Browsing by Author "Baginski, Thomas A."

Now showing items 1-16 of 16

Carbon Nanotubes (CNTs) as Electron Emitters for Plasmas Operating in Subatmospheric pressure under DC and Pulsed Fields

Li, Huirong (2014-05-05)

Subatmospheric pressure is defined as the pressure from several milliTorr to several hundred Torr. The plasmas operated in subatmospheric pressure have the advantages of easier construction and stable operation. The ...

Detection and Mitigation of Electrostatic Pull-in Instability in MEMS Parallel Plate Actuators

Stevens, Colin (2013-07-19)

Electrostatic MEMS actuators are used in a wide variety of applications including micro- machined gyroscopes, high speed mechanical switches, variable capacitors, and vibration isolation devices. MEMS parallel plate ...

Fabrication and Assembly of Ultra Thin Flexible Active Printed Circuits

Zhang, Tan (2006-05-15)

Tremendous attention has been focused on flexible printed circuits for their light weight, minimized dimension and three dimensional packaging capabilities. However, the traditional flexible circuit fabrication and assembly ...

Fabrication of Macro Scale 3D Structures Using MEMS Technology

Stevens, Colin (2010-07-20)

The addition of Deep Reactive Ion Etching (DRIE) in the fabrication of micro-electro-mechanical-systems(MEMS) has enabled the creation of many new structures that were not previously feasible. By combining this technique ...

Flip Chip and Lid Attachment Assembly Process Development

Ding, Fei (2006-12-15)

Flip chip technology offers numerous advantages over conventional packages by virtue of its electrical performance, greater input/output (I/O) flexibility and small size. This study focuses on two flip chip assembly process ...

Growth and Characterization of Nitrogen Doped Nanocrystalline Diamond Films

Clark, Maurice (2006-05-15)

Nitrogen doped nanocrystalline (NCD) diamond films have been deposited on a variety of substrates using microwave plasma chemical vapor deposition (MWPCVD). These films have been systematically studied to determine their ...

High Temperature High Power SiC Devices Packaging Processes and Materials Development

Wang, Cai (2006-08-15)

Silicon power devices have reached their theoretical limits in terms of higher temperature and higher power operation by virtue of the physical properties of the material. SiC has been identified as a material with the ...

Integration of Thin Flip Chip in Liquid Crystal Polymer Based Flex

Hou, Zhenwei (2006-05-15)

Thin embedded active assemblies have been developed that combine a lower profile and high functional density (per volume) with a flexible appearance, meeting the demands for the miniaturization of electronic products. The ...

Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components

Liu, Yueli (2006-05-15)

Chip Scale Packages (CSPs) are widely used in portable and hand-held electronic devices due to their small size and availability. Consumers expect portable products to survive being dropped repeatedly, and drop testing is ...

Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications

Wang, Qing (2005-08-15)

While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, the exact Composition varies by geographic region, supplier and user. Add to that dissolved copper ...

Packaging of Silicon Carbide High Temperature, High Power Devices - Processes and Materials

Liu, Yi (2006-05-15)

Silicon carbide (SiC) has unique electrical, thermal and physical properties compared to the Si and GaAs conventionally used in microelectronics as it can operate in the temperature range from 350ºC to 500ºC. However, there ...

Pine Seedling Detection and Registration

Hunt, Jeff (2009-11-20)

Pine seedling nurseries across the United States depend on antiquated techniques and equipment to manage the country’s supply of pine seedling stock. This research is directed towards the development of a method to ...

A Pre-distortion Technique for OTA-C Filter Design

Dandamudi, Pradeep (2010-11-16)

The growing demand of continuous filters in portable electronic equipment, wireless receivers and continuous-time (CT) analog-to-digital converters (ADCs) has spawned a strong research interest from industry and academia. ...

Process Development of Double Bump Flip Chip with Enhanced Reliability and Finite Element Analysis

Yan, Wei (2005-08-15)

Flip chip technology has drawn tremendous attention in electronic packaging in recent years due to the advantages it offers, such as better electrical performance, high I/O density and smaller size. However, as package ...

A Study of Vibration-Induced Fretting Corrosion for Electrical Connectors

Xie, Fei (2007-05-15)

Vibration induced fretting degradation is a widely recognized failure phenomenon. However, the basic mechanisms that control the onset and progression of such fretting behavior are not well understood and are a topic of ...

A Technique for the Measurement of Relative Velocity between Parallel Plate Electrodes in Micromachined Structures

Dean, Robert (2006-05-15)

Numerous applications exist for microstructures that contain two parallel oriented electrodes that experience relative motion. It is often desirable to measure the relative velocity between the two electrodes and then ...