Browsing by Author "Hamilton, Michael C."

Now showing items 1-9 of 9

Evaluation of thick film materials for high temperature electronics packaging

Zhou, Zhangming (2017-04-30)

Geothermal well logging requires electronics and packaging working reliably at 300C. Thick film technology has many advantages and has been widely investigated for high temperature applications. Previous studies showed ...

Fabrication and Characterization of Flexible Thin-Film Superconducting Microwave Cables

Gupta, Vaibhav (2021-07-26)

The future of superconducting and cryogenic electronic systems depends on densely integrated superconducting multi-layer and multi-signal flexible cables due to the massive number of electrical interconnects needed in ...

Failure Evasion: Statistically Solving the NP Complete Problem of Testing Difficult-to-Detect Faults

Venkatasubramanian, Muralidharan (2016-12-08)

A circuit with n primary inputs (PIs) has N = 2n possible input vectors. A test vector to correctly detect a fault in that circuit must be among those 2n n-bit combinations. Clearly, this problem can be rephrased as a ...

Interfacial Thermal Resistance Measurements of Solution Deposited CNT Films on Copper Substrates

Zheng, Yi (2015-07-28)

Carbon nanotubes (CNTs) have been regarded as one of the most promising materials for electronics applications during the past two decades according to their outstanding electrical properties. However, the fabrication ...

Laser-Assisted Synthesis and Time-Resolved Growth Control of Two-Dimensional Quantum Materials

Azam, Nurul (2022-12-08) ETD File Embargoed

Two-dimensional (2D) layered materials, including transition metal dichalcogenides (TMDCs), have recently been at the heart of quantum materials and information sciences research due to unusual properties associated with ...

Material Compatibility for Passive Two-Phase Immersion Cooling Applications

Kelly, Alexander L. (2014-03-04)

The objective of this work was to investigate potential material compatibility issues related to immersion cooling for high performance computing applications. Extended exposure of potential performance computing components ...

Materials for High Temperature Electronic Packaging

Cui, Jinzi (2016-12-12)

Normally, the operating temperature of consumer electronic devices is from 0oC to 70oC. However, some industries are interested in electronics that can operate in extreme environments. The working environment temperature ...

Novel Interface Trap Passivation and Channel Counter-doping for 4H-SiC MOSFETs

Modic, Aaron (2015-05-07)

4H-Silicon carbide (4H-SiC) is the most promising wide band gap semiconductor for next generation high power and high temperature metal-oxide-semiconductor field-effect transistors (MOSFETs). However, the channel mobility ...

Signal Integrity Challenges and Solutions at Cryogenic Temperatures

Yelamanchili, Bhargav (2023-08-07) ETD File Embargoed

The field of electronics is rapidly evolving and expanding into new frontiers, including cryogenic environments. Cryogenic temperatures below 10 K have become increasingly important in various applications such as quantum ...