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The Effects of Aging on the Reliability of Lead Free Fine-Pitch Electronics Packaging
Zhang, Jiawei (2012-06-26)
A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105), Sn-3.0Ag-0.5Cu (SAC305), ...