Browsing Auburn Theses and Dissertations by Author "John Akkara, Francy"

Now showing items 1-2 of 2

Characterization of Thermally Induced Stress in IC Packages using Piezoresistive Sensors

John Akkara, Francy (2015-05-05)

This thesis presents the characterization of thermally induced stress in IC packages using CMOS sensor circuits. In various applications, the IC packages are exposed to extreme environments. The knowledge of the thermally ...

Thermal Cycling Reliability of Doped SnAgCu Solder Alloys after Long-Term Aging

John Akkara, Francy (2021-04-21)

Eutectic SnPb (Tin-Lead) solder has been used in electronics since early days. This universal alloy combination was used in all soldering applications because it had good mechanical and electrical properties and hence ...