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Browsing Auburn Theses and Dissertations by Author "Jian, Minghong"

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Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Stress Amplitudes 

Jian, Minghong (2021-04-23)  ETD File Embargoed
The eutectic Sn-Pb solder alloys are widely used in the electronic packaging industry. However, they are being replaced by new near-eutectic solder alloys because of environment and health concerns associated with lead. ...