electronics will take a long time for high reliability applications. Successful performance of an electronic module is functions of reliabilities of all other components like solder material, resistors, and metal inter connections etc which perform at different temperature levels. Solder attachment reliability is defined as the ability of solder joints to survive planned design life of a given product. This research looks in to reliability of the solder attachment option in the test vehicles which are subjected to 4300 thermal cycles tracing a particular temperature profile and resistance is used a monitoring parameter for failure of components. This test is done with different Solder pastes and surface finishes which thus will have different solder attachment options and tested in thermal cycling conditions which relate to the actual scenario and will characterize its reliability.
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