Browsing by Author "Lall, Pradeep"

Now showing items 1-20 of 56

Accelerated Lifetime Characterization and Development of Test Protocols for Class I/Class II Micro-Machined Sensors and Flexible Li-ion Power Sources

Abrol, Amrit (2019-04-03)

Modern day applications have led to extensive miniaturization of consumer electronics along with incorporation of state-of-the-art sensor devices and acceptance of flexible materials within an electronic assembly. With the ...

Advanced Process-Property Characterization of Additively Printed Flexible Hybrid Electronics (FHE)

Goyal, Kartik (2022-12-09) ETD File Embargoed

Printed Electronics (PE) is a constant evolving and growing technology that shows a tremendous potential for the future of electronics. Advancements in PE processes demonstrates its viability to fabricate electronic circuits ...

Area-Array Package Reliability Models for No-Core PCB Assemblies in Extreme Thermo-Mechanical Environments

Moore, Timothy (2007-08-15)

The trends in the electronic packaging industry are to design smaller packages that have higher complexity, and to improve package reliability while reducing costs. These needs in the packaging industry have lead to a ...

Ballistic Limit Velocity For Continuous Fiber Polymeric Composite Materials and Polymers Through Experimental and Numerical Methods

Grupp, Jonathan (2015-05-06)

Composite materials are often subject to harsh operating environments which may include impact from errant projectiles of various geometries traveling at specific velocities and trajectories. Experimentalists seek to ...

Characterization and Prediction of Material Response of Micro And Nano-Underfills for Flip Chip Devices

Islam, Muhammad (2006-05-15)

Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silica particles is in the micrometer ...

Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment

Panchagade, Dhananjay (2007-05-15)

The fatigue and damage of solder joints and also the potential for interface failure within BGA packages are caused by thermal cycling. In case of portable electronic products, fatigue is caused by repetitive drop and shock ...

Development of a one-dimensional moving window atomistic framework to model steady state shock wave propagation

Davis, Alexander (2020-04-10)

We develop a long-time, large-domain moving window atomistic framework using Molecular Dynamics (MD) to model shock wave propagation through a one-dimensional system. We implement ideas of control volume on a MD framework ...

Development of Embedded Systems for Continuous Monitoring of Additively-Manufactured Flexible Sensors and Reliability Modeling of Large-Scale Flip-Chip Ball Grid Arrays

Cranston, Brett (2023-07-18)

This thesis has been redacted.

Development of Flexible Pavement Rut Prediction Models from the NCAT Test Track Structural Study Sections Data

Selvaraj, Suresh Iimmanuel (2007-08-15)

This research study was attempted to address two of the most important aspects of mechanistic-empirical (M-E) pavement design. As M-E design continues to advance toward full implementation by state agencies, there is a ...

Die Stress Characterization and Interface Delamination Study in Flip Chip on Laminate Assemblies

Rahim, Md. Sayed Kaysar (2005-08-15)

Thermo-mechanical reliability of flip chip on laminate packaging is a major concern when the assemblies are exposed to harsh operating environments such as space or automotive underhood applications. In this study, ...

Direct-Write and Aerosol Jet Processes with Evaluation for Additively Printed Electronics

Narangaparambil, Jinesh Janardhanan (2023-08-04) ETD File Embargoed

Printed electronics, with their eco-friendliness, cost-effectiveness, and scalability, are becoming popular as a replacement for traditional silicon electronics. Flexible batteries, wearable sensors, and screens are just ...

Effect of Reflow Process on Glass Transition Temperature of Printed Circuit Board Laminates and Model for Prediction of Package-on-Package (PoP) Warpage and the Effect of Process and Material Parameters

Narayan, Vikalp (2013-12-04)

The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board ...

Effects of Aging on the Cyclic Stress Strain and Fatigue Behaviors of Lead-free Solders

Mustafa, Muhannad (2014-08-18)

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the ...

Explicit Finite Element Modeling in Conjunction with Digital Image Correlation Based Life Prediction of Lead-Free Electronics under Shock-Impact

Shantaram, Sandeep (2009-08-12)

Increasing demand for smaller consumer electronics with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects thus increasing chances of failure of the electronic ...

Failure Mode Classification for Life Prediction Modeling of Solid-State Lighting

Sakalaukus, Peter (2015-07-24)

Since the passing of the Energy Independence and Security Act of 2007, the U.S. government has mandated greater energy independence which has acted as a catalyst for accelerating and facilitating research efforts toward ...

Failure Mode Classification for Prognostics and Health Monitoring of Electronic-Systems under Mechanical Shock

Gupta, Prashant (2012-01-30)

Electronics have become an integral part of most systems and subsystems used in various fields such as avionics, defense, space exploration, manufacturing, household appliances, health care (implantable biological devices ...

Failure Modes Analysis and Life Prediction Modeling of Phosphor Converted White Lighting Emitting Diode under Harsh Environment

Zhang, Hao (2017-06-21)

The development of light-emitting diode (LED) technology has resulted in widespread solid state lighting use in both consumer and industrial applications due to their high-energy efficiency, long expected life, and less ...

Finite Element Analysis of Three-Dimensional Elasto-Plastic Sinusoidal Contact and Inclusion in a Multi-Scale Rough Surface Contact Model

Krithivasan, Vijaykumar (2008-05-15)

Researchers have developed many models to simulate the elasto-plastic contact of spheres. However, there does not appear to exist a closed-form analytical model for elasto-plastic three dimensional sinusoidal contact. This ...

Health Monitoring for Damage Initiation & Progression During Mechanical Shock in Electronic Assemblies

Choudhary, Prakriti (2007-05-15)

Electronic products may be subjected to shock and vibration during shipping, normal usage and accidental drop. Highstrain rate transient bending produced by such loads may result in failure of fine-pitch electronics. Current ...

High Strain Rate Material Characterization of Lead-Free SAC Solder Alloy and Solder Joint Reliability under Vibration and Thermal Loads

Yadav, Vikas (2022-12-09) ETD File Embargoed

Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as automotive, oil and gas, aerospace, medical technologies, and defense ...