This Is AuburnElectronic Theses and Dissertations

Browsing by Author "Suhling, Jeffrey"

Now showing items 21-40 of 59

An Experimental Investigation and a Multiscale Electro-thermo-mechanical Model of a Flat Pin High Power Electrical Connector 

Angadi, Santosh (2011-11-03)
Hybrid and electrical vehicles (HEV) are the next evolutionary step in automobile technology. However, the electrical systems which propel HEVs are fundamentally different from conventional technologies. Therefore, a few ...

Fatigue Behavior and Modeling of Polyether Ether Ketone under Variable Amplitude and Multiaxial Loading 

Shrestha, Rakish (2020-07-22)
Experimental and analytical roadmap to thoroughly understand and establish benchmark material properties for unfilled polyether ether ketone (PEEK) under monotonic tension and compression, as well as uniaxial and multiaxial ...

Health Monitoring for Flywheel Rotors Supported By Active Magnetic Bearings 

Barber, Kelly (2006-08-15)
Magnetic bearings are not a new technology in themselves, yet the control and implementation of such devices is still a budding science. Magnetic bearings are particularly attractive for some applications because of the ...

High Strain Rate Material Characterization of Lead-Free SAC Solder Alloy and Solder Joint Reliability under Vibration and Thermal Loads 

Yadav, Vikas (2022-12-09)  ETD File Embargoed
Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as automotive, oil and gas, aerospace, medical technologies, and defense ...

Hydraulic Solenoid Valve Reliability and Modeling Study 

Angadi, Santosh (2008-12-15)
The current work has studied the reliability of a solenoid valve (SV) used in automobile transmissions through a joint theoretical and experimental approach. Based on an extensive literature search, the most common failures ...

In-situ Electronics Measurement Using X-ray Micro-Computed Tomography System and Data Driven Prognostic Health Management 

Wei, Junchao (2017-05-02)
In the 21st century, the electronics is everywhere and covers every aspect of human life. You can find it when watching TV, opening a laptop, or checking emails on a cell phone. Since 2015, 268 million PCs, 455 million ...

Investigating the Process-Structure-Property Relationships of Additively Manufactured 17-4 Precipitation Hardening Stainless Steel 

Dastranjy Nezhadfar, Pooriya (2022-07-28)
The present work aims to investigate the process-structure-property relationships for the additively manufactured 17-4 PH stainless steel to improve its mechanical performance. To this end, a multidisciplinary (i.e., ...

The Investigation of Haliotis Rufescens (Red Abalone): Mesolayer Growth & Mechanical Behavior 

Zhang, Anqi (2017-11-30)
Self-assembly is a popular bottom-up process which results in highly-ordered and fine structures in micro- or nano-scale. The special structures produced through the self-assembly are always related to some unique and ...

Investigation of the Mechanical Behavior of Freestanding Polycrystalline Gold Films Deposited by Evaporation 

Wang, Liwei (2007-08-15)
The Membrane Deflection Experiment was employed to perform the micro-tensile testing on freestanding polycrystalline gold thin films. Films with varying thickness of 0.25 µm, 0.50 µm and 1.00 µm were deposited on Si ...

Investigations on Damage Mechanics and Life Prediction of Fine-Pitch Electronics in Harsh Envirorments 

Islam, Mohd (2005-08-15)
Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher ...

Magnetoelastic Sensor Systems in Biomarker Sensing Applications 

MacLachlan, Alana (2023-12-01)  ETD File Embargoed
Biosensors are receptor-transducer devices which convert biological responses into readable signals. Biosensor design and development have drawn increasing attention due to the extensive range of possible applications, ...

Material behaviour of mixed formulation solders 

Kurumaddali, Nalini Kanth (2009-12-18)
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed ...

Material Factors Influencing Metallic Whisker Growth 

Rodekohr, Chad (2008-12-15)
Whiskering refers to the formation of slender, long, metallic filaments, much thinner than a human hair, that grow on a metallic thin film surface. They are readily observed for pure and alloyed zinc (Zn), silver (Ag), ...

Measuring, Evaluating, and Describing Pile-Up and Sink-In During Nanoindentation of Thin Films on Substrates 

Sullivan, MariAnne (2015-12-10)
Nanoindentation is a valuable tool for extracting material properties such as elastic modulus and hardness at the nanoscale. Knowing material properties at this scale enhances the use of thin films in protective coatings ...

Mechanical Behavior and Microstructural Evolution of Lead Free Solder Alloys in Harsh Environment Applications 

Alam, Mohammad (2019-07-10)
Solder joints provide mechanical support, electrical and thermal interconnection between packaging levels in microelectronics assembly systems. Proper functioning of these interconnections and the reliability of the ...

Mechanical Characterization and Aging Induced Evolution of Cyclic Properties and Microstructure of Lead-Free Solder Materials 

Chowdhury, Md Mahmudur (2020-04-29)
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life ...

Microstructural effects on fracture behavior of particulate composites: Investigation of toughening mechanisms using optical and boundary element methods 

Kitey, Rajesh (2006-08-15)
Particulate polymer composites are used in a variety of engineering applications. These are generally two phase materials with polymeric phase reinforced by a filler phase to improve overall mechanical, thermal and/or ...

Modeling and Analysis of PZT Micropower Generator 

Ajitsaria, Jyoti (2008-12-15)
The goal of this research is to theoretically and experimentally investigate behaviors of a power harvesting system that was constructed with a bimorph cantilever made of Lead Zirconate Titanate (Pb[ZrxTi1-x]O3) and a ...

Models for Thermo-Mechanical Reliability Trade-offs for Ball Grid Array and Flip Chip Packages in Extreme Environments 

Hariharan, Ganesh (2007-05-15)
In the current work, decision-support models for deployment of various ball grid array devices and flip chip electronics under various harsh thermal environments have been presented. The current work is targeted towards ...

Moisture Effects and Viscoelasticity in Polymers Used for Microelectronic Packaging 

Chowdhury, Promod (2019-12-06)  ETD File Embargoed
In the microelectronics packaging industry, polymer based materials are used widely. Reliable, consistent and comprehensive material property data are required for mechanical design, process optimization, and reliability ...