Browsing by Author "Bhavnani, Sushil H."

Now showing items 1-11 of 11

Advancements in Vacuum Process Molding and Casting

Capps, Johnathon (2005-08-15)

Vacuum assisted molding, or ‘V’ Process molding, possesses many benefits over other sand casting processes. However, the process lacks the high cooling rates and speed of solidification that other sand casting processes ...

Comparative Characterization of Electronic Packaging Materials through Steady State Thermal Conductivity Measurements

Maddox, John Franklin, Jr. (2010-07-30)

The decreasing feature size and increasing power generation of modern electronic devices have created a need for increasingly effective and efficient thermal management solutions to remove the high heat fluxes being ...

Experimental and Computational Study of Fluid Flow and Heat Transfer in the Lost Foam Casting Process

Liu, Xuejun (2005-12-15)

The Lost foam casting (LFC) process has been considered as one of the most significant modern developments in casting technology. The use of polymer foam patterns allow complex shapes to be created by integrating several ...

Experimental Investigation of Cavity Induced Two Phase Flow in Silicon Microchannels

Pate, Daniel (2006-12-15)

Modern developments in microelectronics manufacturing and architecture continue to lead to reductions in feature sizes on microprocessor chips. The demand for faster and more powerful systems has approached the limits of ...

Experimental Investigation of Thermo-Hydraulic Characteristics of Two-Phase Flow of FC72 in Microchannel Heat Sinks

Thiagarajan, Naveenan (2009-11-20)

Advances in electronics such as chip level integration and die stacking have led to a bottleneck in further development since dissipation of the resulting high heat fluxes continues to be a challenge. Due to the tremendous ...

Investigation of Thermally-Actuated Pumping During Pool Boiling of a Dielectric Liquid on an Asymmetric Microstructured Silicon Heat Sink

Thiagarajan, Naveenan (2013-08-20)

Developments in the field of electronics fabrication have led to significant miniaturization of devices. Such a reduction in foot-print of the electronic devices coupled with increased capabilities, such as computing ...

Liquid Jet Impingement with Spent Flow Management for Power Electronics Cooling

Maddox, John Franklin Jr (2015-07-21)

The high levels of heat generated by power electronics, on board electric and hybrid-electric vehicles, require the use of aggressive liquid cooling techniques. Incorporating the electronics cooling into the radiator flow ...

Multiphase Numerical Simulations of Dielectric Fluid Immersion Cooling Scenarios including Effects of Nucleation Site Density and Bubble Departure Diameter Functions

Nguyen, Jonathan L. (2015-07-24)

Multiphase numerical simulations have typically been restricted to a few standard functions for key boiling parameters. In this study, ANSYS Fluent was used to model dielectric fluid immersion cooling of multichip modules ...

Numerical Simulations of Boiling in Dielectric Fluid Immersion Cooling Scenarios of High Power Electronics

Fincher, Seth (2014-04-28)

As server technologies have progressed, the traditional methods of blade level cooling have become very costly. Up to this point, most server units have been cooled through forced air convection; a process that requires ...

Parametric Study of a Commercial-Scale Biomass Downdraft Gasifier: Experiments and Equilibrium Modeling

Gautam, Gopal (2010-08-04)

Biomass has already emerged in the renewable energy arena as one of the promising candidates for the future. Biomass has been a major source of fuel for human from the existence of mankind. Rapid urbanization and widespread ...

Viability of server module thermal management using enhanced heat sinks and low global warming potential dielectric fluids

Ramakrishnan, Bharath (2014-06-24)

Immersion cooling is making a resurgence for use in server applications driven by an increase in chip densities and the need for reduction in overall data center power usage. This thesis focuses on pool boiling characteristics ...