Browsing by Author "Bozack, Michael J."

Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated ...

The electronics may experience high strain rates under single, sequential and simultaneous exposure to thermo-mechanical and transient dynamics loads at various stages of their life-cycle i.e. manufacturing, transportation, ...