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Now showing items 31-40 of 91
Characterization of Die Stresses in Large Area Array Flip Chip Packages
(2008-09-09)
Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic chip carrier. The final assembly configuration features a complex ...
Wear Simulation of Electrical Contacts Subjected to Vibrations
(2008-09-09)
Electrical contacts may be subjected to wear because of shock, vibration, and thermo-mechanical stresses resulting in fretting, increase in contact resistance, and eventual failure over the lifetime of the product. Previously, ...
GPS/INS Operation in Shadowed Environments
(2008-09-09)
This thesis presents the analysis techniques developed for monitoring GPS signals in harsh shadowed environments such as heavy foliage. It also details a method selected for improved performance by combining raw GPS ...
Impacts of Kinematic Links with a Granular Material
(2009-06-26)
The impact of kinematic links into a granular material is studied. In the impact process through the granular material defined as a conglomeration of discrete solids, the most important force governing the motion of a body ...
Investigation into the Effects of Tool Geometry and Metal Working Fluids on Tool Forces and Tool Surfaces During Orthogonal Tube Turning of Aluminum 6061 Alloy
(2009-11-20)
Orthogonal Metal Cutting has evolved as a significant way of analyzing the mechanics involved in the art of metal cutting. An orthogonal tube turning apparatus was constructed and validated. The instrument was used to ...
Modeling and Analysis of PZT Micropower Generator
(2009-02-23)
The goal of this research is to theoretically and experimentally investigate behaviors of a power harvesting system that was constructed with a bimorph cantilever made of Lead Zirconate Titanate (Pb[ZrxTi1-x]O3) and a ...
Compression Response and Modeling of Interpenetrating Phase Composites and Foam-Filled Honeycombs
(2009-08-03)
Although multiphase materials with discrete, dispersed and/or embedded phases in a matrix have been evolving over the years, there are limitations in terms of the degree of concentration of the secondary phase that can be ...
Principal Component Regression Models for Thermo-Mechanical Reliability of Plastic Ball Grid Arrays on Cu-Core and No Cu-Core PCB Assemblies in Harsh Environments
(2009-05-21)
In the current work, Goldmann constants and Norris-Landzberg acceleration factors have been developed for eutectic Tin Lead and Lead free solders (SAC 305) with the help of statistical tools including Principal Component ...
Alternate In-Situ Environmental Testing System by Matrix Design
(2009-03-30)
Compared with the existing in-situ environmental testing system, this alternative one got significant improvement on measuring capacity, total cost, as well as number of connections that must be made between the hardware ...
Surface Separation and Contact Resistance Considering Sinusoidal Elastic-Plastic Multiscale Rough Surface Contact
(2009-02-23)
This thesis considers the multiscale nature of surface roughness in a new model that predicts the real area of contact and surface separation as functions of load. This work is based upon a previous rough surface multiscale ...