Browsing by Author "Suhling , Jeffrey C"

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Measurement and Modeling of Damage in Mechanically Cycled Lead Free Solders

Haq, Mohammad Ashraful (2022-06-29) ETD File Embargoed

Solder joints in electronic packages often experience fatigue failures due to cyclic mechanical stresses and strains in fluctuating temperature environments. This cyclic loading of the solder is induced by mismatches in ...