This Is AuburnElectronic Theses and Dissertations

Browsing Auburn Theses and Dissertations by Author "Tippur, Hareesh"

Now showing items 21-32 of 32

Quasi-Static and Dynamic Crack Initiation and Growth in Soda-lime Glass: Full-field Optical Investigations 

Dondeti, Sivareddy (2022-11-17)
Soda-lime glass (SLG) is a widely used structural material with numerous advantages in terms of thermal, physical, and mechanical properties besides sustainability and recyclability. It is widely used for structural ...

Role of Print Architecture on Fracture Behavior of Additively Manufactured ABS: Opto-Mechanical Investigations 

Isaac, John Ponniah (2023-03-30)
Acrylonitrile Butadiene Styrene or ABS is a popular and inexpensive isotropic, amorphous thermoplastic widely used for Additive Manufacturing (AM) of engineering parts. An AM process called Fused Filament Fabrication ...

A Split Hopkinson Pressure Bar Apparatus for High Strain Rate Testing of Interpenetrating Phase Composites (IPC): Measurements and Modeling 

Periasamy, Chandru (2010-04-08)
Novel materials with enhanced mechanical performance and multifunctionality are of interest to automotive, aerospace and marine industries alike. Designing materials with multiple thermo-mechanical attributes while satisfying ...

Static, Dynamic and Acoustical Properties of Sandwich Composite Materials 

Yu, Zhaohui (2007-05-15)
Sandwich composite materials have been widely used in recent years for the construction of spacecraft, aircraft, and ships, mainly because of their high stiffness-to-weight ratios and the introduction of a viscoelastic ...

‘Structure - Processing - Property’ Relationships of Cellulose Nanocrystals for Optical and Sensing Applications 

Amit, Sadat Kamal (2024-05-01)  ETD File Embargoed
This research enhanced scientific understanding of the structure-processing-property relationships that govern the assembly of sulfated cellulose nanocrystals (CNCs) into films for photonic and sensing applications. CNCs ...

A Study of Crack-Inclusion Interaction Using Moiré Interferometry and Finite Element Analysis 

Savalia, Piyush-Chunilal (2006-12-15)
Failure of composite materials is intrinsically linked to the fundamental problem of a matrix crack interacting with a second phase inclusion. In this work, the critical issue of matrix-inclusion debonding in the presence ...

A study of mixed-mode dynamic fracture in advanced particulate composites by optical interferometry, digital image correlation and finite element methods 

Kirugulige, Madhusudhana (2007-08-15)
Understanding the fracture mechanics of materials under stress wave loading is essential for impact resistant design of structures. In this context, mixed-mode dynamic fracture behavior of two-phase composites - a ...

Study of the Effect of Mechanical Cycling on the Constitutive Behavior of Lead-Free Solders 

Hoque, Mohd Aminul (2021-08-05)  ETD File Embargoed
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life ...

Synthesis, Processing and Dynamic Fracture Behavior of Particulate Epoxy Composites with Conventional and Hierarchical Micro-/Nano-fillers 

Kushvaha, Vinod (2016-12-09)
Polymer-based particulate composites have a wide range of engineering applications due to their mechanical, chemical, dielectric, and lightweight characteristics as well as simplicity of processing. The mechanical performance ...

Theoretical and Experimental Analysis of Strain in a Tire Under Static Loading and Steady-State Free-Rolling Conditions 

Krithivasan, Vijaykumar (2011-04-11)
This main objective of this work is to predict the operating conditions or the state of a tire based on a wireless sensor suit. First a three dimensional finite element model of a standard reference test tire (SRTT) was ...

Viscoelastic Modeling of Microelectronic Packaging Polymers Including Moisture Effects 

Chhanda, Nusrat (2015-05-05)
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. ...

Why do Growing Cracks Branch? An Optical Investigation of Brittle Monolithic and Bilayer Transparencies Under Stress Wave Loading 

Meenakshi Sundaram, Balamurugan (2017-02-28)
Understanding the fracture mechanics of materials due to stress wave (or impact) loading under combined tensile and shear (mixed-mode) conditions is important for two opposing reasons: (a) for creating impact resistant ...