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Explicit Finite Element Modeling in Conjunction with Digital Image Correlation Based Life Prediction of Lead-Free Electronics under Shock-Impact
Shantaram, Sandeep (2009-08-12)
Increasing demand for smaller consumer electronics with multi-function
capabilities has driven the packaging architectures trends for the
finer-pitch interconnects thus increasing chances of failure of the
electronic ...
Material Characterization of Leadfree SAC Solder Alloys at High Strain Rates with Finite Element Analysis
Shantaram, Sandeep (2013-07-25)
The electronics may experience high strain rates under single, sequential and simultaneous exposure to thermo-mechanical and transient dynamics loads at various stages of their life-cycle i.e. manufacturing, transportation, ...