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Evolution of the Mechanical and Microstructure Properties of SAC Alloys During Thermal Cycling
Belhadi, Mohamed El Amine (2023-04-18) ETD File Embargoed
In real-time applications, solder joints are exposed to thermal and mechanical stresses. As a result, the microstructure evolves, and mechanical characteristics deteriorate, resulting in component failure. Solders have ...
Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics
Belhadi, Mohamed El Amine (2019-12-02) ETD File Embargoed
The most common solder alloy SAC305 has a significant reliability issue especially after aging. In addition to aging, multiple factors can contribute to the early failure of the solder joint.
Research has shown that shear ...