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Now showing items 11-17 of 17
Simplification and Order Reduction of Parametrically Excited Nonlinear Dynamical Systems
(2010-08-11)
System simplification is, by far, the most common theme behind various techniques available for the analysis and controller design of nonlinear dynamic systems. One such technique that is widely used by engineers is the ...
Interrogation of System State of Lead-Free Electronics Subjected to Mixed Sequential Steady-State and Cyclic Thermal Environments
(2010-11-04)
Electronic assemblies deployed in harsh field environments may be exposed to single and multiple thermal environments during their service life. In real world setting it is often required to know during the service life ...
The Effects of Isothermal Aging on the Mechanical Behavior of Underfill Encapsulants
(2010-08-04)
Underfill encapsulants are widely used in the microelectronics industry to improve the reliability of electronic components assembled to printed circuit boards. In this work, the effects of isothermal aging on the ...
Comparative Characterization of Electronic Packaging Materials through Steady State Thermal Conductivity Measurements
(2010-07-30)
The decreasing feature size and increasing power generation of modern
electronic devices have created a need for increasingly effective and
efficient thermal management solutions to remove the high heat fluxes
being ...
The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys
(2010-08-05)
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In this work, ...
A Split Hopkinson Pressure Bar Apparatus for High Strain Rate Testing of Interpenetrating Phase Composites (IPC): Measurements and Modeling
(2010-04-08)
Novel materials with enhanced mechanical performance and multifunctionality are of interest to automotive, aerospace and marine industries alike. Designing materials with multiple thermo-mechanical attributes while satisfying ...
Thermal Cycling Reliability of Nickel added Solder Paste for use in Surface Mount Manufacturing
(2010-11-03)
With the ban on lead (Pb) by the European Union (EU), the electronics industry has sought alternatives to replace the long used Sn-Pb solder. Although Sn-Ag-Cu (SAC) alloys with Sn3Ag0.5Cu (SAC 305) have been considered ...