Browsing by Author "Suhling, Jeffrey"

Now showing items 41-59 of 59

A Multiscale Investigation of the Fatigue Behavior of Additively Manufactured Nickel Superalloys

Soleimani Dodaran, Mohammad (2021-11-15)

Fatigue as the most frequent mode of failure among mechanical systems has been the focus of a large part of the research community. Modern manufacturing technologies are developed to address the need for complex geometries ...

Nanomechanical Characterization of Aging Effects in Solder Joints

Hasnine, Md (2015-10-14)

Over the past decade, it has been demonstrated the large changes that occur in the mechanical (constitutive) response and failure behavior of lead free solders after exposure to isothermal aging. For example, measured ...

Overmolded Substrate on Aluminum Metal Backing for Harsh Environment Applications

Ridenour, Joshua (2008-12-15)

Demand for high-temperature electronics in the automotive industry increases daily with the increasing number of electronics going into under-the-hood locations. Along with keeping costs low and reliability high while the ...

Quasi-Static and Dynamic Crack Initiation and Growth in Soda-lime Glass: Full-field Optical Investigations

Dondeti, Sivareddy (2022-11-17)

Soda-lime glass (SLG) is a widely used structural material with numerous advantages in terms of thermal, physical, and mechanical properties besides sustainability and recyclability. It is widely used for structural ...

Reduction of Lead Free Solder Aging Effects Using Doped SAC Alloys

Cai, Zijie (2012-10-08)

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. Large ...

Reliability of Lead-Free and Advanced Interconnects in Fine Pitch and High I/O Electronics Subjected to Harsh Thermo-Mechanical Environments

Hinshaw, Robert, III (2009-09-11)

Industry is moving towards lower cost, increased functionality, and miniaturized electronics placed in ever closer proximity of higher operating temperatures, typical of harsh environments. In this thesis, three aspects ...

Statistical Model for Prediction of Life-Reduction in SAC Lead-free Interconnects during Long-Term High Temperature Storage using Principal Component Regression and Ridge Regression

Duraisamy, Sree Mitun (2016-05-18)

Electronics in military and defense applications may be stored for prolonged period of time prior to deployment in mission critical applications. In addition, electronics in automotive applications may be used underhood, ...

Stress Analysis in Bipolar Transistors

Gnanachchelvi, Parameshwaran (2016-05-03)

Stress effects in semiconductor devices have gained significant attention in semiconductor industry nowadays. Stress effect in semiconductor devices is used as a beneficial effect in sensor applications and strain engineering ...

A Study of Crack-Inclusion Interaction Using Moiré Interferometry and Finite Element Analysis

Savalia, Piyush-Chunilal (2006-12-15)

Failure of composite materials is intrinsically linked to the fundamental problem of a matrix crack interacting with a second phase inclusion. In this work, the critical issue of matrix-inclusion debonding in the presence ...

A study of mixed-mode dynamic fracture in advanced particulate composites by optical interferometry, digital image correlation and finite element methods

Kirugulige, Madhusudhana (2007-08-15)

Understanding the fracture mechanics of materials under stress wave loading is essential for impact resistant design of structures. In this context, mixed-mode dynamic fracture behavior of two-phase composites - a ...

Study of the Effect of Mechanical Cycling on the Constitutive Behavior of Lead-Free Solders

Hoque, Mohd Aminul (2021-08-05) ETD File Embargoed

Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life ...

A Study of Vibration-induced Fretting Corrosion in Electrical Connectors Based on Experimental Test and FEA Simulation

Zhang, Fuxi (2015-09-08)

In the field of electrical contacts, vibration induced fretting corrosion is generally recognized as one of the major failure mechanisms. Many factors affect fretting corrosion, including the normal force and the surface ...

Target Reliability Analysis for Structures

Ghasemi, Seyed Hooman (2015-01-06)

Structural performance depends on load and resistance parameters, in particular magnitude and frequency of load components and their combinations, strength of materials, modulus of elasticity, dimensions, rate of deterioration, ...

Thermal Performance of Ball Grid Arrays and Thin Interface Materials

El-Kady, Yasser (2005-08-15)

Current electronic packages exhibit very high and ever increasing power densities. That trend mandates the need for enhanced thermal performance. This study introduces a state of the art apparatus to measure thermal ...

Thermal-Mechanical Characterization and Microstructural Evolution of Lead Free Solder Alloys in Harsh Environment Applications

Hassan, KM Rafidh (2021-04-27) ETD File Embargoed

With the emergence of the modern electronic packaging technology over the last few decades, lead free solder alloys have been the primary interconnects material used in electronic packaging industry due to their relatively ...