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Identification and Predictive Modeling of High Propensity of Defects and Field Failure in Copper-aluminum Wire Bond Interconnect under Exposure to High Temperature and Humidity
Luo, Yihua (2018-07-25)
Semiconductor packaging industry is undergoing a paradigm shift from gold to copper wire bonding. The main driving force behind this shift is the much lower raw material cost of copper compared to gold as well as superior ...