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Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling
Shen, Chaobo (2016-05-06)
A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ...