This Is AuburnElectronic Theses and Dissertations

Browsing by Author "Lall, Pradeep"

Now showing items 1-20 of 51

Accelerated Lifetime Characterization and Development of Test Protocols for Class I/Class II Micro-Machined Sensors and Flexible Li-ion Power Sources 

Abrol, Amrit (2019-04-03)  ETD File Embargoed
Modern day applications have led to extensive miniaturization of consumer electronics along with incorporation of state-of-the-art sensor devices and acceptance of flexible materials within an electronic assembly. With the ...

Area-Array Package Reliability Models for No-Core PCB Assemblies in Extreme Thermo-Mechanical Environments 

Moore, Timothy (2007-08-15)
The trends in the electronic packaging industry are to design smaller packages that have higher complexity, and to improve package reliability while reducing costs. These needs in the packaging industry have lead to a ...

Ballistic Limit Velocity For Continuous Fiber Polymeric Composite Materials and Polymers Through Experimental and Numerical Methods 

Grupp, Jonathan (2015-05-06)
Composite materials are often subject to harsh operating environments which may include impact from errant projectiles of various geometries traveling at specific velocities and trajectories. Experimentalists seek to ...

Characterization and Prediction of Material Response of Micro And Nano-Underfills for Flip Chip Devices 

Islam, Muhammad (2006-05-15)
Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silica particles is in the micrometer ...

Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment 

Panchagade, Dhananjay (2007-05-15)
The fatigue and damage of solder joints and also the potential for interface failure within BGA packages are caused by thermal cycling. In case of portable electronic products, fatigue is caused by repetitive drop and shock ...

Development of a one-dimensional moving window atomistic framework to model steady state shock wave propagation 

Davis, Alexander (2020-04-10)
We develop a long-time, large-domain moving window atomistic framework using Molecular Dynamics (MD) to model shock wave propagation through a one-dimensional system. We implement ideas of control volume on a MD framework ...

Development of Flexible Pavement Rut Prediction Models from the NCAT Test Track Structural Study Sections Data 

Selvaraj, Suresh Iimmanuel (2007-08-15)
This research study was attempted to address two of the most important aspects of mechanistic-empirical (M-E) pavement design. As M-E design continues to advance toward full implementation by state agencies, there is a ...

Die Stress Characterization and Interface Delamination Study in Flip Chip on Laminate Assemblies 

Rahim, Md. Sayed Kaysar (2005-08-15)
Thermo-mechanical reliability of flip chip on laminate packaging is a major concern when the assemblies are exposed to harsh operating environments such as space or automotive underhood applications. In this study, ...

Effect of Reflow Process on Glass Transition Temperature of Printed Circuit Board Laminates and Model for Prediction of Package-on-Package (PoP) Warpage and the Effect of Process and Material Parameters 

Narayan, Vikalp (2013-12-04)
The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board ...

Effects of Aging on the Cyclic Stress Strain and Fatigue Behaviors of Lead-free Solders 

Mustafa, Muhannad (2014-08-18)
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the ...

Explicit Finite Element Modeling in Conjunction with Digital Image Correlation Based Life Prediction of Lead-Free Electronics under Shock-Impact 

Shantaram, Sandeep (2009-08-12)
Increasing demand for smaller consumer electronics with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects thus increasing chances of failure of the electronic ...

Failure Mode Classification for Life Prediction Modeling of Solid-State Lighting 

Sakalaukus, Peter (2015-07-24)
Since the passing of the Energy Independence and Security Act of 2007, the U.S. government has mandated greater energy independence which has acted as a catalyst for accelerating and facilitating research efforts toward ...

Failure Mode Classification for Prognostics and Health Monitoring of Electronic-Systems under Mechanical Shock 

Gupta, Prashant (2012-01-30)
Electronics have become an integral part of most systems and subsystems used in various fields such as avionics, defense, space exploration, manufacturing, household appliances, health care (implantable biological devices ...

Failure Modes Analysis and Life Prediction Modeling of Phosphor Converted White Lighting Emitting Diode under Harsh Environment 

Zhang, Hao (2017-06-21)
The development of light-emitting diode (LED) technology has resulted in widespread solid state lighting use in both consumer and industrial applications due to their high-energy efficiency, long expected life, and less ...

Finite Element Analysis of Three-Dimensional Elasto-Plastic Sinusoidal Contact and Inclusion in a Multi-Scale Rough Surface Contact Model 

Krithivasan, Vijaykumar (2008-05-15)
Researchers have developed many models to simulate the elasto-plastic contact of spheres. However, there does not appear to exist a closed-form analytical model for elasto-plastic three dimensional sinusoidal contact. This ...

Health Monitoring for Damage Initiation & Progression During Mechanical Shock in Electronic Assemblies 

Choudhary, Prakriti (2007-05-15)
Electronic products may be subjected to shock and vibration during shipping, normal usage and accidental drop. Highstrain rate transient bending produced by such loads may result in failure of fine-pitch electronics. Current ...

High Temperature Vibration Fatigue Life Prediction and High Strain Rate Material Characterization of Lead-Free Solders 

Limaye, Geeta (2013-01-03)
Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, ...

In-situ Electronics Measurement Using X-ray Micro-Computed Tomography System and Data Driven Prognostic Health Management 

Wei, Junchao (2017-05-02)
In the 21st century, the electronics is everywhere and covers every aspect of human life. You can find it when watching TV, opening a laptop, or checking emails on a cell phone. Since 2015, 268 million PCs, 455 million ...

Initialization and Progression of Damage in Lead Free Electronics under Drop Impact 

Iyengar, Deepti (2008-12-15)
Electronics may be subjected to shock, vibration, and drop impact during shipping, handling, and normal usage. Measurement of transient dynamic deformation of the electronic assemblies during shock and vibration can yield ...

Interrogation of System State of Lead-Free Electronics Subjected to Mixed Sequential Steady-State and Cyclic Thermal Environments 

Vaidya, Rahul (2010-11-04)
Electronic assemblies deployed in harsh field environments may be exposed to single and multiple thermal environments during their service life. In real world setting it is often required to know during the service life ...