Browsing by Author "Hamasha, Sa'd"

Now showing items 1-13 of 13

Design and Manufacture of Surface Topography with Additive Manufacturing: Properties and Applications

Khoshkhoo, Ali (2018-05-31)

The first study investigates the impact of surface texture parameters of natural surface specimens on the attachment of algae communities. The primary objective of this effort is to show feasibility in the approach of ...

Drop Shock Performance of Solder Alloys in BGA Assemblies under Different Thermal Conditions

Vyas, Palash (2024-05-03) ETD File Embargoed

Lead-free soldering has become mainstream since the Restriction of Hazardous Substances (RoHS) Directive. Solders have come a long way from the traditional SnPb (Tin-Lead) to lead-free alloys doped with elements such as ...

The Effects of Aging on Doped Lead-Free Solder under Thermal Shock and Thermal Cycling

Robert Raj, Anto Jeson Raj (2019-12-09)

In this experiment, the thermal shock performance of various doped Pb-free solder pastes on Ball Grid Array (BGA) packages and resistors were observed in order to determine their reliability. This investigation is based ...

Effects of Creep and Fatigue on the Reliability of SnAgCu Solder Joints in Thermal Cycling

Abueed, Mohammed (2020-11-20)

The reliability of electronic systems is threatened by the failure of one solder interconnection among thousands connecting several components to the PCB. These joints are exposed to different sorts of harsh circumstances ...

Evolution of the Mechanical and Microstructure Properties of SAC Alloys During Thermal Cycling

Belhadi, Mohamed El Amine (2023-04-18) ETD File Embargoed

In real-time applications, solder joints are exposed to thermal and mechanical stresses. As a result, the microstructure evolves, and mechanical characteristics deteriorate, resulting in component failure. Solders have ...

Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Stress Amplitudes

Jian, Minghong (2021-04-23) ETD File Embargoed

The eutectic Sn-Pb solder alloys are widely used in the electronic packaging industry. However, they are being replaced by new near-eutectic solder alloys because of environment and health concerns associated with lead. ...

Fatigue Properties and Reliability of Solder Joints in BGA Assembly

Wei, Xin (2022-12-05) ETD File Embargoed

Lead-free near-eutectic Sn-Ag-Cu (SAC) solder system has raised increasing attention in the electronics industry since the hazardous effects of SnPb solders. One of the critical considerations for the reliability of an ...

Lean Six Sigma Approach to Improve Further Processing Efficiency using Burger Manufacturing as a Model Process.

Guzman, Luis (2024-04-26)

Operations management plays a crucial role in industries, enhancing operations through the application of process improvement philosophies. Among these, Six Sigma reduces variation, and Lean Manufacturing ensures quality ...

Mechanical and Microstructural Behavior Evolution of Lead Free Solder Materials Under Different Thermal Exposures

Hasan, S M Kamrul (2023-05-01) ETD File Embargoed

With the growth of electronic packaging industries, ranging from automobile to hand-held products, reliability is a major concern. Also, to keep pace with the increasing demand of end users for integration, miniaturization, ...

Mechanical Properties of Micro Alloyed SAC Lead-Free Solder with Bi For Future Electronics

Belhadi, Mohamed El Amine (2019-12-02) ETD File Embargoed

The most common solder alloy SAC305 has a significant reliability issue especially after aging. In addition to aging, multiple factors can contribute to the early failure of the solder joint. Research has shown that shear ...

Reliability Modeling of Microelectronic Interconnections in Long-term Applications

Al Athamneh, Raed (2019-10-17)

Solder alloy materials are used to form mechanical and electrical connections between printed circuit boards and electronic components. Enhancing the reliability of electronic assemblies is mostly dependent on the reliability ...

Reliability of Doped SnAgCu Solder Alloys with Various Surface Finishes Under Realistic Service Conditions

Su, Sinan (2019-04-24)

The electronic packaging industry has moved from eutectic Sn-Pb solder materials to near-eutectic SnAgCu (SAC) solder materials in the past decade because of the increasing awareness of health and safety concerns associated ...

Thermal Cycling Reliability of Doped SnAgCu Solder Alloys after Long-Term Aging

John Akkara, Francy (2021-04-21)

Eutectic SnPb (Tin-Lead) solder has been used in electronics since early days. This universal alloy combination was used in all soldering applications because it had good mechanical and electrical properties and hence ...