Browsing by Author "Suhling, Jeffrey"

The trends in the electronic packaging industry are to design smaller packages that have higher complexity, and to improve package reliability while reducing costs. These needs in the packaging industry have lead to a ...

Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silica particles is in the micrometer ...

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and ...

The precise and ordered microstructures produced through the bottom-up process of self-assembly is a matter of much interest to many research teams, with many applications in the fields of engineering and technology. In ...

Although multiphase materials with discrete, dispersed and/or embedded phases in a matrix have been evolving over the years, there are limitations in terms of the degree of concentration of the secondary phase that can be ...

Stresses in electronic packages due to thermal and mechanical loadings can cause premature mechanical failures such as fracture of die, severing of connections, die bond failure, solder fatigue, and encapsulant cracking. ...

Mechanical structures and their material constituents undergo an expansive range of loading conditions. Specifically, the rate at which the loading takes place can vary from being virtually static to being almost ...

Thermo-mechanical reliability of flip chip on laminate packaging is a major concern when the assemblies are exposed to harsh operating environments such as space or automotive underhood applications. In this study, ...

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In this work, ...

Mechanical strains and stresses are developed during the fabrication, assembly and packaging of the integrated circuit (IC) chips. Sources include processes such as shallow trench isolation, wafer backgrinding and dicing, ...