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dc.contributor.advisorEvans, John
dc.contributor.advisorMurray, Chase
dc.contributor.advisorSesek, Richard
dc.contributor.authorSwaim, William
dc.date.accessioned2011-06-03T20:01:39Z
dc.date.available2011-06-03T20:01:39Z
dc.date.issued2011-06-03
dc.identifier.urihttp://hdl.handle.net/10415/2645
dc.description.abstractThis work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and place machines. A full description of these projects is presented along with rationales and background on their real world implementations. The transition from a five to ten zone reflow oven represents many opportunities for reflow soldering quality improvements. Specifics about the enhanced profiling abilities gained with the longer oven are explored and results from the oven installation are presented. To increase SMT line efficiency various changeover methods are discussed. The “hot swap” method, a somewhat new and unknown setup strategy, is explored in detail. Results from an implementation of the “hot swap” changeover method are discussed. Additional productive enhancements to the strategy are proposed.en_US
dc.rightsEMBARGO_NOT_AUBURNen_US
dc.subjectIndustrial and Systems Engineeringen_US
dc.titleSMT Line Improvements for High Mix, Low Volume Electronics Manufacturingen_US
dc.typethesisen_US
dc.embargo.lengthNO_RESTRICTIONen_US
dc.embargo.statusNOT_EMBARGOEDen_US


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