Browsing by Author "Bozack, Michael"

Now showing items 1-20 of 21

Cold Metal Transfer-Gas Metal Arc Welding (CMT-GMAW) Wire + Arc Additive Manufacturing (WAAM) Process Control Implementation

Hunko, Wesley (2018-04-13)

While additive manufacturing is comprised of metal and polymer fabrication, current additively manufactured polymer-based products are much further from being put into industrial applications. Metal-based additive ...

Drop Shock Performance of Solder Alloys in BGA Assemblies under Different Thermal Conditions

Vyas, Palash (2024-05-03) ETD File Embargoed

Lead-free soldering has become mainstream since the Restriction of Hazardous Substances (RoHS) Directive. Solders have come a long way from the traditional SnPb (Tin-Lead) to lead-free alloys doped with elements such as ...

The Effects of Aging on Doped Lead-Free Solder under Thermal Shock and Thermal Cycling

Robert Raj, Anto Jeson Raj (2019-12-09)

In this experiment, the thermal shock performance of various doped Pb-free solder pastes on Ball Grid Array (BGA) packages and resistors were observed in order to determine their reliability. This investigation is based ...

Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders

Sanders, Thomas (2016-05-11)

The semiconductor and packaging industries have been moving away from the use of Lead (Pb) due to the increasing awareness of the health and safety concerns surrounding its use. For many applications, the industry has moved ...

Fabrication and Characterization of Thin Film Transistors based on Sol-Gel Derived Zinc Oxide Channel Layers

Mirkhani, Vahid (2018-04-30)

This dissertation aims to explore film and device characteristics of zinc oxide (ZnO) based channel layers fabricated via the sol-gel spin-coating growth technique. ZnO is wide band gap semiconductor with a wide range of ...

Factors Governing Tin Whisker Growth

Crandall, Erika (2012-08-02)

Tin (Sn) whiskers are electrically conductive, single crystal eruptions that can grow from surfaces where tin is deposited on a substrate surface. They present reliability problems for the electronics industry due to the ...

Failure Mode Classification for Prognostics and Health Monitoring of Electronic-Systems under Mechanical Shock

Gupta, Prashant (2012-01-30)

Electronics have become an integral part of most systems and subsystems used in various fields such as avionics, defense, space exploration, manufacturing, household appliances, health care (implantable biological devices ...

In-situ Electronics Measurement Using X-ray Micro-Computed Tomography System and Data Driven Prognostic Health Management

Wei, Junchao (2017-05-02)

In the 21st century, the electronics is everywhere and covers every aspect of human life. You can find it when watching TV, opening a laptop, or checking emails on a cell phone. Since 2015, 268 million PCs, 455 million ...

Material Factors Influencing Metallic Whisker Growth

Rodekohr, Chad (2008-12-15)

Whiskering refers to the formation of slender, long, metallic filaments, much thinner than a human hair, that grow on a metallic thin film surface. They are readily observed for pure and alloyed zinc (Zn), silver (Ag), ...

Mechanical and Microstructural Behavior Evolution of Lead Free Solder Materials Under Different Thermal Exposures

Hasan, S M Kamrul (2023-05-01) ETD File Embargoed

With the growth of electronic packaging industries, ranging from automobile to hand-held products, reliability is a major concern. Also, to keep pace with the increasing demand of end users for integration, miniaturization, ...

Mechanical Behavior and Microstructural Evolution of Lead Free Solder Alloys in Harsh Environment Applications

Alam, Mohammad (2019-07-10)

Solder joints provide mechanical support, electrical and thermal interconnection between packaging levels in microelectronics assembly systems. Proper functioning of these interconnections and the reliability of the ...

Mechanical Characterization and Aging Induced Evolution of Cyclic Properties and Microstructure of Lead-Free Solder Materials

Chowdhury, Md Mahmudur (2020-04-29)

Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life ...

Modeling and Experimental Behavior Studies on Tin Whiskers

Wang, Zekun (2021-12-06)

The spontaneous growth of tin whiskers can occur under room temperature conditions. However, under more extreme external conditions (e.g., high temperature, high humidity, or thermal cycling), the rate of such growth tends ...

Nanomechanical Characterization of Aging Effects in Solder Joints

Hasnine, Md (2015-10-14)

Over the past decade, it has been demonstrated the large changes that occur in the mechanical (constitutive) response and failure behavior of lead free solders after exposure to isothermal aging. For example, measured ...

PBGA Reliability of Lead Free Solder Balls Assembled with Tin Lead Solder Paste for Harsh Environment Electronics

Mitchell, Charles (2006-08-15)

The demand for high-temperature electronics is growing rapidly in the automotive industry. This stems directly from the fact that these electronics are being transferred from their passive environments to under-the-hood ...

Phospho-silicate glass as gate dielectric in 4H-SiC metal-oxide-semiconductor devices

Jiao, Chunkun (2016-07-28)

Silicon carbide (SiC) based MOS devices are well suited to meet the need for energy efficient power electronics. For 4H-SiC MOSFET technology, one of the crucial challenges is to improve the quality of SiO2/SiC interface, ...

Prognostic Health Management for Mission and Safety Critical Electronics

Lowe, Ryan (2012-07-17)

The increasing reliance on electrical systems to fulfill mission and safety critical applications has motivated the need for in situ monitoring of functioning electrical systems and a priori warnings of failure. In this ...

Radiation Hardness Study of AlGaN/GaN High Electron Mobility Transistors (HEMTs)

Khanal, Min (2019-04-29)

Gallium nitride (GaN) has unique inherent properties such as ionic-covalent bond, large direct bandgap, excellent thermal stability, high threshold displacement energy and higher break-down field. Also, the relatively low ...

Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling

Shen, Chaobo (2016-05-06)

A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ...

The Reliability of Zinc Oxide Based Thin Film Transistors Under Extreme Conditions

Yapa Bandara, Kosala (2018-04-23)

In this Ph.D. dissertation, I report the device instability of ZnO thin film transistors (TFTs) under extreme environmental conditions. It is extremely important to identify the cause of device instability under different ...