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Development of Test Methods for Evaluation of Bending Stiffness and Compressive Modulus of Braided Composite Lattice Structures
(2015-01-14)
Open Architecture Composite Structures (O-ACS) have been recently developed and are known for their high modulus per unit weight. They are truss structures preformed on a mandrel shaped as a cylindrical, elliptical or ...
High Strain Rate Elastic and Fracture Characterization of Isotropic and Orthotropic Materials with and without Nano Fillers
(2015-07-22)
A long-bar apparatus for subjecting relatively small samples to mode-I stress-wave loading has been devised for failure characterization. A methodology based on digital image correlation (DIC) used in conjunction with ...
Extension of a Reflection-Mode Digital Gradient Sensor (r-DGS) to Study Impact Induced Deformations, Damage, and Fracture
(2015-02-23)
Reflective structures such as space mirrors, silicon wafers, solar reflectors, microelectronic devices to name a few, are made of stiff and brittle materials. They often suffer deformations and catastrophic failure when ...
Chaotic Dynamic Character of Human Chewing Determined Using New Three-Dimensional Motion Capture Techniques
(2015-05-05)
A need exists to determine the dynamic character of natural human chewing so human mandible or lower jaw biomechanics can be fully understood. No one has reported investigating the dynamic character of natural human chewing ...
The Effects of Mechanical Stress on Semiconductor Devices
(2015-04-24)
Mechanical strains and stresses are developed during the fabrication, assembly and packaging of the integrated circuit (IC) chips. Sources include processes such as shallow trench isolation, wafer backgrinding and dicing, ...
Interfacial Thermal Resistance Measurements of Solution Deposited CNT Films on Copper Substrates
(2015-07-28)
Carbon nanotubes (CNTs) have been regarded as one of the most promising materials for electronics applications during the past two decades according to their outstanding electrical properties. However, the fabrication ...
Experimental analysis of the wear of rubber against harder materials in reciprocating motion
(2015-07-21)
This work investigated the wear performance of rubber when contacted against harder composite materials through experimental analysis. The focus of this thesis was to find the optimal type of rubber and the composite ...
Constitutive Model and Solder Joint Reliability Predictionsfor BGA Packages Subjected to Aging
(2015-07-28)
Isothermal aging causes detrimental changes in the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies. Traditional finite element based predictions for solder ...
Viscoelastic Modeling of Microelectronic Packaging Polymers Including Moisture Effects
(2015-05-05)
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. ...
Symbolic Computation of Quantities Associated with Time-Periodic Dynamical Systems
(2015-05-07)
Many dynamical systems can be modeled by a set of linear/nonlinear ordinary differential equations with periodic time-varying coefficients. The state transition matrix S(t,a) associated with the linear part of the equation ...