This Is AuburnElectronic Theses and Dissertations

Browsing by Author "Sessek, Richard"

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Lead-free Doped Solder Joint Reliability under Harsh Temperature Cycling Environment to study the Long Term Isothermal Aging Effects of Heat Sinks, Solder Paste Volume, Board Substrate Material, Component Substrate Material and Component Sizes 

Thirugnanasambandam, Sivasubramanian (2018-07-23)
Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment Directive (WEEE) organizations have restricted the use of lead in solder materials for consumer electronics. The electronic industry ...