Browsing by Author "Suhling, Jeffrey C."

Now showing items 1-12 of 12

Aging Induced Evolution of the Fatigue Behavior and Microstructure of Sn-Ag-Cu Lead Free Solders

Fu, Nianjun (2017-07-31)

Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated ...

Characterization of Die Stress in Microprocessor Packaging Due to Mechanical, Thermal, and Power Loading

Roberts, Jordan C. (2014-08-05)

Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic chip carrier. The final assembly configuration features a complex ...

Designing Into 3D for Quadruped Orthotics

Sterling, Amanda Jo (2022-07-25) ETD File Embargoed

The goal of this research is to leverage local equine keratin material properties and their correlation to hoof tubule density (TD), hydration state (biological and environmental), temperature (biological and environmental), ...

Effects of Aging on the Cyclic Stress Strain and Fatigue Behaviors of Lead-free Solders

Mustafa, Muhannad (2014-08-18)

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the ...

Effects of Grain Size and Orientation on Mechanical Response of Lead Free Solders

Zou, Jing (2013-11-25)

In this study, the effects of grain size and orientation on mechanical behaviors of lead free solders were evaluated by measuring the sub-grain size and determining the plane orientation of the grains. Sn-Ag-Cu (SAC) solder ...

Failure Mode Classification for Prognostics and Health Monitoring of Electronic-Systems under Mechanical Shock

Gupta, Prashant (2012-01-30)

Electronics have become an integral part of most systems and subsystems used in various fields such as avionics, defense, space exploration, manufacturing, household appliances, health care (implantable biological devices ...

Improved Modeling and Analysis Strategies for Plastic Ball Grid Array Package Assemblies Subjected to Thermal Cycling

Chen, Chienchih (2018-12-06)

Solder joint fatigue is one of the primary reliability issues in the electronic packaging area. Solder joints typically experience cyclic loading, yielding, and highly nonlinear material behavior when subjected to temperature ...

Material Characterization of Leadfree SAC Solder Alloys at High Strain Rates with Finite Element Analysis

Shantaram, Sandeep (2013-07-25)

The electronics may experience high strain rates under single, sequential and simultaneous exposure to thermo-mechanical and transient dynamics loads at various stages of their life-cycle i.e. manufacturing, transportation, ...

MICRO AND MESO SCALE ANALYSIS OF LEAD-FREE SOLDER JOINTS

Mondal, Debabrata (2024-04-30) ETD File Embargoed

With the growth of electronic packaging industries, ranging from automobiles to hand-held products, reliability is a major concern. Also, to keep pace with the increasing demand of end users for integration, miniaturization, ...

Modeling and Experimental Behavior Studies on Tin Whiskers

Wang, Zekun (2021-12-06)

The spontaneous growth of tin whiskers can occur under room temperature conditions. However, under more extreme external conditions (e.g., high temperature, high humidity, or thermal cycling), the rate of such growth tends ...

Study of Friction and Wear Behavior Based on Different Lubricants and Materials

K C, Sanjeev (2021-12-02)

Tribology is the study of friction, wear, and lubrication between the contacting bodies and requires a deeper understanding of multiple disciplines. This study was mainly focused on two main areas: the tribological study ...

Three-Dimensional Modeling of Elasto-Plastic Sinusoidal Contact under Time Dependent Deformation Including Both Stress Relaxation and Creep Analysis

Rostami, Amir (2013-07-11)

Computational modeling of contact between rough surfaces has attracted a great deal of attention due to the developing technological needs of industry. Most of the early models of rough surface contacts assumed a cylindrical ...