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Browsing Auburn Theses and Dissertations by Author "Johnson, Wayne"
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Ag Sintering Die and Passive Components Attach for High Temperature Applications
Yu, Fang (2016-05-09)
With an increasing demand for SiC and GaN high power devices and high temperature electronics operating in extreme environments, traditional solder materials are reaching their limitations in performance. Compatible, high ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale Package
Shu, Huihua (2011-12-05)
Wafer level chip scale package (WLCSP) have been used in many consumer products, and thus they are competitive in cost, size, yield, and technology. For advanced WLCSP, solder joint reliability is a major concern. ...