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Now showing items 7246-7265 of 9115
Reliability and Modeling of 32nm SOI Transistors at Cryogenic Temperatures
(2016-05-26)
With conventional transistor scaling rules and performance trends coming to an end,
new methods are being explored to continue the advancements of electronic devices. One
such method is to operate the devices in cryogenic ...
Reliability and Prognostics of Copper-Aluminum Wirebond System Subjected to Extreme Ambient and Operating Conditions
(2018-07-26)
Wire bonding is predominant first level interconnect used in semiconductor packaging industry. Gold (Au) is traditionally used for wirebonding since inception. Recent increase in the cost of Au has forced industry to seek ...
Reliability and Validity of the SE-HEPA: Examining Physical Activity and Healthy Eating-Specific Self-Efficacy among a Sample of African-American Pre-Adolescents
(2013-10-11)
Current estimates indicate that nearly one-third of all U.S. children can be classified as either overweight or obese and is even more prominent in African American children, affecting approximately 39%. In attempts to ...
Reliability Assessment of Electronics Under Drop-Impact Using Cohesive Zone and XFEM Models
(2011-05-05)
The evolution of complexity in the handheld portable electronics accompanied with the miniaturization due to advancement in technology has contributed to their vulnerability under shock and drop conditions. Drop reliability ...
Reliability Modeling of Microelectronic Interconnections in Long-term Applications
(2019-10-17)
Solder alloy materials are used to form mechanical and electrical connections between printed circuit boards and electronic components. Enhancing the reliability of electronic assemblies is mostly dependent on the reliability ...
Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling
(2016-05-06)
A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ...
Reliability of Doped SnAgCu Solder Alloys with Various Surface Finishes Under Realistic Service Conditions
(2019-04-24)
The electronic packaging industry has moved from eutectic Sn-Pb solder materials to near-eutectic SnAgCu (SAC) solder materials in the past decade because of the increasing awareness of health and safety concerns associated ...
Reliability of Electronic Assemblies and Additively Printed Strain Sensors for Health Monitoring
(2023-07-31)
This thesis has been redacted.
Reliability of Lead-Free and Advanced Interconnects in Fine Pitch and High I/O Electronics Subjected to Harsh Thermo-Mechanical Environments
(2009-09-11)
Industry is moving towards lower cost, increased functionality, and miniaturized electronics placed in ever closer proximity of higher operating temperatures, typical of harsh environments. In this thesis, three aspects ...
Reliability of Lead-Free Electronic Package Interconnections under Harsh Environment
(2014-07-24)
Lead-free solder alloy has evolved and applied in industries for many years. The reliability is of concern for lead-free solder joints of assembled circuitry, especially those exposed to high temperature in a long period ...
Reliability of Shear-Critical Reinforced Concrete Members
(2020-05-13)
Recent research on one-way shear strength and strut-and-tie design approach has led to updates in the ACI 318 Building code requirements for structural concrete. The changes in one-way shear design provisions in ACI 318-19 ...
Reliability of Solder Attachment Options with Lead Free for 0.4 mm Micro BGA Packages
(2011-05-16)
Electronic Modules have become an integral part in Automobiles. User friendly applications in Automobiles require high reliable electronic components to perform in harsh temperature ranges of -40 C to 165 C. Micro-electronic ...
The Reliability of Zinc Oxide Based Thin Film Transistors Under Extreme Conditions
(2018-04-23)
In this Ph.D. dissertation, I report the device instability of ZnO thin film transistors (TFTs) under extreme environmental conditions. It is extremely important to identify the cause of device instability under different ...
Reliability, Scalability and Security in Smart Utility Networks
(2014-05-01)
With the rapid increase in deployment of smart meters across North America, resource
consumption data of utilities such as water, gas and electricity is being collected at a much higher
granular level. The huge amount ...
Reliability-Based Calibration of the Code for Steel Girder Bridges
(2019-02-12)
Accurate evaluation and design of bridge structures can maximize the performance-to-cost ratio, which is one of the most critical aspects in infrastructure maintenance and expansion. The author of this dissertation presents ...
Reliability/Availability of Manufacturing cells and Transfer Lines
(2011-05-04)
One of the major wastes in a manufacturing system is downtime caused by machine breakdown/failure and the time and cost incurred to repair the failed machine. Machine breakdown leads to stoppage of production in manufacturing ...
The Remarriage Belief Inventory: Testing the Factorial Structure and Validity with a Remarried Sample
(2005-08-15)
Recent figures have indicated that approximately half of all marriages each year are remarriages for one or both partners and that the majority of these remarriages form stepfamilies. Despite the prevalence of remarriages ...
Remediation in Urban Ecology: How Remediative Park Design in Montgomery, AL can influence its Future Development
(2013-03-18)
This design research project explores the possibility of connection between the riverfront and the downtown of Montgomery, Alabama by means of a remediative park system that encourages movement through the city. Currently ...
A Remote Magnetoelastic Sensor with Antibody as a Probe to Detect Salmonella Typhimurium
(2007-05-15)
Every year millions of people around the globe suffer from foodborne illnesses as a result of the ingestion of food products contaminated with pathogens. Foodborne illnesses not only result in suffering and permanent ...
Remote Sensing of Shallow-Marine Impact Craters on Mars
(2007-12-15)
Impact craters are common on solid planetary bodies in our solar system and are one of the most important physical features from which the surface history of these planetary bodies can be deduced. Remote sensing is a ...