Browsing by Author "Carrano, Andres"

Now showing items 1-8 of 8

3D-printed custom substratum to accentuate fast functional responses from microbial colonization

Proaño-Peña, Gabriel Felipe (2018-12-03)

Recent studies have shown the feasibility of growing benthic organisms on customized substratum by using Additive Manufacturing (AM). Their proven capabilities to fabricate objects at high speed and with complex geometries ...

An analytical and experimental study on 3D-printed custom surfaces for benthic algal biofilms

Kardel, Kamran (2016-07-08)

Due to their fast growing rates and regeneration, algae are a promising avenue for biofuels, aquatic pollution recovery, and a source of protein nutrients, among others. Cultivation of benthic algal communities, in particular, ...

Design and Manufacture of Surface Topography with Additive Manufacturing: Properties and Applications

Khoshkhoo, Ali (2018-05-31)

The first study investigates the impact of surface texture parameters of natural surface specimens on the attachment of algae communities. The primary objective of this effort is to show feasibility in the approach of ...

Effect of Three Dimensional Substratum Features on Benthic Algal Biomass Productivity

Ekong, Joseph (2017-11-30)

Algae has emerged as a promising and valuable source for biofuels, waste water remediation and bio-products such as fertilizers, bioplastics and aquaculture feed. Algae’s emergence can be attributed to its high growth rates ...

Facility layout and emerging advanced material handling optimization

Lee, Hung-Yu (2017-07-12)

This research explores the intersection of facility layout and vehicle routing, beginning with a study on a real-world semiconductor manufacturing facility layout problem (FLP), followed by a study of facility layout ...

Metrology and Characterization of Electrically Conductive Filaments (ECF) for Fused Deposition Modeling (FDM).

Henriquez, Mauricio (2019-12-05)

Current electronics manufacturing is composed of several processes, usually with a high energy, space and knowledge footprint costs to produce a working product. The product is assembled from subcomponents such as the PCB, ...

Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling

Shen, Chaobo (2016-05-06)

A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ...

Reliability of Lead-Free Electronic Package Interconnections under Harsh Environment

Hai, Zhou (2014-07-24)

Lead-free solder alloy has evolved and applied in industries for many years. The reliability is of concern for lead-free solder joints of assembled circuitry, especially those exposed to high temperature in a long period ...