This Is AuburnElectronic Theses and Dissertations

Browsing Auburn Theses and Dissertations by Author "Johnson, R. Wayne"

Now showing items 21-22 of 22

Thermal Performance of Ball Grid Arrays and Thin Interface Materials 

El-Kady, Yasser (2005-08-15)
Current electronic packages exhibit very high and ever increasing power densities. That trend mandates the need for enhanced thermal performance. This study introduces a state of the art apparatus to measure thermal ...

Thick Film Packaging Techniques for 300°C Operation 

Zhang, Rui (2011-08-11)
Geothermal well logging and instrumentation applications require electronics capable of 300°C operation. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. ...