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Browsing by Author "Suhling, Jeff"
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Lead-free Doped Solder Joint Reliability under Harsh Temperature Cycling Environment to study the Long Term Isothermal Aging Effects of Heat Sinks, Solder Paste Volume, Board Substrate Material, Component Substrate Material and Component Sizes
Thirugnanasambandam, Sivasubramanian (2018-07-23)
Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment Directive (WEEE) organizations have restricted the use of lead in solder materials for consumer electronics. The electronic industry ...
Prognostic Health Management for Mission and Safety Critical Electronics
Lowe, Ryan (2012-07-17)
The increasing reliance on electrical systems to fulfill mission and safety critical applications has motivated the need for in situ monitoring of functioning electrical systems and a priori warnings of failure. In this ...