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Browsing Auburn Theses and Dissertations by Author "Lall, Pradeep"
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Reliability of Electronic Assemblies and Additively Printed Strain Sensors for Health Monitoring
Taylor, Devin (2023-07-31)
This thesis has been redacted.
Reliability of Lead-Free and Advanced Interconnects in Fine Pitch and High I/O Electronics Subjected to Harsh Thermo-Mechanical Environments
Hinshaw, Robert, III (2009-09-11)
Industry is moving towards lower cost, increased functionality, and miniaturized electronics placed in ever closer proximity of higher operating temperatures, typical of harsh environments. In this thesis, three aspects ...
Ridge Regression based Development of Acceleration Factors and closed form Life prediction models for Lead-free Packaging
Arunachalam, Dinesh Kumar (2011-07-25)
The thermo-mechanical mismatch caused by the difference in the coefficient of thermal expansion between the electronic part and the printed circuit board results in shear strains in the solder interconnects during thermal ...
The Scrum Process for Independent Programmers
Srirangarajan, Ananth (2009-03-27)
A software process is an attempt to impose structure on the software development process. The primary goal of a software process is to arrive at a repeatable, predictable process that will raise the productivity of software ...
Solder Joint Reliability & Prognostication of Lead Free Electronics in Harsh Thermo-Mechanical Environments
Bhat, Chandan (2008-08-15)
The trends in the electronic packaging industry are to design smaller packages that have higher complexity, and to improve package reliability while reducing costs. These needs in the packaging industry have lead to a newer ...
Solder Joint Reliability Based Prognostic Health Management (PHM) Models for Life Prediction of Electronics Subjected to Harsh Thermo-mechanical Environments
Harsha, Mahendra (2013-12-04)
Field deployed electronics may accrue damage due to environmental exposure and usage after finite period of service but may not often have any macro-indicators of failure such as cracks or delamination. In real world setting ...
Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Sub-Modeling
Gupte, Sameepulhas (2007-05-15)
Solder joint failure in electronic devices subject to shock and drop environment is one of the key concerns for the telecommunications industry. The recent trend towards miniaturization and increased functional density has ...
Statistical Model for Prediction of Life-Reduction in SAC Lead-free Interconnects during Long-Term High Temperature Storage using Principal Component Regression and Ridge Regression
Duraisamy, Sree Mitun (2016-05-18)
Electronics in military and defense applications may be stored for prolonged period of time prior to deployment in mission critical applications. In addition, electronics in automotive applications may be used underhood, ...
Terminal Ballistics of Composite Panels and Verification of Finite Element Analysis
Grupp, Jonathan (2011-07-29)
Composite materials are becoming more prevalent in a wider range of applications due to the inherent advantages afforded by their strength to weight ratio over more traditional engineering materials such as metals. As such, ...
Test Methods and Reliability Modeling of Electronic Assemblies under High-G Shock
Dornala, Venkata Kalyan Reddy (2019-10-28) ETD File Embargoed
Electronic systems and sub-assemblies undergo a myriad of stresses during operation in their lifetime. Electronics in consumer, aerospace and defense industries increasingly use commercial-off-the-shelf components in their ...
Thermo-mechanical Reliability Models for Life Prediction of Area Array Electronics in Extreme Environments
Singh, Naveen (2006-05-15)
The increasing functionality in modern microelectronics requires more complexity in less space and more reliability at lower cost. Demands on miniaturization have lead to the evolution of several types of area array packages ...
Thermo-mechanical reliability models for life prediction of ball grid arrays on Cu-core PCBS in extreme environments
Drake, Jonathan (2007-08-15)
In this work, thermo-mechanical models for reliability prediction of BGA packages mounted on Cu-core printed circuit assemblies in harsh environments have been developed. The models have been developed based on thermo-mechanical ...
Utilizing Dual Neural Networks as a Tool for Training, Optimization, and Architecture Conversion
Hunter, David Shawn (2013-04-23)
Very little time has been devoted to the application of Dual Neural Networks and advances that they might produce by utilizing them for conversion between network architectures. By leveraging the efficiencies of the various ...
Vibration Analysis Of Test Chips With Integrated Piezoresistive Stress Sensors
Gore, Kapil (2006-08-15)
Vibration analysis of the WB200 test chip containing an array of optimized piezoresistive stress sensor rosettes has been performed. The test chip was attached to the printed circuit board with an underfill encapsulant ...
Viscoelastic Modeling of Microelectronic Packaging Polymers Including Moisture Effects
Chhanda, Nusrat (2015-05-05)
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. ...
Wear Simulation of Electrical Contacts Subjected to Vibrations
Shinde, Darshan (2008-08-15)
Electrical contacts may be subjected to wear because of shock, vibration, and thermo-mechanical stresses resulting in fretting, increase in contact resistance, and eventual failure over the lifetime of the product. Previously, ...