Browsing Auburn Theses and Dissertations by Author "Johnson, R. Wayne"

Now showing items 1-20 of 22

Characterization of Lead-free Solders for Electronic Packaging

Ma, Hongtao (2007-05-15)

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and ...

Conductor and Dielectric Property Extraction Using Microstrip Tee Resonators

Fulford, Andrew (2005-08-15)

The growth and resultant competitive nature of the wireless industry has prompted the need for high frequency electronics to be provided at a low cost. An efficient method of component characterization is necessary to ...

Considerations and Options for High Temperature Die Attach

Henson, Phillip (2010-07-27)

Development of electronics that can withstand temperatures ranging from 200oC up to 600oC is a growing research area. More electronic aircraft, space exploration and in engine automotive electronics are some examples of ...

Die Attach for High Temperature Applications

Shen, Zhenzhen (2014-12-17)

The energy sector is seeing dynamic growth with advanced oil and gas recovery methods being deployed. Measure-while-drilling (MWD) and downhole production instrumentation is important to maximize production and safety. ...

Evaluation of thick film materials for high temperature electronics packaging

Zhou, Zhangming (2017-04-30)

Geothermal well logging requires electronics and packaging working reliably at 300C. Thick film technology has many advantages and has been widely investigated for high temperature applications. Previous studies showed ...

Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders

Sanders, Thomas (2016-05-11)

The semiconductor and packaging industries have been moving away from the use of Lead (Pb) due to the increasing awareness of the health and safety concerns surrounding its use. For many applications, the industry has moved ...

Fabrication and Assembly of Ultra Thin Flexible Active Printed Circuits

Zhang, Tan (2006-05-15)

Tremendous attention has been focused on flexible printed circuits for their light weight, minimized dimension and three dimensional packaging capabilities. However, the traditional flexible circuit fabrication and assembly ...

Flip Chip and Heat Spreader Attachment Development

Li , Yuquan (2009-04-09)

Flip chip packages offer many advantages over traditional wire bonding based packages. Flip chip packages have high input/output (I/O) handling capability, better electrical performance and smaller size. Proper package ...

Flip Chip and Lid Attachment Assembly Process Development

Ding, Fei (2006-12-15)

Flip chip technology offers numerous advantages over conventional packages by virtue of its electrical performance, greater input/output (I/O) flexibility and small size. This study focuses on two flip chip assembly process ...

High Temperature Electronics Packaging Processes and Materials Development

Zheng, Ping (2010-08-16)

Silicon carbide device technology is being developed for power electronics applications for use at high temperatures. In recent studies, SiC based electronics and sensors have also been demonstrated for extended operation ...

High Temperature High Power SiC Devices Packaging Processes and Materials Development

Wang, Cai (2006-08-15)

Silicon power devices have reached their theoretical limits in terms of higher temperature and higher power operation by virtue of the physical properties of the material. SiC has been identified as a material with the ...

Integration of Thin Flip Chip in Liquid Crystal Polymer Based Flex

Hou, Zhenwei (2006-05-15)

Thin embedded active assemblies have been developed that combine a lower profile and high functional density (per volume) with a flexible appearance, meeting the demands for the miniaturization of electronic products. The ...

Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components

Liu, Yueli (2006-05-15)

Chip Scale Packages (CSPs) are widely used in portable and hand-held electronic devices due to their small size and availability. Consumers expect portable products to survive being dropped repeatedly, and drop testing is ...

Materials for High Temperature Electronic Packaging

Cui, Jinzi (2016-12-12)

Normally, the operating temperature of consumer electronic devices is from 0oC to 70oC. However, some industries are interested in electronics that can operate in extreme environments. The working environment temperature ...

Mechanical Properties and Microstructure Investigation of Sn-Ag-Cu Lead Free Solder for Electronic Package Applications

Wang, Qing (2005-08-15)

While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, the exact Composition varies by geographic region, supplier and user. Add to that dissolved copper ...

Packaging of Silicon Carbide High Temperature, High Power Devices - Processes and Materials

Liu, Yi (2006-05-15)

Silicon carbide (SiC) has unique electrical, thermal and physical properties compared to the Si and GaAs conventionally used in microelectronics as it can operate in the temperature range from 350ºC to 500ºC. However, there ...

Process Development of Double Bump Flip Chip with Enhanced Reliability and Finite Element Analysis

Yan, Wei (2005-08-15)

Flip chip technology has drawn tremendous attention in electronic packaging in recent years due to the advantages it offers, such as better electrical performance, high I/O density and smaller size. However, as package ...

A Study of Vibration-Induced Fretting Corrosion for Electrical Connectors

Xie, Fei (2007-05-15)

Vibration induced fretting degradation is a widely recognized failure phenomenon. However, the basic mechanisms that control the onset and progression of such fretting behavior are not well understood and are a topic of ...

A Technique for the Measurement of Relative Velocity between Parallel Plate Electrodes in Micromachined Structures

Dean, Robert (2006-05-15)

Numerous applications exist for microstructures that contain two parallel oriented electrodes that experience relative motion. It is often desirable to measure the relative velocity between the two electrodes and then ...

Thermal Cycling Reliability of Nickel added Solder Paste for use in Surface Mount Manufacturing

Nelaturi, Anil (2010-11-03)

With the ban on lead (Pb) by the European Union (EU), the electronics industry has sought alternatives to replace the long used Sn-Pb solder. Although Sn-Ag-Cu (SAC) alloys with Sn3Ag0.5Cu (SAC 305) have been considered ...