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Browsing Auburn Theses and Dissertations by Author "Rahim, Md. Sayed Kaysar"
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Die Stress Characterization and Interface Delamination Study in Flip Chip on Laminate Assemblies
Rahim, Md. Sayed Kaysar (2005-08-15)
Thermo-mechanical reliability of flip chip on laminate packaging is a major concern when the assemblies are exposed to harsh operating environments such as space or automotive underhood applications. In this study, ...