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Browsing by Author "Harris, Daniel K."

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Characterization of Structurally-Enhanced Solder Joints Using Vertically-Aligned Carbon Nanotubes 

Peacock, Melissa (2014-07-29)
Since the demand for more efficient means of electronics cooling has grown significantly over recent years, the need for more advanced thermal interface materials has also increased. Thermal interface materials (TIMs) are ...

An Experimental Investigation of Liquid Metal MHPs 

Palkar, Ashish (2007-12-15)
The concept of heat pipes was introduced by R. S. Gaugler in 1940s and Cotter first introduced the idea of “micro” heat pipes in 1984. Cotter in his paper, defined the micro heat pipe as being one in which the mean curvature ...

Heat transfer study of airfoil arrays in low Reynolds number gas flows 

Shrestha, Prateek (2020-12-01)
In electronic components, pin fins arrays are commonly used to manage the thermal load. Even though several shape forms and configurations of the pin fins array are possible, cylindrical and airfoil shapes in staggered ...

Interfacial Thermal Resistance Measurements of Solution Deposited CNT Films on Copper Substrates 

Zheng, Yi (2015-07-28)
Carbon nanotubes (CNTs) have been regarded as one of the most promising materials for electronics applications during the past two decades according to their outstanding electrical properties. However, the fabrication ...

Molecular Dynamics Simulations of Dry Sliding Asperities to Study Friction and Frictional Energy Dissipation 

Vadgama, Bhavin N. (2014-03-31)
Fundamental friction characteristics such as the friction coefficient, wear, adhesion, and dissipation of energy require an accurate understanding of how the surfaces in contact interact on nano or atomic scale. At nano ...

Multiphase Numerical Simulations of Dielectric Fluid Immersion Cooling Scenarios including Effects of Nucleation Site Density and Bubble Departure Diameter Functions 

Nguyen, Jonathan L. (2015-07-24)
Multiphase numerical simulations have typically been restricted to a few standard functions for key boiling parameters. In this study, ANSYS Fluent was used to model dielectric fluid immersion cooling of multichip modules ...

Numerical Simulations of Boiling in Dielectric Fluid Immersion Cooling Scenarios of High Power Electronics 

Fincher, Seth (2014-04-28)
As server technologies have progressed, the traditional methods of blade level cooling have become very costly. Up to this point, most server units have been cooled through forced air convection; a process that requires ...