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Browsing by Author "Suhling, Jeffrey"
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Area-Array Package Reliability Models for No-Core PCB Assemblies in Extreme Thermo-Mechanical Environments
Moore, Timothy (2007-08-15)
The trends in the electronic packaging industry are to design smaller packages that have higher complexity, and to improve package reliability while reducing costs. These needs in the packaging industry have lead to a ...
Ballistic Limit Velocity For Continuous Fiber Polymeric Composite Materials and Polymers Through Experimental and Numerical Methods
Grupp, Jonathan (2015-05-06)
Composite materials are often subject to harsh operating environments which may include impact from errant projectiles of various geometries traveling at specific velocities and trajectories. Experimentalists seek to ...
Characterization and Prediction of Material Response of Micro And Nano-Underfills for Flip Chip Devices
Islam, Muhammad (2006-05-15)
Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silica particles is in the micrometer ...
Characterization of Die Stresses in Large Area Array Flip Chip Packages
Roberts, Jordan (2008-08-15)
Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic chip carrier. The final assembly configuration features a complex ...
Characterization of Lead-free Solders for Electronic Packaging
Ma, Hongtao (2007-05-15)
The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and ...
Characterization of Moisture and Thermally Induced Die Stresses in Microelectronic Packages
Nguyen, Quang (2017-09-20)
Moisture has been one of the major concerns for package designers and reliability researchers. It is well-known that high humidity combined with high temperature can cause a number of failure modes to electronic devices, ...
Characterization of the Widescale Reversible Sliding Mechanism in California Red Abalone Nacre Structure
Price, Hayden (2022-12-09)
The precise and ordered microstructures produced through the bottom-up process of self-assembly is a matter of much interest to many research teams, with many applications in the fields of engineering and technology. In ...
CMOS Stress Sensor Circuits
Chen, Yonggang (2006-12-15)
Two CMOS piezoresistive stress sensor circuits based on piezoresistive MOSFETs (PiFETs) are the focus of this dissertation. The first design is a multiplexed array of 512 piezoresistive sensors fabricated on a 2.2 by 2.2mm2 ...
Compression Response and Modeling of Interpenetrating Phase Composites and Foam-Filled Honeycombs
Jhaver, Rahul (2009-08-03)
Although multiphase materials with discrete, dispersed and/or embedded phases in a matrix have been evolving over the years, there are limitations in terms of the degree of concentration of the secondary phase that can be ...
Constitutive Model and Solder Joint Reliability Predictionsfor BGA Packages Subjected to Aging
Basit, Munshi (2015-07-28)
Isothermal aging causes detrimental changes in the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies. Traditional finite element based predictions for solder ...
Design and Calibration of Stress Sensors on 4H-SiC
Chen, Jun (2022-03-07)
Stresses in electronic packages due to thermal and mechanical loadings can cause premature mechanical failures such as fracture of die, severing of connections, die bond failure, solder fatigue, and encapsulant cracking. ...
Design, Fabrication and Testing of Novel Medical Facemasks to Prevent COVID-19
Alby, Laine (2022-04-28)
The nation is going through an unprecedented time due to the Coronavirus pandemic. One of the most effective ways to prevent viral spread is to use face masks and respirators. Available reusable face masks are often not ...
Development of a Split Hopkinson Tension Bar for Testing Stress-Strain Response of Particulate Composites under High Rates of Loading
Owens, Anthony (2007-08-15)
Mechanical structures and their material constituents undergo an expansive range of
loading conditions. Specifically, the rate at which the loading takes place can vary from
being virtually static to being almost ...
Development of Test Protocols for Analysis of Low Back Exertions in Standing Position
Soman, Varun (2012-05-16)
More than 80 percent of people suffer from low back pain at some point in their lifetime costing losses of up to $9 billion because of treatment and loss of work hours in the US alone. Kinematics and kinetics of body ...
Die Stress Characterization and Interface Delamination Study in Flip Chip on Laminate Assemblies
Rahim, Md. Sayed Kaysar (2005-08-15)
Thermo-mechanical reliability of flip chip on laminate packaging is a major concern when the assemblies are exposed to harsh operating environments such as space or automotive underhood applications. In this study, ...
Effects of Aging on Microstructure and Mechanical Properties of Lead Free Solder Materials
Ahmed, Sudan (2018-12-03)
Lead free solder materials are widely used in the electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Sn-Ag-Cu (SAC) lead free ...
The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys
Zhang, Yifei (2010-08-05)
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In this work, ...
The Effects of Isothermal Aging on the Mechanical Behavior of Underfill Encapsulants
Lin, Chang (2010-08-04)
Underfill encapsulants are widely used in the microelectronics industry to improve the reliability of electronic components assembled to printed circuit boards. In this work, the effects of isothermal aging on the ...
The Effects of Mechanical Stress on Semiconductor Devices
Hussain, Safina (2015-04-24)
Mechanical strains and stresses are developed during the fabrication, assembly and packaging of the integrated circuit (IC) chips. Sources include processes such as shallow trench isolation, wafer backgrinding and dicing, ...
Experimental Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon
Cho, Chun (2007-08-15)
In this work, the dependence of the silicon piezoresistive coefficients p11, p12, and p44 on temperature is investigated. Experimental calibration results for the piezoresistive coefficients of silicon as a function of ...